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    Electronic technology

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    Electronic components
First Hi-tec Enterprise Co., Ltd.

First Hi-tec Enterprise Co., Ltd.

TTPEX:5439
219.50
TWD
-5.00
(-2.23%)
17.57EPS
17.17P/E
28.87BMarket Cap
Nov 05Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
20
23.05
23.19
25.08
24.5
26.36
25.18
28.64
38.19
34.68
46.79
44.93
103.72
123.91
Basic EPS, GAAP
1.26
1.99
1.59
2.52
2.29
3.36
2.54
3.39
4.61
3.98
5.07
3.51
13.74
18.08
Free Cash Flow per Basic Share
0.93
0.39
2.94
2.02
-0.75
3.01
2.42
2.64
-4.99
5.41
2.67
-1.68
-10.75
5.93
Dividend per Share
1.47
1.47
1.57
1.48
1.84
1.97
2.76
2.27
2.43
3.6
3.3
4.1
2.2
- -
Book Value per Share
14.95
15.43
15.34
16.24
17.82
19.27
18.96
20.17
25.08
25.42
26.95
26.26
42.44
43.4
Tangible Book Value per Share
14.95
15.43
15.34
16.24
17.82
19.27
18.96
20.17
25.08
25.42
26.95
26.26
42.44
43.4
Basic Weighted Avg Shares
80
80
80
79
85
87
87
87
88
93
93
93
93
93
Sales/Revenue/Turnover
1,593
1,836
1,847
1,980
2,074
2,295
2,192
2,494
3,372
3,225
4,350
4,178
9,644
11,522
Operating Margin (%)
6.92
9.07
8.28
11.61
11.91
14.19
12.98
15.57
14.93
11.77
13.66
9.7
16.84
17.1
Depreciation Expense
111
107
107
106
102
106
115
119
140
177
174
196
285
359
Net Income, GAAP
100
159
126
199
194
293
221
295
407
370
471
327
1,277
1,681
Effective Tax Rate (%)
17.13
20.09
19.02
17.01
17.83
19.24
21.72
19.74
19.78
18.34
19.67
19.07
19.01
18.73
Profit Margin (%)
6.3
8.65
6.83
10.04
9.35
12.76
10.1
11.83
12.07
11.48
10.83
7.82
13.25
14.59
Working Capital
495
529
593
668
724
830
779
843
1,072
1,147
1,250
961
3,572
3,689
LT Debt
29
23
45
36
27
20
41
34
180
165
156
300
2,611
3,072
Total Equity
1,191
1,229
1,222
1,294
1,552
1,678
1,651
1,756
2,332
2,363
2,505
2,441
3,946
4,035
Return on Invested Capital (%)
7.19
10.26
9.31
14.24
13.27
15.23
12.72
17.14
17.39
11.29
16.36
10.08
23.73
24.8
Return on Capital (%)
8.02
12.43
9.73
15.23
12.98
17.44
12.98
16.56
18.09
13.9
16.67
10.49
24.52
27.63
Return on Common Equity (%)
8.38
13.12
10.3
15.81
13.62
18.13
13.3
17.31
19.91
15.77
19.36
13.21
40
50.76

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
789
689
519
LT Borrowings
2,487
2,478
2,890
LT Finance Leases
124
122
182
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
93
93
93
Market Capitalization
29,473
24,918
28,869

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
7,821
7,805
8,993
Cash, Cash Equivalents & STI
2,141
2,331
2,498
Accounts Receivable, Net
4,352
3,813
4,627
Inventories
1,278
1,545
1,761
Total Current Liabilities
4,249
4,202
5,304
Payables & Accruals
- -
- -
- -
ST Debt
789
689
519
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
13.79%
19.85%
61.63%
Free Cash Flow
-87.31%
-35.84%
540.08%
Net Income, GAAP
43.14%
63.3%
290.92%
Sales/Revenue/Turnover
22.45%
38.53%
130.83%
Total Cash Common Dividend
9.35%
6.8%
-46.34%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
924
1,002
1,057
1,194
4,178
2025
1,424
2,288
3,161
2,770
9,644
2026
2,538
3,053
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.08
0.97
0.45
1.02
3.51
2025
1.94
1.87
5.71
4.22
13.74
2026
3.51
4.64
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
4.1
2025
- -
- -
- -
- -
2.2
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Tai Hui Li
Full Time Employees
717
Sector
Electronic technology
Industry
Electronic components
Address
No. 3, Xingbang Road Taoyuan TYC Taiwan 33068
IPO Date
Jun 26, 2000
Website
fht.com.tw
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Business
First Hi-tec Enterprise Co., Ltd. manufactures and sells printed circuit boards in Taiwan and other parts of Asia. The company offers single-sided and double-sided rigid PCBs; multilayer rigid PCBs; high-density interconnect PCBs with stacked through vias, blind vias, and buried vias; metal core PCBs; heavy copper boards; rigid-flex boards; high-layer count PCBs with high aspect ratios up to 42 layers; high-frequency and microwave radar boards; and embedded resistor boards, which serve telecommunications equipment including 5G applications and switch boards at 100G/400G/800G speeds; AI server boards; industrial computers and peripherals; network security and acceleration cards; gaming products; surveillance systems; medical devices; power supplies; automotive electronics such as electric scooter charging modules, in-vehicle intelligent systems, power control modules, and advanced driver-assistance systems; semiconductor equipment and test boards; low-earth orbit satellite systems; electric vehicles; and industrial automation and instrumentation. Founded in 1988 and headquartered in Taoyuan City, Taiwan, at No. 3, Lane 43, Xingbang Road, Taoyuan District, the company primarily targets electronics manufacturers in these sectors with rapid prototyping, flexible mid-to-low volume production, and advanced technologies like high-speed signal integrity, low-roughness brown oxide treatment, high-frequency materials, and patented processes, while maintaining IPC-standard compliance, rigorous quality assurance, and operations focused on Taiwan with global customer reach. In recent years, First Hi-tec has expanded its high-value capabilities through ongoing R&D investments in multilayer and HDI technologies for emerging applications like AI servers and LEO satellites; secured new long-term financing arrangements as noted in its 2024 consolidated financials; and enhanced manufacturing efficiency via implementation of manufacturing execution systems and knowledge management solutions.