M31 Technology Corp.

M31 Technology Corp.

TTPEX:6643
435.00
TWD
-21.00
(-4.61%)
0.15EPS
3,122.57P/E
20.03BMarket Cap
Oct 29Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
- -
6.82
9.17
16.03
16.77
20.2
21.12
23.85
24.64
33.05
38.92
35.56
42.66
42.33
Basic EPS, GAAP
- -
0.55
0.79
4.81
4.93
7.4
7.5
7.83
6.15
9.22
10.5
3.05
1.69
0.15
Free Cash Flow per Basic Share
- -
2.3
0.71
5.63
1.23
6.03
7.72
8.12
-7.6
14.87
4.78
-1.12
-1.03
-2.55
Dividend per Share
- -
- -
- -
- -
2.27
3.41
5.33
5.71
6.06
4.81
6.12
6.69
2
- -
Book Value per Share
6.26
6.83
7.66
12.68
15.34
19.71
34.87
36.75
38.21
44.67
49.31
45.91
45.48
44.61
Tangible Book Value per Share
5.63
6.4
7.42
12.63
15.21
19.59
34.81
36.56
38.03
44.41
49.02
45.49
44.77
43.63
Basic Weighted Avg Shares
30
30
30
31
38
38
41
41
41
41
41
42
42
43
Sales/Revenue/Turnover
- -
207
278
501
634
764
869
981
1,012
1,360
1,612
1,481
1,782
1,810
Operating Margin (%)
- -
1.02
7.3
35.14
38.69
41.61
41.35
42.81
31.28
27.05
27.79
5.35
5.3
3.94
Depreciation Expense
- -
21
26
25
25
24
38
42
40
47
49
63
75
79
Net Income, GAAP
- -
17
24
150
186
280
309
322
253
379
435
127
71
7
Effective Tax Rate (%)
- -
- -
14.39
14.06
13.8
14.89
14.76
14.4
13.94
14.41
15.22
15.61
24.83
70.56
Profit Margin (%)
- -
8.1
8.63
30
29.41
36.66
35.5
32.85
24.97
27.88
26.99
8.57
3.96
0.36
Working Capital
137
145
172
415
418
567
1,239
1,274
863
1,154
1,328
988
991
1,009
LT Debt
- -
- -
- -
- -
- -
- -
2
1
83
1
7
11
3
3
Total Equity
190
207
232
478
580
745
1,442
1,509
1,584
1,857
2,063
1,919
1,900
1,877
Return on Invested Capital (%)
- -
- -
7.85
41.31
36.57
35.59
27.67
23.73
16.64
17.51
18.79
2.21
3.62
0.79
Return on Capital (%)
- -
- -
10.93
42.32
33.35
39.47
27.62
21.75
15.96
21.48
22.14
6.38
3.71
0.36
Return on Common Equity (%)
- -
8.46
10.93
42.32
35.21
42.24
28.22
21.84
16.34
22.04
22.2
6.37
3.7
0.35

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
9
9
7
LT Borrowings
- -
- -
- -
LT Finance Leases
3
4
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
42
42
42
Market Capitalization
15,755
19,851
20,032

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,240
1,146
1,222
Cash, Cash Equivalents & STI
558
443
496
Accounts Receivable, Net
336
281
361
Inventories
- -
- -
- -
Total Current Liabilities
249
207
213
Payables & Accruals
- -
- -
- -
ST Debt
9
9
7
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
27.89%
5.07%
-0.98%
Free Cash Flow
38.53%
-137.69%
-7.65%
Net Income, GAAP
54.24%
-14.39%
-44.38%
Sales/Revenue/Turnover
22.2%
13.66%
20.34%
Total Cash Common Dividend
- -
-9.29%
-70.01%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
342
429
382
328
1,481
2025
435
449
- -
544
1,782
2026
395
422
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.02
2.64
0.67
-1.27
3.05
2025
0.47
-0.98
- -
2.38
1.69
2026
-1.18
-0.06
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
6.69
2025
- -
- -
- -
- -
2
2026
- -
- -
- -
- -
- -

Company Description

CEO
Yuan Hsun Chang
Full Time Employees
133
Sector
Technology services
Industry
Packaged software
Address
No.1, Taiyuan 2nd Street Zhubei TP Taiwan 302082
IPO Date
Sep 20, 2017
Business
M31 Technology Corporation operates as a professional silicon intellectual property (IP) provider specializing in integrated circuit design for the semiconductor industry. The company offers a comprehensive range of high-speed interface IPs including USB, PCI Express (PCIe), Mobile Industry Processor Interface (MIPI), Serial-Deserializers (SerDes), and DisplayPort, as well as foundation IP such as standard cell libraries, memory compilers, general-purpose input/output (GPIO), and analog IP including analog-to-digital converters (ADC), phase-locked loops (PLL), low-dropout regulators (LDO), and process-voltage-temperature (PVT) sensors. M31 also provides IP integration services including processor core hardening to enhance chip design. Their products serve markets spanning AI applications, automotive electronics, IoT, mobile devices, wearable electronics, and high-performance computing. Founded in 2011 and headquartered in Hsinchu, Taiwan, M31 operates internationally with key collaborations, notably with major foundry TSMC. Recent developments include the launch of advanced IP solutions for AI chips demonstrated at ICCAD 2025, focusing on high-performance, low-power IP for AI, automotive, and edge computing applications. The company has expanded its portfolio with USB4 IP for TSMC's 5nm process and is advancing eUSB2 IP innovation aligned with TSMC's 2nm semiconductor process technology. M31 has received multiple consecutive Specialty Process IP Partner Awards from TSMC, reflecting deep strategic partnerships and technological leadership in advanced nodes. The company continues to grow its presence in China’s IC design industry, targeting AI-driven technology advancements and industrial upgrading. M31’s industry segment includes high-performance semiconductor IP design and IP integration services, targeting semiconductor manufacturers and chip designers worldwide. The company is recognized for its strong research and development capability and commitment to innovation in foundation IP and high-speed interface IP essential to next-generation semiconductor products. Recent operational highlights also include a focus on ultra-low power memory compilers on TSMC’s N6e platform and consistent corporate governance excellence recognized by local market evaluations. Overall, M31 Technology Corporation stands as a key player in the semiconductor IP development industry, delivering specialized silicon IP products and services that enable accelerated design cycles, cost reduction, and enhanced competitiveness for customers focused on AI, mobile, automotive, and data center markets. Its sustained collaboration with leading foundries and continuous innovation have positioned it at the forefront of semiconductor IP technology.