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    Electronic technology

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    Semiconductors
Hua Hsu Advanced Technology Co., Ltd.

Hua Hsu Advanced Technology Co., Ltd.

TTPEX:6682
31.45
TWD
-1.00
(-3.08%)
7.77BMarket Cap
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
- -
0.06
8.59
3.83
7.72
8.69
24.39
16.05
3.12
1.74
7.47
- -
Basic EPS, GAAP
-0.01
-0.11
-0.19
-4.57
-3.87
-2.42
-1.34
-0.35
-3.23
-2.98
-1.57
- -
Free Cash Flow per Basic Share
-2.32
-4.83
-6.35
-5.43
-2.32
0.91
-1.76
-3.36
-2.56
-1.59
-1.19
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
9.82
9.56
18.93
14.63
10.7
8.29
7.72
9.71
8.53
5.74
5.42
5.12
Tangible Book Value per Share
9
8.79
18.27
11.86
8.1
6.25
6.16
8.51
7.6
5.25
4.92
4.56
Basic Weighted Avg Shares
31
52
53
70
72
72
77
105
118
124
137
148
Sales/Revenue/Turnover
- -
3
459
270
552
622
1,889
1,686
369
216
1,023
- -
Operating Margin (%)
- -
-638.42
0.13
-122.48
-50.22
-29.63
-1.71
-1.58
-87.31
-143.65
-2.97
- -
Depreciation Expense
- -
4
32
61
84
79
74
72
99
116
102
- -
Net Income, GAAP
- -
-6
-10
-322
-277
-173
-104
-37
-381
-369
-214
- -
Effective Tax Rate (%)
- -
- -
2,041.52
- -
- -
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
- -
-185.2
-2.22
-119.21
-50.11
-27.87
-5.51
-2.2
-103.29
-171.18
-20.95
- -
Working Capital
619
403
917
529
331
243
386
425
386
229
681
647
LT Debt
- -
- -
39
2
129
121
204
156
106
131
135
113
Total Equity
688
670
1,326
1,124
829
647
665
1,048
1,095
745
1,175
1,206
Return on Invested Capital (%)
- -
- -
-1.15
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
-2.87
- -
- -
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
- -
-0.82
-1.02
-27.13
-30.53
-25.51
-16.54
-4.32
-35.58
-40.14
-27.66
- -

Capital Structure

TWD

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
ST Debt
82
63
62
LT Borrowings
96
111
91
LT Finance Leases
23
24
22
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
144
149
147
Market Capitalization
2,228
3,648
7,767

Working Capital

TWD

•

in mil. unless spec.
Jun'25
Dec'25
Jun'26
Total Current Assets
1,060
1,229
1,150
Cash, Cash Equivalents & STI
156
353
339
Accounts Receivable, Net
365
508
429
Inventories
414
330
332
Total Current Liabilities
629
548
503
Payables & Accruals
- -
- -
- -
ST Debt
82
63
62
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
12.25%
18.12%
57.73%
Free Cash Flow
-11.88%
-43.47%
-17.19%
Net Income, GAAP
511.88%
156.09%
-41.94%
Sales/Revenue/Turnover
- -
89.52%
374.29%
Total Cash Common Dividend
- -
- -
- -

Semi-annual Revenue

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
216
2025
- -
- -
1,023
2026
- -
- -
- -

Semi-annual Earnings Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
-2.98
2025
- -
- -
-1.57
2026
- -
- -
- -

Semi-annual Dividends Per Share

TWD

•

in mil. unless spec.

Year

H1
H2
FY
2024
- -
- -
- -
2025
- -
- -
- -
2026
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Chiao Yang Cheng
Full Time Employees
179
Sector
Electronic technology
Industry
Semiconductors
Address
No. 8, 10th Road, Industrial Zone Taichung City TX Taiwan
IPO Date
May 11, 2018
Website
huahsu.com
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Business
Hua Hsu Advanced Technology Co., Ltd. specializes in the research, development, production, and distribution of advanced electroplated diamond wires. These essential products are utilized for precision slicing of various hard and brittle materials, including silicon, sapphire, and magnetic substrates, serving critical applications in semiconductor and solar wafer processing. Established in 2015, the firm maintains its corporate headquarters in Hsinchu City, Taiwan.