1. Taiwan Stocks

  2. •

    Producer manufacturing

  3. •

    Industrial machinery
Gudeng Equipment Co., Ltd.

Gudeng Equipment Co., Ltd.

TTPEX:6953
229.00
TWD
-8.00
(-3.38%)
9.69EPS
23.84P/E
6.96BMarket Cap
Nov 06Next Earn
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
43.3
36.37
50.69
44.22
44.81
44.12
45.55
Basic EPS, GAAP
5.77
4.08
9.84
8.36
8.25
7.99
9.73
Free Cash Flow per Basic Share
13.75
9.01
6.23
15.75
1.91
0.3
10.55
Dividend per Share
- -
- -
- -
1.65
4.23
6
- -
Book Value per Share
5.33
7.81
20.17
26.86
52.32
53.7
54.79
Tangible Book Value per Share
3.26
6.61
19.11
25.8
51.47
52.86
53.96
Basic Weighted Avg Shares
11
17
21
27
29
30
30
Sales/Revenue/Turnover
478
602
1,048
1,207
1,302
1,324
1,367
Operating Margin (%)
17.65
17.39
23.88
22.04
19.98
20.14
21.06
Depreciation Expense
2
11
15
22
38
41
44
Net Income, GAAP
64
68
203
228
240
240
292
Effective Tax Rate (%)
20.08
25.76
20.34
17.7
21.64
13.08
13.78
Profit Margin (%)
13.32
11.22
19.41
18.91
18.41
18.1
21.36
Working Capital
72
156
495
596
1,423
1,339
1,266
LT Debt
- -
- -
18
29
131
270
348
Total Equity
146
213
551
733
1,570
1,612
1,645
Return on Invested Capital (%)
- -
42.94
45.62
30.07
16.68
12.41
13.67
Return on Capital (%)
- -
37.29
51.61
34.06
19.4
13.47
16.3
Return on Common Equity (%)
- -
37.65
53.27
35.56
20.82
15.07
18.69

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
18
18
18
LT Borrowings
151
151
227
LT Finance Leases
119
124
121
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
30
30
30
Market Capitalization
6,348
6,093
6,963

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
2,025
2,106
2,458
Cash, Cash Equivalents & STI
1,525
1,435
1,666
Accounts Receivable, Net
146
222
249
Inventories
348
439
539
Total Current Liabilities
686
1,047
1,191
Payables & Accruals
- -
- -
- -
ST Debt
18
18
18
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
70.94%
2.64%
Free Cash Flow
- -
9.53%
-83.52%
Net Income, GAAP
- -
44.9%
-0.03%
Sales/Revenue/Turnover
- -
24.97%
1.72%
Total Cash Common Dividend
- -
- -
46.6%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
331
362
307
302
1,302
2025
247
345
337
395
1,324
2026
265
369
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.87
1.86
2.3
2.19
8.25
2025
1.53
1.64
2.35
2.46
7.99
2026
1.26
3.66
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
4.23
2025
- -
- -
- -
- -
6
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Yin Feng Chan
Full Time Employees
200
Sector
Producer manufacturing
Industry
Industrial machinery
Address
No. 117, Section 1 New Taipei Taiwan 236041
IPO Date
May 13, 2024
Website
gdauto.com.tw
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Business
Gudeng Equipment Co., Ltd. (Ticker: 6953.TWO) manufactures and sells automated material handling systems and precision components primarily for the semiconductor and liquid crystal display (LCD) industries. The company offers a comprehensive range of products including overhead hoist transfer (OHT) systems, overhead shuttle (OHS) systems, stockers, automated guided vehicles (AGVs), sort-to-loaders, and semiconductor-specific equipment such as front-opening unified pod (FOUP) stockers, reticle stockers, and sorters; it also provides after-sales services, maintenance support, and customized engineering solutions for wafer fabrication facilities (fabs) and panel manufacturing plants. Gudeng serves major global semiconductor manufacturers and display panel producers as its target customers, with operations spanning Asia, North America, and Europe. Founded in 1998 and headquartered in Taoyuan City, Taiwan, the company operates through subsidiaries in the United States, China, Japan, and South Korea to support its international client base in the high-tech manufacturing sector. In the past two years, Gudeng has expanded its product portfolio with new launches including advanced 300mm wafer handling systems and next-generation OHT solutions optimized for high-volume fabs; the company secured strategic partnerships with leading chipmakers for joint development of EUV-compatible stockers and completed a significant funding round in 2024 to bolster R&D in AI-integrated automation.