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    Electronic technology

  3. •

    Electronic components
HUA YANG Precision Machinery Co., Ltd.

HUA YANG Precision Machinery Co., Ltd.

TTPEX:6983
326.00
TWD
-6.00
(-1.81%)
4.42EPS
78.68P/E
6.39BMarket Cap
Nov 25Next Earn
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
- -
7.75
20.26
14.19
11.44
15.78
19.64
20.42
Basic EPS, GAAP
- -
1.95
5.92
3.46
1.9
3.89
4.46
4.51
Free Cash Flow per Basic Share
- -
1.52
-2.2
-10.49
-4.89
3.29
7.94
4.92
Dividend per Share
- -
- -
- -
0.48
0.34
1.5
2
- -
Book Value per Share
1.72
3.59
7.72
18.52
23.08
25.62
28.1
49.99
Tangible Book Value per Share
1.68
3.56
7.45
18.23
22.88
25.51
28.04
49.92
Basic Weighted Avg Shares
16
15
11
11
16
16
16
16
Sales/Revenue/Turnover
- -
118
225
158
178
251
312
332
Operating Margin (%)
- -
20.12
37.36
30.89
20.51
28.49
29.52
26.42
Depreciation Expense
- -
2
3
4
4
7
10
10
Net Income, GAAP
- -
30
66
39
30
62
71
73
Effective Tax Rate (%)
- -
- -
19.75
20.44
23.04
17.84
21.26
20.68
Profit Margin (%)
- -
25.2
29.2
24.4
16.62
24.63
22.73
22.07
Working Capital
26
94
61
257
268
280
288
609
LT Debt
- -
45
7
144
209
212
175
37
Total Equity
27
57
123
294
367
407
447
901
Return on Invested Capital (%)
- -
- -
35.34
10.76
5.24
9.42
10.93
8.66
Return on Capital (%)
- -
- -
36.87
11.32
5.77
10.4
11.38
9.74
Return on Common Equity (%)
- -
70.66
72.99
18.46
8.96
15.97
16.62
11.33

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
38
38
8
LT Borrowings
174
164
36
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
16
16
18
Market Capitalization
2,862
4,802
6,388

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
415
411
710
Cash, Cash Equivalents & STI
310
273
532
Accounts Receivable, Net
35
63
87
Inventories
63
68
72
Total Current Liabilities
127
174
100
Payables & Accruals
- -
- -
- -
ST Debt
38
38
8
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
60.01%
9.71%
Free Cash Flow
- -
22.45%
141.54%
Net Income, GAAP
- -
35.83%
14.83%
Sales/Revenue/Turnover
- -
27.66%
24.42%
Total Cash Common Dividend
- -
- -
33.33%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
22
93
251
2025
54
45
145
68
312
2026
49
69
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
-0.33
1.6
3.89
2025
0.67
0.29
3.37
0.13
4.46
2026
0.19
0.85
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1.5
2025
- -
- -
- -
- -
2
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Hsien Te Hsiao
Full Time Employees
73
Sector
Electronic technology
Industry
Electronic components
Address
No. 56, Lane 686, Zhongzheng Road Tainan TQ Taiwan 712
IPO Date
Nov 9, 2023
Website
hua-yang.com.tw
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Business
UA YANG Precision Machinery Co., Ltd. (6983.TWO) manufactures and sells advanced imaging inspection equipment and modules for the semiconductor and display industries; its core products include deep ultraviolet (DUV) and extreme ultraviolet (EUV) mask inspection machines, EUV film inspection machines, after-development inspection (ADI) and after-etching inspection (AEI) mask inspection machines, light-emitting diode (LED) high-power heat sink inspection machines, optical substrate inspection modules, automated optical inspection (AOI) systems, in-situ wafer intelligence analysis systems such as IWIA and IWIA-CMP, IMIA in-situ mask intelligence analysis systems, machine vision solutions, high-precision stages, laser applications, load/unload automation, and AI-enhanced inspection algorithms with image libraries. Founded in October 2012 and headquartered in Tainan City, Taiwan, with additional offices in Hsinchu and Taichung, the company serves major semiconductor foundries and panel makers including TSMC, UMC, SMIC, Innolux, and Hannstar, primarily operating in Asia through equipment deployed for mask, wafer, flat panel display (FPD), printed circuit board (PCB), and IC carrier inspections. Recent developments include the 2023 initial public offering (IPO) on the Taipei Exchange, collaboration with TSMC Arizona and UMC Singapore, development of AR/VR inspection systems, release of IWIA in-situ wafer intelligence analysis in 2022 with first EUV mask inspection deployment at TSMC fabs, 2024 inauguration of a new headquarters, market launch of IMIA in-situ wafer intelligence analysis, delivery of 14-inch mask inspection to TSMC Advanced Packaging, and achievement of ISO 9001 certification.