1. Taiwan Stocks

  2. •

    Producer manufacturing

  3. •

    Industrial machinery
Horng Terng Automation Co Ltd

Horng Terng Automation Co Ltd

TTPEX:7751
1,300.00
TWD
-140.00
(-9.72%)
26.22EPS
52.39P/E
36.84BMarket Cap
Nov 12Next Earn
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
- -
56.71
36.71
46.89
73.49
90.64
Basic EPS, GAAP
- -
17.37
6.65
12.02
20.5
26.15
Free Cash Flow per Basic Share
21.36
24.43
7.78
12.1
21.38
20.77
Dividend per Share
4.55
11.36
8.29
6
9.65
- -
Book Value per Share
35.29
40.94
43.04
49.18
91.8
87.78
Tangible Book Value per Share
35.08
40.68
42.92
48.98
91.5
87.43
Basic Weighted Avg Shares
19
22
24
24
25
27
Sales/Revenue/Turnover
- -
1,273
886
1,145
1,859
2,404
Operating Margin (%)
- -
24.68
23.46
28.12
34.98
35.13
Depreciation Expense
- -
22
24
25
30
42
Net Income, GAAP
- -
390
160
294
519
694
Effective Tax Rate (%)
- -
21
22.47
20.06
20.72
21.05
Profit Margin (%)
- -
30.63
18.11
25.64
27.9
28.85
Working Capital
780
921
962
1,117
2,310
2,144
LT Debt
14
13
10
6
53
48
Total Equity
864
1,002
1,053
1,203
2,473
2,367
Return on Invested Capital (%)
- -
19.95
12.69
23.36
26.14
35.2
Return on Capital (%)
- -
34.89
14.82
25.73
27.55
38.31
Return on Common Equity (%)
- -
41.89
15.65
26.08
28.28
39.51

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
15
14
15
LT Borrowings
- -
- -
- -
LT Finance Leases
53
50
48
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
27
27
27
Market Capitalization
20,866
37,106
36,837

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,729
4,046
4,325
Cash, Cash Equivalents & STI
2,536
2,492
2,160
Accounts Receivable, Net
229
218
233
Inventories
936
1,298
1,886
Total Current Liabilities
1,419
2,071
2,181
Payables & Accruals
- -
- -
- -
ST Debt
15
14
15
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
- -
105.62%
Free Cash Flow
- -
- -
83.21%
Net Income, GAAP
- -
- -
76.72%
Sales/Revenue/Turnover
- -
- -
62.42%
Total Cash Common Dividend
- -
- -
66.67%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
289
272
290
294
1,145
2025
357
448
507
548
1,859
2026
618
731
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3.15
3.15
2.81
2.91
12.02
2025
4.01
4.07
6.16
6.12
20.5
2026
7
6.85
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
6
2025
- -
- -
- -
- -
9.65
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Jia Xin Xu
Full Time Employees
120
Sector
Producer manufacturing
Industry
Industrial machinery
Address
No. 61, Jingliu Road Kaohsiung City KHH Taiwan 81170
IPO Date
Jun 13, 2024
Website
hta.com.tw
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Business
Horng Terng Automation Co., Ltd. (7751.TWO) manufactures and develops semiconductor automation equipment, specializing in advanced packaging solutions for thermal management and process efficiency; key products include vision inspection machines such as 2D/3D AOI systems (T1520, FI7600, FI7700), open/short electrical testers (OS7000 series), lid attach and die bonding systems (DS3070, DS3100), heat link implantation machines (H5000, HS2400), wafer breakers (WB1100), dispensers, glue printing machines (SP3000), film attach machines (PF1000), micro ball attach and reflow automation (IP2000), lid gap inspection (LI1000), and auxiliary equipment like loading/unloading machines, lane changers (LC3000), and automatic connection systems; the company also provides fixtures, parts, and maintenance services. Founded in 1994 and headquartered in Kaohsiung City, Taiwan, Horng Terng Automation operates primarily in the semiconductor industry, serving top global IC packaging and testing firms with over 80% market share in thermal equipment among the top five providers; it expanded internationally with the establishment of Shanghai Horng Terng Technology Co., Ltd. in 2020 and maintains a workforce of approximately 100 employees, with over 40% dedicated to R&D. Recent developments include its 2024 initial public offering on the Taiwan Emerging Stock Market, receipt of the 7th Taiwan Mittelstand Award in 2024, development of the new-generation FCBGA Lid Attach Machine (DS3070S) and full-function 3D inspection system (FI7700) in 2022, FCBGA Lid Dispenser and Mount System (DS3100) in 2023, installation of a 170KW rooftop solar photovoltaic system in 2021, and full order books in 2025 driven by surging demand for AI chip cooling equipment.