E&R Engineering Corp.

E&R Engineering Corp.

TTPEX:8027
176.00
TWD
-13.00
(-6.88%)
0.28EPS
696.61P/E
23.24BMarket Cap
Nov 11Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
30.28
42.42
28.82
25.01
20.69
25.34
18.27
25.27
27.37
32.48
16.04
16.26
17.24
20.13
Basic EPS, GAAP
0.57
2.49
0.01
-2.31
-1.26
1.24
-1.01
2
2.62
3.94
0.32
-0.51
-0.93
0.31
Free Cash Flow per Basic Share
-3
1.47
-5.55
-0.81
-1.88
-3.06
2.01
-1.4
-0.26
-4.23
0.78
-1.44
-1.91
-1.53
Dividend per Share
- -
0.19
1.25
0.3
- -
- -
0.29
- -
1.13
1.59
2.02
0.49
- -
- -
Book Value per Share
10.63
15.86
14.38
11.5
13.74
14.52
13.23
16.94
23.92
25.78
24.07
27.16
25.2
26.85
Tangible Book Value per Share
10.38
15.61
14.21
11.36
13.62
14.43
13.06
16.68
23.73
25.66
23.9
27.03
25.13
26.67
Basic Weighted Avg Shares
43
47
54
56
69
81
80
81
93
99
97
101
105
106
Sales/Revenue/Turnover
1,315
1,994
1,542
1,392
1,426
2,051
1,469
2,041
2,545
3,223
1,549
1,645
1,809
2,129
Operating Margin (%)
2.56
5.56
0.28
-8.89
-5.86
4.7
-7.36
9.3
12.06
12.77
0.83
-7.6
-4.04
-2.38
Depreciation Expense
47
49
64
84
84
83
105
110
121
124
140
161
179
187
Net Income, GAAP
25
117
- -
-128
-87
100
-81
161
244
391
31
-51
-98
33
Effective Tax Rate (%)
31.63
12.92
74.51
- -
- -
2.22
- -
18.81
19.9
21.18
38.47
- -
- -
43.42
Profit Margin (%)
1.89
5.88
0.02
-9.23
-6.08
4.89
-5.5
7.9
9.59
12.13
2
-3.11
-5.41
1.54
Working Capital
336
450
721
315
749
1,166
950
940
1,909
3,035
2,536
2,120
1,585
1,652
LT Debt
29
28
328
35
38
458
540
138
133
1,151
1,151
775
692
672
Total Equity
584
815
903
715
1,149
1,245
1,111
1,460
2,425
2,636
2,349
2,830
2,658
2,896
Return on Invested Capital (%)
2.73
9.5
0.09
- -
- -
5.34
- -
9.49
10.78
9.63
0.27
- -
- -
-0.71
Return on Capital (%)
3.59
12.55
- -
- -
- -
7.06
- -
9.71
10.89
12.4
1.38
- -
- -
1.24
Return on Common Equity (%)
5.46
19.17
0.04
-17.69
-10.1
8.85
-7.21
13.08
12.93
15.85
1.27
-2
-3.58
1.21

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
262
111
113
LT Borrowings
568
714
542
LT Finance Leases
124
119
129
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
105
105
107
Market Capitalization
11,504
14,520
23,236

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
2,344
2,392
2,510
Cash, Cash Equivalents & STI
705
920
737
Accounts Receivable, Net
699
453
642
Inventories
802
855
922
Total Current Liabilities
758
701
858
Payables & Accruals
- -
- -
- -
ST Debt
262
111
113
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
14.71%
15.65%
-6.08%
Free Cash Flow
101.52%
231.54%
38.29%
Net Income, GAAP
-4,268.77%
-30.95%
91.29%
Sales/Revenue/Turnover
6.27%
3.12%
10%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
288
504
422
431
1,645
2025
315
375
398
721
1,809
2026
382
627
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.29
0.31
-0.38
-0.15
-0.51
2025
-0.57
-1.14
0.12
0.66
-0.93
2026
-0.22
-0.24
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.49
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Kun Shan Chen
Full Time Employees
1,770
Sector
Producer manufacturing
Industry
Industrial machinery
Address
61, Hengsang Road Kaohsiung City KH Taiwan 824
IPO Date
Jan 3, 2003
Website
enr.com.tw
Business
E&R Engineering Corporation (8027.TWO) provides automation equipment and packing materials for the semiconductor, light emitting diode (LED), passive component, flexible printed circuit (FPC), and medical industries. The company offers laser solutions including wafer and package marking as well as micromachining such as laser drilling, cutting, scribing, and grooving; plasma technology products comprising wafer, panel, and lead frame/substrate forms; FPC equipment consisting of roll-to-roll, stack-to-stack, lamination, punch, plating, and open cover machines; embossed carrier tape, cover tape, and tape and reel packaging products; and workshop and laser process development services. Founded in 1994 and headquartered in Kaohsiung, Taiwan, at 61 Heng Shan Rd, Yan-Chao District, E&R operates globally with service centers in the United States, Central America, Europe, China, Malaysia, Philippines, Thailand, and Vietnam, serving customers in Taiwan, Hong Kong, Mainland China, Southeast Asia, the United States, and Europe. Recent developments include the formation of the E-Core System Alliance in August 2024 to advance glass substrate mass production, the topping off of a new facility in Qiaotou Science Park in July 2025, a syndicated loan signing ceremony in August 2025, inauguration of a Jiangsu facility in July 2024, and expansion of its P3 plant with cleanroom capabilities in 2020 to meet semiconductor precision standards.