- CEO
- Kun Shan Chen
- Full Time Employees
- 1,770
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- 61, Hengsang Road Kaohsiung City KH Taiwan 824
- IPO Date
- Jan 3, 2003
- Business
- E&R Engineering Corporation (8027.TWO) provides automation equipment and packing materials for the semiconductor, light emitting diode (LED), passive component, flexible printed circuit (FPC), and medical industries. The company offers laser solutions including wafer and package marking as well as micromachining such as laser drilling, cutting, scribing, and grooving; plasma technology products comprising wafer, panel, and lead frame/substrate forms; FPC equipment consisting of roll-to-roll, stack-to-stack, lamination, punch, plating, and open cover machines; embossed carrier tape, cover tape, and tape and reel packaging products; and workshop and laser process development services. Founded in 1994 and headquartered in Kaohsiung, Taiwan, at 61 Heng Shan Rd, Yan-Chao District, E&R operates globally with service centers in the United States, Central America, Europe, China, Malaysia, Philippines, Thailand, and Vietnam, serving customers in Taiwan, Hong Kong, Mainland China, Southeast Asia, the United States, and Europe. Recent developments include the formation of the E-Core System Alliance in August 2024 to advance glass substrate mass production, the topping off of a new facility in Qiaotou Science Park in July 2025, a syndicated loan signing ceremony in August 2025, inauguration of a Jiangsu facility in July 2024, and expansion of its P3 plant with cleanroom capabilities in 2020 to meet semiconductor precision standards.