Contrel Technology Co., Ltd
TTPEX:8064117.00
TWD
-7.50
(-6.02%)
ISIN
TW0008064007
Return %
Stock
S&P 500
1Y
171.78
14.20
3Y
570.49
81.12
5Y
509.37
68.34
Capital Structure
TWD
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in mil. unless spec.Working Capital
TWD
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in mil. unless spec.Growth Rates
TWD
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in mil. unless spec.Quarterly Revenue
TWD
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in mil. unless spec.Quarterly Earnings Per Share
TWD
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in mil. unless spec.Quarterly Dividends Per Share
TWD
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in mil. unless spec.Company Description
- CEO
- Lu Yen
- Full Time Employees
- 306
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- Science-Based Industrial Park Tainan TQ Taiwan 744094
- IPO Date
- Jan 27, 2003
- Website
- contrel.com.tw
- Similar Companies
- Business
- Contrel Technology Co., Ltd. (8064.TWO) researches, develops, manufactures, and sells specialized equipment for flat panel displays, semiconductors, and related industries, with a focus on laser processing, automation, optical inspection, and vacuum coating technologies; core products include mini LED test, inspection, repair, laser drilling, bonding, mass transfer, trimming, and track metal repair equipment; sealant ultraviolet, nano protrusion, photo alignment ultraviolet, and ultrasonic dry cleaning systems; macro inspection, glass appearance inspection, burr check, electric testing, PAD inspection, lighting test, and demura systems; pack/unpack equipment, RTP/RTS panel transmission systems, and TFT/CF/LCD factory transmission systems; semiconductor automation solutions such as EFEM integrated systems, laser marking, molding, over process, plasma process automation, SMT lifters, I-Box inspection, OHCV/OHRGV handling, shuttles, OHS, carousels, stockers, e-racks, magazine/N2/tray stockers, glass cutting, EMC laser trimming, line repair, and laser microdrilling machines; OCR character recognition systems; 3D structured light stereo cameras, AI FVI sorting, AI OCR, CT/nano multiplexing inspection, chip measurement machines, and substrate laser repair equipment; logistics systems featuring high-speed sortation, automated storage/handling, and intelligent logistics; LED vacuum coating products including electroplasmic surface modification, electron beam evaporation, optical vacuum sputtering, horizontal high vacuum sputtering, deluster/evaporation/optical/sputtering machines, cross sight lenses, and nanoimprint products; and advanced offerings like TGV laser modification, PLP RDL 3D measuring, plasma cleaning, semiconductor laser debond, EMC laser trimming, glass laser cutting, PLP RDL optical measuring, SEUV LED equipment, and FOPLP/FOWLP solutions for panel-level and fan-out packaging. The company, founded in 1987 and headquartered in Tainan City, Taiwan, operates primarily in Taiwan with exports supporting global panel makers and semiconductor firms in Asia and beyond, targeting display manufacturers, OSATs, and advanced packaging customers. Recent developments include deepened strategic collaboration with parent Tongtai Machine & Tool Co., Ltd. (4526.TWO) for semiconductor and PCB equipment showcased at 2025 events like SEMICON Taiwan and Taiwan PCB Show, emphasizing FOPLP-driven technologies and overseas expansions; partnerships with AU Optronics and Innolux for microLED and panel-level packaging equipment orders; recognition as AUO's Co-Creation Partner in 2024 for MicroLED and smart manufacturing excellence; awards such as the 2024 Gold Panel Award for outstanding display components, second AI Award Best Solution, and sponsorship of Taiwan Precision Engineering Society paper awards in November 2025 to foster industry-academia innovation; donations of high-power femtosecond laser machines to National Cheng Kung University in 2024; and active pursuit of PLP/FOWLP growth including glass carrier cutting, laser debonding, EMC trimming, plasma cleaning, and seed layer sputtering, positioning semiconductor equipment revenue to exceed 30% of total in 2026 amid capacity expansions by seal testers, Chinese LED/MicroLED investments, and low-earth orbit satellite demands.