Advanced Wireless Semiconductor Co.

Advanced Wireless Semiconductor Co.

TTPEX:8086
120.50
TWD
-8.00
(-6.23%)
4.74EPS
31.46P/E
29.38BMarket Cap
Nov 05Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
7.77
19.44
31.52
16.02
11.72
12.88
15.6
21.31
24
11.01
13.86
22.67
20.95
24.13
Basic EPS, GAAP
-0.54
2.73
7.75
2.74
1.56
2.08
2.54
3.75
4.29
0.07
0.42
2.65
3.36
4.75
Free Cash Flow per Basic Share
1.79
1.67
7.1
2.65
2.71
2.05
-1.15
-2.15
-4.89
-2.96
-1.87
1.89
5.39
4.91
Dividend per Share
- -
- -
1.95
4.7
2.37
1.38
1.5
1.55
2.8
2.8
- -
1
1.19
- -
Book Value per Share
13.08
16.02
22.46
19.97
19.2
20.38
20.94
38.88
40.38
37.65
38.07
39.72
41.89
43.14
Tangible Book Value per Share
13.02
15.98
22.41
19.93
19.18
20.22
20.82
38.78
40.28
37.57
38.04
39.65
41.77
42.99
Basic Weighted Avg Shares
137
137
140
142
142
143
142
166
197
197
197
197
197
197
Sales/Revenue/Turnover
1,066
2,669
4,424
2,273
1,661
1,837
2,207
3,543
4,716
2,164
2,723
4,456
4,117
4,748
Operating Margin (%)
-6.2
14.84
27.78
21.68
17.54
17.83
19.92
21.88
20.71
-1.58
2.56
11.79
17.92
22.34
Depreciation Expense
235
229
242
271
261
252
250
260
364
483
594
658
697
715
Net Income, GAAP
-74
375
1,088
389
221
297
359
623
844
14
83
521
660
935
Effective Tax Rate (%)
- -
13.62
14.3
20.41
16.99
19.21
18.29
14.96
13.49
5.7
11.97
12.75
15.42
14.03
Profit Margin (%)
-6.95
14.04
24.59
17.1
13.32
16.14
16.28
17.58
17.89
0.63
3.04
11.69
16.04
19.69
Working Capital
826
1,113
1,782
1,536
1,600
1,692
1,623
5,133
3,349
2,281
2,745
3,447
4,060
4,142
LT Debt
163
106
29
12
- -
- -
256
90
85
85
398
892
698
377
Total Equity
1,796
2,221
3,191
2,827
2,735
2,853
3,001
7,641
7,935
7,398
7,482
7,807
8,233
8,478
Return on Invested Capital (%)
- -
15.15
35.55
12.4
8.59
9.3
11.32
11.78
10.65
-0.45
0.77
5.44
6.72
9.94
Return on Capital (%)
- -
16.79
37.96
12.64
7.9
10.53
11.54
11.24
10.72
0.2
1.09
6.23
7.21
10.35
Return on Common Equity (%)
-4.07
18.65
40.2
12.92
7.96
10.61
12.27
11.71
10.83
0.18
1.11
6.81
8.23
11.59

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
623
697
531
LT Borrowings
698
542
377
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
197
197
197
Market Capitalization
20,929
23,189
29,379

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
5,569
5,961
5,985
Cash, Cash Equivalents & STI
3,921
4,281
4,021
Accounts Receivable, Net
698
612
686
Inventories
923
1,037
1,248
Total Current Liabilities
1,509
2,018
1,843
Payables & Accruals
- -
- -
- -
ST Debt
623
697
531
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
15.75%
1.6%
5.46%
Free Cash Flow
-4.35%
15.45%
185.44%
Net Income, GAAP
101.8%
199.36%
26.73%
Sales/Revenue/Turnover
7.66%
12.17%
-7.61%
Total Cash Common Dividend
- -
- -
19%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,286
1,307
1,102
760
4,456
2025
772
974
- -
1,253
4,117
2026
1,222
1,298
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.09
1.06
0.42
0.08
2.65
2025
0.42
0.5
- -
1.33
3.36
2026
1.51
1.42
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1
2025
- -
- -
- -
- -
1.19
2026
- -
- -
- -
- -
- -

Company Description

CEO
Kuo Chun Huang
Full Time Employees
841
Sector
Electronic technology
Industry
Semiconductors
Address
No.6, Da-Li 1st Road Tainan TQ Taiwan 74145
IPO Date
Mar 31, 2003
Business
Advanced Wireless Semiconductor Company Advanced Wireless Semiconductor Company (8086.TWO) operates as a pure-play foundry specializing in gallium arsenide (GaAs) compound semiconductor wafer fabrication, research, development, production, testing, and sales primarily in Taiwan. The company provides InGaP/GaAs heterojunction bipolar transistor (HBT) processes for power amplifier and gain block circuit designs; GaAs enhancement/depletion-mode pseudomorphic high electron-mobility transistor (pHEMT) processes for switch and low noise amplifier applications; enhancement/depletion-mode integration of HBT and pHEMT technologies for highly integrated single-chip solutions in smartphones and WiFi devices; integrated passive device (IPD) processes including resistors, inductors, and high Q components for passive applications; optical products such as vertical cavity surface emitting lasers (VCSEL) and concentrated photovoltaic (CPV) solar solutions for sensors, 3D sensing, AR/VR, autonomous driving, and solar power plants; and flip-chip GaAs wafer copper pillar bump technology as a wire bond replacement. It serves wireless communications, optical communications, automotive, datacom, drones, and solar sectors with customers spanning Asia excluding Taiwan, the United States, and other regions, headquartered in Tainan City, Taiwan since its founding in 1998. In recent developments, Advanced Wireless Semiconductor Company expanded its strategic partnership with IQE plc in April 2024 through a multi-year supply agreement for GaAs wafers to manufacture smartphone power amplifiers supplied to Lansus for Tier One China-based Android OEMs, building on a over 20-year collaboration. The company continues diversification beyond mobile power amplifiers into high-growth areas including datacom, VCSEL optical sensors, automotive radar, drones, and GaAs solar cells to capitalize on AI-driven demand for high-bandwidth transmission and data centers. It reported third-quarter 2025 sales of TWD 1,117.18 million, a slight increase from the prior year, approved cash dividends for fiscal 2024, and achieved full-year 2024 revenue growth of 63.62% to TWD 4.46 billion amid operational expansions.