1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Computer peripherals
Panram International Corp.

Panram International Corp.

TTPEX:8088
41.30
TWD
-0.95
(-2.25%)
3.02EPS
21.40P/E
3.94BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
56.74
49.29
33.02
21.71
28.55
28.05
25.63
30.98
30.23
28.83
25
17.66
27.51
32.28
Basic EPS, GAAP
3.48
1.68
1.59
1.14
0.41
0.53
2.37
1.96
1.64
3.48
2.61
0.16
1.7
3.02
Free Cash Flow per Basic Share
0.46
4.38
3.33
-0.24
-1.6
3.46
3.17
2.19
2.16
5.59
2.08
0.24
-6.61
-3.77
Dividend per Share
0.57
3.1
1.52
1.4
0.5
0.19
0.44
2.08
1.2
1
2.4
2.6
0.5
- -
Book Value per Share
15.96
14.64
14.61
14.3
14.03
14.37
16.23
16.07
16.48
18.85
19.18
16.79
18.14
18.32
Tangible Book Value per Share
15.88
14.56
14.55
14.26
13.97
14.31
16.12
16.03
16.43
18.79
19.13
16.73
18.05
18.24
Basic Weighted Avg Shares
61
61
61
61
61
61
61
61
61
61
61
61
61
60
Sales/Revenue/Turnover
3,445
3,001
2,011
1,323
1,739
1,705
1,561
1,890
1,842
1,756
1,523
1,076
1,676
1,948
Operating Margin (%)
6.61
3.21
4.47
6.54
2.34
1.18
12.19
9.42
7.23
12.36
10.94
-4.3
7.01
9.82
Depreciation Expense
50
60
58
75
78
74
116
126
127
90
75
69
71
67
Net Income, GAAP
211
102
97
70
25
32
145
120
100
212
159
10
104
182
Effective Tax Rate (%)
17.12
17.2
16.45
17.74
6.04
18.36
21.22
20
20
20
20.13
19.78
20.03
19.35
Profit Margin (%)
6.13
3.41
4.81
5.25
1.43
1.91
9.26
6.33
5.42
12.07
10.46
0.93
6.18
9.36
Working Capital
605
508
463
385
383
357
469
513
522
668
707
573
678
666
LT Debt
67
54
43
38
32
27
23
22
13
5
1
7
1
- -
Total Equity
972
892
890
871
855
855
989
979
1,004
1,149
1,169
1,023
1,105
1,116
Return on Invested Capital (%)
17.58
7.37
7.49
7.12
3.51
1.59
14.59
11.18
8.67
15.43
11.12
-3.36
8.15
13.25
Return on Capital (%)
20.2
9.86
9.92
7.18
2.57
3.39
14.4
9.69
8.3
19.29
13.6
0.91
9.08
15.75
Return on Common Equity (%)
24.03
11
10.86
7.89
2.88
3.8
15.68
12.15
10.07
19.69
13.74
0.92
9.73
17.41

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
136
255
233
LT Borrowings
- -
- -
- -
LT Finance Leases
1
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
61
61
61
Market Capitalization
2,815
2,961
3,942

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
951
1,141
1,094
Cash, Cash Equivalents & STI
73
126
240
Accounts Receivable, Net
442
258
192
Inventories
404
704
632
Total Current Liabilities
273
387
429
Payables & Accruals
- -
- -
- -
ST Debt
136
255
233
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
2.49%
2.84%
7.98%
Free Cash Flow
-275.38%
-570.31%
-2,857.91%
Net Income, GAAP
117.45%
181.67%
931.19%
Sales/Revenue/Turnover
1.38%
1.19%
55.8%
Total Cash Common Dividend
37.82%
1.72%
-80.77%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
270
204
267
335
1,076
2025
292
312
422
650
1,676
2026
504
372
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.21
-0.55
-0.49
0.99
0.16
2025
0.13
-0.29
0.44
1.41
1.7
2026
1.04
0.11
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2.6
2025
- -
- -
- -
- -
0.5
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Wu Pei Hsieh
Full Time Employees
475
Sector
Electronic technology
Industry
Computer peripherals
Address
No. 460, Chenggong Road Taipei TPQ Taiwan 114705
IPO Date
Apr 3, 2003
Website
panram.com.tw
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Business
Panram International Corp. (8088.TWO) engages in the research, development, design, manufacture and sale of memory modules and flash memory related products including DRAM modules, solid state drives (SSDs), memory cards and I/O products such as IP phones, FPGA development boards, control boards, smart lights, smart meters, VGA cards, Thunderbolt 3 solutions and AC/DC power control boards; the company also provides original design manufacturing (ODM) and original equipment manufacturing (OEM) services encompassing product design, raw material procurement, logistics management, transportation, product testing and maintenance, as well as hardware design, mold development, DIP, SMT, IC testing and sorting, laser and spot soldering and laser engraving. Founded in 1994 and headquartered at 9F, No. 460, Sec. 5, Chenggong Road, Neihu District, Taipei City 114705, Taiwan, Panram operates primarily in Taiwan with products distributed to overseas markets including Asia, Europe and the Americas, serving sectors such as consumer electronics, communications equipment, industrial control computers, medical devices and automotive applications through its manufacturing facility in Taiwan's Liudu Technology Industrial Park featuring 21 SMT high-speed lines and a monthly capacity of 3.5 million units. Recent developments include the launch of industrial-grade SSD series with 3D TLC technology offering high read/write performance and wide temperature range, full-range I/O solutions for edge computing and AI applications, special M.2 IO adapter products and DDR5-related memory modules; in 2024, the company reduced DRAM production capacity below 50% amid a depressed memory market, announced layoffs of approximately 250 employees or nearly half its workforce of 475 due to canceled OEM orders from major clients including Kingston Technology, and pursued automotive growth and new partnerships to offset declining DDR4 demand.