SORACOM,INC.
TTSE:147A940.00
JPY
-29.00
(-2.99%)
ISIN
JP3436240000
Return %
Stock
S&P 500
1Y
1.62
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
JPY
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in mil. unless spec.Growth Rates
JPY
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in mil. unless spec.Quarterly Revenue
JPY
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in mil. unless spec.Quarterly Earnings Per Share
JPY
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in mil. unless spec.Quarterly Dividends Per Share
JPY
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in mil. unless spec.Company Description
- CEO
- Ken Tamagawa
- Full Time Employees
- 201
- Sector
- Technology services
- Industry
- Packaged software
- Address
- 9th Floor, Sumitomo Fudosan Motoakasaka Building Tokyo TY Japan 107-0051
- IPO Date
- Mar 26, 2024
- Website
- soracom.jp
- Similar Companies
- Business
- Soracom, Inc. (147A.T) provides Internet of Things (IoT) platform solutions, including cellular connectivity, data management, security, and cloud integration services for connected devices and machine-to-machine (M2M) applications. The company offers Soracom SIM and eSIM for 2G, 3G, 4G LTE, LPWA, and satellite connectivity with multi-carrier coverage in 160 countries; Soracom Arc for Wi-Fi, Ethernet, and satellite connections; connectivity management platform with zero-touch provisioning, remote device access, and unified control across network types; private IoT networking, data transmission to cloud providers like AWS, and protocol management tools; as well as subscriber identity modules, communication modules, and gateway devices. Soracom operates globally with offices in Tokyo, Bellevue (USA), and London (UK), targeting industries such as agriculture, energy, construction, transportation, healthcare, manufacturing, and consumer electronics; it serves over 20,000 customers ranging from startups to enterprises. Founded in 2014 and headquartered in Tokyo, Japan, Soracom functions as a subsidiary of KDDI Corporation. Recent developments include a March 2024 initial public offering on the Tokyo Stock Exchange Growth Market; a July 2024 letter of intent to acquire 51% of Cariot Co., Ltd., completed in October 2024; a February 2025 agreement with Marubeni Corporation for IoT collaboration in overseas markets, followed by a May 2025 joint venture establishment with Marubeni I-DIGIO Holdings; the January 2025 commercial launch of iSIM technology and modules with partners Sony Semiconductor Israel, Kigen, and Murata; August 2025 release of GenAI tools for IoT development, network management, workflow automation, and video analysis; and the planned year-end 2025 rollout of Connectivity Hypervisor for dynamic eSIM profile management.