1. Japan Stocks

  2. •

    Process industries

  3. •

    Industrial specialties
C. Uyemura & Co., Ltd.

C. Uyemura & Co., Ltd.

TTSE:4966
17,800.00
JPY
-700.00
(-3.78%)
317.26BMarket Cap
Nov 11Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
2026 Y
TTM
Revenue per Share
2,309.4
2,540.37
2,612.55
2,324.63
2,672.75
2,887.14
2,916.7
3,162.1
4,179.23
5,178.38
4,948.84
5,198.51
5,690.07
- -
Basic EPS, GAAP
7.62
208.14
233.45
292.41
296.41
314
299.3
402.89
559.61
636.84
673.41
872.86
864.57
- -
Free Cash Flow per Basic Share
307.73
311.31
369.48
365.7
341.64
465.15
240.3
490.46
428.74
812.99
767.35
1,190.61
860.97
- -
Dividend per Share
27.5
45
50
60.35
70
75
75.41
80.21
91.98
135.3
182.71
199.89
279.97
- -
Book Value per Share
2,302.82
2,653.22
2,753.11
2,956.42
3,234.07
3,396.11
3,601.43
3,929.41
4,567.35
5,125
5,749.95
6,578.51
7,251.54
- -
Tangible Book Value per Share
2,283.4
2,631.54
2,729.52
2,936.4
3,217.28
3,381.15
3,584.73
3,912.27
4,548.04
5,103.79
5,730.35
6,558.54
7,226.93
- -
Basic Weighted Avg Shares
18
18
18
18
18
18
18
18
17
17
16
16
16
16
Sales/Revenue/Turnover
42,050
46,255
47,569
42,082
48,120
51,980
52,223
55,947
72,304
85,749
80,256
83,845
91,784
- -
Operating Margin (%)
12.95
13.97
14.08
13.48
17.3
15.8
14.44
16.96
19.29
17.55
18.68
22.47
23.24
- -
Depreciation Expense
1,630
1,785
2,061
1,929
2,033
2,049
2,144
2,067
1,913
2,025
1,992
2,262
2,425
- -
Net Income, GAAP
139
3,790
4,251
5,293
5,337
5,653
5,359
7,128
9,682
10,546
10,921
14,078
13,946
- -
Effective Tax Rate (%)
68.59
44.23
37.42
6.1
31.39
31.2
31.1
28.19
31.18
32.21
30.89
30
32.31
- -
Profit Margin (%)
0.33
8.19
8.94
12.58
11.09
10.88
10.26
12.74
13.39
12.3
13.61
16.79
15.19
- -
Working Capital
28,458
33,873
35,968
37,838
38,967
41,624
37,627
42,364
48,528
50,518
56,461
68,202
79,650
- -
LT Debt
1,060
939
587
306
130
93
179
245
461
487
660
570
554
- -
Total Equity
43,286
49,392
50,523
53,637
58,226
61,143
63,888
69,474
78,712
84,364
92,714
106,117
116,664
- -
Return on Invested Capital (%)
3.9
7.15
7.74
9.57
9.66
8.99
7.89
9.75
12.37
11.97
11.16
12.66
12.45
- -
Return on Capital (%)
-3.65
7.63
8.1
9.82
9.3
9.34
8.48
10.57
12.91
12.77
12.18
14
12.4
- -
Return on Common Equity (%)
0.35
8.4
8.64
10.24
9.58
9.47
8.57
10.69
13.07
12.93
12.33
14.16
12.52
- -

Capital Structure

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
ST Debt
585
594
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
496
554
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
16
16
16
Market Capitalization
188,813
317,259
438,856

Working Capital

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
Total Current Assets
86,700
95,899
- -
Cash, Cash Equivalents & STI
51,531
58,474
- -
Accounts Receivable, Net
24,281
18,841
- -
Inventories
9,005
10,039
- -
Total Current Liabilities
16,738
16,249
- -
Payables & Accruals
- -
- -
- -
ST Debt
585
594
- -
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
8.77%
10.96%
9.94%
Free Cash Flow
16.66%
17.21%
-27.68%
Net Income, GAAP
13.54%
15.25%
-0.94%
Sales/Revenue/Turnover
7.38%
11.07%
9.47%
Total Cash Common Dividend
- -
26.81%
40.07%

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
83,845
2026
- -
- -
- -
- -
91,784
2027
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
872.86
2026
- -
- -
- -
- -
864.57
2027
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
199.89
2026
- -
- -
- -
- -
279.97
2027
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Hiroya Uemura
Full Time Employees
1,528
Sector
Process industries
Industry
Industrial specialties
Address
3-2-6 Dosho-machi Osaka OS Japan 541-0045
IPO Date
Nov 1, 1997
Website
uyemura.co.jp
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Business
C.Uyemura & Co., Ltd. manufactures and sells plating chemicals, surface finishing materials, plating equipment, control systems, industrial chemicals, and non-ferrous metals for surface treatment applications in electronics, automotive, and other industries; it operates plating processing services for printed wiring boards, plastics, and circuit boards; and engages in real estate leasing of office buildings, condominiums, and factory sites. The company provides specialized products including copper plating, final finish plating, electroless plating, hard disk media Ni-P plating, functional plating chemicals, and decorative plating chemicals, supporting applications in printed wiring boards, aluminum magnetic disks, semiconductors, wafers, packages, and automobile parts. Founded in 1848 and headquartered in Osaka, Japan, C.Uyemura conducts global operations across Japan, the United States, Taiwan, China, the Pacific Rim, and other regions through sales offices, manufacturing plants like the Hirakata Plant, and research facilities such as the Central Research Laboratory. In 2024, the company establishes a Shanghai Technical Center equipped with clean rooms and analytical equipment to enhance development in China; it advances investments totaling 4 billion yen over fiscal years 2025-2027 in semiconductor wafer processing, electroless nickel plating, environmentally friendly products like formalin-free electroless copper baths and PFOS/PFOA-free baths, wastewater treatment, plating solution recycling, and CO2 reduction technologies; and continues expansion in high-growth areas including new materials surface treatment and clean room chemical supply systems.