- CEO
- Kazuo Maeda
- Full Time Employees
- 508
- Sector
- Process industries
- Industry
- Chemicals: specialty
- Address
- 3-4-1, Kuise Minamishimmachi Amagasaki HYO Japan 660-0822
- IPO Date
- Jan 30, 2001
- Business
- MEC Company Ltd. MEC Company Ltd. (4971.T) engages primarily in the research, development, production, and sale of specialty chemicals, equipment, and materials for printed circuit board (PCB) fabrication and electronic component manufacturing; its core offerings include copper surface roughening treatments such as the CZ Series and EXE Series for mechanical and chemical adhesion enhancement between metal and resin, pre-lamination treatments for multilayer and high-frequency substrates, anisotropic and seed layer etching solutions, CO2 laser direct drilling surface preparations, degreasing and rust removal agents, microetching and etch down processes, residue removal treatments, DFR pre-treatments, and the proprietary AMALPHA technology for direct metal-resin bonding; the company also provides PCB machinery like chemical, pre-, and post-treatment equipment, as well as materials including copper foils and dry films, with repair services for such machinery. Founded in 1969 and headquartered in Amagasaki, Hyogo, Japan, MEC Company Ltd. operates globally through subsidiaries and distributors in Continental Asia (including China via MEC Fine Chemical (Zhuhai) Ltd. and MEC China Specialty Products (Suzhou) Company Ltd., Taiwan via MEC Taiwan Company Ltd., Thailand via MEC Specialty Chemical (Thailand) Co., Ltd., and Hong Kong), Europe (MEC Europe NV. in Belgium), the Americas, India, the Middle East, and North Africa, targeting electronics manufacturers in automotive, semiconductor packaging, 5G smartphones, and IoT applications with a focus on high-reliability surface creation technologies. In recent developments, the company fully acquired MEC Fine Chemical (Zhuhai) Ltd. to strengthen control as a wholly owned subsidiary, announced the 2030 Vision Phase 2 Medium-term Management Plan (2025-2027), participated in the JOINT3 consortium for next-generation semiconductor packaging, authorized and completed a share buyback of 500,000 treasury shares (2.67% of outstanding stock) for ¥1.29 billion in 2025 with subsequent retirement, progressed construction of the Kitakyushu Plant (delayed start to December 2026), revised earnings and dividend forecasts upward including a dividend increase to ¥60 per share, and issued its Sustainability Report 2025 while participating in trade shows like TPCA Show 2025 and SEMICON Japan 2025.