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Shikino High-Tech CO.,LTD.

Shikino High-Tech CO.,LTD.

TTSE:6614
807.00
JPY
-12.00
(-1.47%)
3.39BMarket Cap
Nov 12Next Earn
Shikino High-Tech CO.,LTD.
TSE:6614
(Tokyo Stock Exchange)

Recent

price

807.00

P/E

ratio

- -

div

yld

- -

ROIC.AI

2019
2020
2021
2022
2023
2024
2025
2026
TTM
JPY
1,127.26
1,091.96
1,461.4
1,233.11
1,466.11
1,603.82
1,472.87
1,474.17
- -
Revenue per Share
29.12
27.45
37.4
75.35
107.99
115.24
-3.3
-24.93
- -
Basic EPS, GAAP
8.71
48.41
45.73
-29.09
-35.71
42.87
-1.21
-231.28
- -
Free Cash Flow per Basic Share
- -
- -
- -
- -
9.92
14.97
14.99
15.03
- -
Dividend per Share
134.35
163.21
295.63
371.61
470.38
575.83
558.67
521.92
- -
Book Value per Share
125.58
156.99
291.16
350.84
423.86
518.55
499.04
474.47
- -
Tangible Book Value per Share
4
4
3
4
4
4
4
4
4
Basic Weighted Avg Shares
4,678
4,532
4,426
5,359
6,476
7,092
6,516
6,486
- -
Sales/Revenue/Turnover
3.51
5.2
4.59
7.4
10.15
8.52
0.86
-2.62
- -
Operating Margin (%)
97
95
96
111
104
101
148
140
- -
Depreciation Expense
121
114
113
327
477
510
-15
-110
- -
Net Income, GAAP
28.38
32.79
45.88
20.88
22.23
20.3
- -
- -
- -
Effective Tax Rate (%)
2.58
2.51
2.56
6.11
7.37
7.19
-0.22
-1.69
- -
Profit Margin (%)
-84
284
758
1,251
1,727
1,844
1,978
1,742
- -
Working Capital
164
297
198
189
293
207
339
212
- -
LT Debt
558
677
1,227
1,641
2,081
2,549
2,471
2,292
- -
Total Equity
- -
8.9
6.06
15.01
20.46
15.7
- -
- -
- -
Return on Invested Capital (%)
- -
6.99
6.97
17.05
20.29
17.61
- -
- -
- -
Return on Capital (%)
- -
18.45
11.9
22.84
25.64
22.01
-0.58
-4.61
- -
Return on Common Equity (%)

Capital Structure

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
ST Debt
740
1,189
- -
LT Borrowings
283
194
- -
LT Finance Leases
- -
18
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
4
4
4
Market Capitalization
3,526
3,390
3,832

Working Capital

JPY

•

in mil. unless spec.
Sep'26
Mar'26
Jun'27
Total Current Assets
3,700
3,961
- -
Cash, Cash Equivalents & STI
406
218
- -
Accounts Receivable, Net
1,869
1,153
- -
Inventories
1,035
982
- -
Total Current Liabilities
1,876
2,219
- -
Payables & Accruals
- -
- -
- -
ST Debt
740
1,189
- -
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
14.55%
-7.25%
Free Cash Flow
- -
3,680.86%
18,893.78%
Net Income, GAAP
- -
158.14%
651.95%
Sales/Revenue/Turnover
- -
8.57%
-0.47%
Total Cash Common Dividend
- -
- -
-0.28%

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
6,516
2026
- -
- -
- -
- -
6,486
2027
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
-3.3
2026
- -
- -
- -
- -
-24.93
2027
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2025
- -
- -
- -
- -
14.99
2026
- -
- -
- -
- -
15.03
2027
- -
- -
- -
- -
- -
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Business
Shikino High-Tech Co., Ltd. develops, designs, manufactures and sells semiconductor testing equipment, image processing cameras, embedded cameras for industrial use, shop cameras, IP cores and IoT PLC communication modules; provides LSI design services including analog/digital circuits, FPGA/ASIC development, power supply ICs, high-speed interfaces and image sensors; and offers related solutions such as burn-in systems, IC testers, inspection boards, test programs, camera modules with USB/YUV/NTSC outputs, customized lenses, JPEG/MIPI IP cores, DMS/EMS services and equipment rentals. The company operates in three segments—electronic systems, microelectronics and product development—targeting semiconductor post-production, industrial automation, FA equipment, robotics, vending machines, biometrics, surveillance, medical devices, mobility, ITS, smart agriculture, retail and IoT applications primarily in Japan with design centers in Tokyo, Yokohama, Osaka, Fukuoka, Kumamoto and branches across the country. Founded in 1975 and headquartered in Uozu-shi, Toyama, Japan, it employs 455 people and maintains production facilities in Toyama. Recent developments include the January 2024 completion of its acquisition of Sanshin Electric Works Business from Outsourcing Technology, Inc.; a partnership with e-con Systems announced in 2024 to expand embedded vision camera solutions for Japanese markets in mobility, robotics and medical fields; a June 2025 sales contract with German firm Ineltech to grow camera product distribution in Europe; and a April 2025 collaboration with AGNEZ TECH to broaden sales channels.