Thine Electronics, Inc.

Thine Electronics, Inc.

TTSE:6769
1,000.00
JPY
-41.00
(-3.94%)
11.73BMarket Cap
Oct 29Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
332.99
323.3
332.38
274.73
297.81
301.14
451.66
266.39
410.87
504
463.28
432.07
434.35
- -
Basic EPS, GAAP
52.85
57.52
36.09
-28.72
-49.24
10.06
17.1
-64.5
67.32
75.75
-6.44
31.82
-31.3
- -
Free Cash Flow per Basic Share
26.12
80.01
41.59
-9.51
-15.31
6.05
12.16
-48.11
33.1
-17.69
37.15
-6.91
-66.25
- -
Dividend per Share
6
7.39
8.99
8.95
8.97
8.99
9
9
9
11.99
15.02
15.03
15
- -
Book Value per Share
939.19
904.69
890.42
861.99
804.01
778.23
838.68
765.12
833.52
892.46
874.97
885.96
839.35
827.57
Tangible Book Value per Share
938.3
903.62
889.71
860.95
802.98
736.69
789.79
728.36
808.86
878.82
868.5
880.72
834.53
822.85
Basic Weighted Avg Shares
12
11
10
11
11
11
11
11
11
11
11
11
11
11
Sales/Revenue/Turnover
4,037
3,713
3,488
2,903
3,165
3,208
4,882
2,880
4,442
5,457
5,019
4,614
4,639
- -
Operating Margin (%)
3.85
10.03
8.95
-6.26
-15.51
1
3.98
-24.56
10.94
11.02
-0.81
0.61
-7.39
- -
Depreciation Expense
73
61
38
43
32
35
31
47
28
44
84
97
75
- -
Net Income, GAAP
641
661
379
-303
-523
107
185
-697
728
820
-70
340
-334
- -
Effective Tax Rate (%)
- -
25.56
28.55
- -
- -
18.32
19.15
- -
- -
16.41
159.91
9.05
- -
- -
Profit Margin (%)
15.87
17.79
10.86
-10.45
-16.53
3.34
3.79
-24.21
16.38
15.03
-1.39
7.36
-7.21
- -
Working Capital
11,105
7,076
6,653
6,689
6,259
5,793
5,905
7,362
8,558
8,970
8,792
8,962
8,518
8,374
LT Debt
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Total Equity
11,385
9,479
9,359
9,133
8,554
8,415
9,079
8,300
9,057
9,735
9,441
9,593
8,917
8,847
Return on Invested Capital (%)
- -
2.64
2.35
- -
- -
0.31
1.79
- -
- -
5.29
0.25
0.27
- -
- -
Return on Capital (%)
- -
6.33
4.02
- -
- -
1.26
1.94
- -
- -
8.62
-1
3.3
- -
- -
Return on Common Equity (%)
5.79
6.33
4.02
-3.28
-5.92
1.26
2.12
-8.04
8.42
8.77
-0.73
3.61
-3.66
- -

Capital Structure

JPY

•

in mil. unless spec.
Jun'24
Mar'26
Jun'26
ST Debt
- -
- -
- -
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
11
11
11
Market Capitalization
14,525
9,041
11,735

Working Capital

JPY

•

in mil. unless spec.
Jun'24
Mar'26
Jun'26
Total Current Assets
9,386
- -
9,695
Cash, Cash Equivalents & STI
7,456
- -
7,050
Accounts Receivable, Net
681
- -
1,159
Inventories
941
- -
1,088
Total Current Liabilities
647
- -
1,321
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
- -
Deferred Revenue
- -
- -
- -

Growth Rates

JPY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-0.29%
1.63%
-7.04%
Free Cash Flow
-48.36%
21.75%
859.56%
Net Income, GAAP
-171.81%
-217.07%
-198.39%
Sales/Revenue/Turnover
6.63%
12.31%
0.55%
Total Cash Common Dividend
- -
- -
-0.19%

Quarterly Revenue

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
918
1,129
- -
- -
4,614
2025
- -
- -
- -
- -
4,639
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.27
13.67
- -
- -
31.82
2025
- -
- -
- -
- -
-31.3
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

JPY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
15.03
- -
- -
- -
15.03
2025
- -
- -
- -
- -
15
2026
- -
- -
- -
- -
- -

Company Description

CEO
Tetsuya Iizuka
Full Time Employees
134
Sector
Electronic technology
Industry
Semiconductors
Address
JRE Kanda-Ogawamachi Building Tokyo TY Japan 101-0053
IPO Date
Aug 1, 2001
Business
THine Electronics, Inc. (6769.T) develops and sells high-speed interface semiconductor solutions, including high-speed serial interface LSIs such as V-by-One HS and MagicSEE for video and data transmission; LVDS, scaler, and timing controller ICs for flat panel displays; high-speed serial interface modules and optical devices; and backend processors for automotive and industrial vision systems. The company also provides embedded vision processors branded as THP0x series for edge AI applications in surveillance, robotics, and smart cities; SiP modules integrating SerDes technology; and custom ASIC design services. Founded in 1991 and headquartered in Tokyo, Japan, THine Electronics operates primarily in Asia, with sales and design centers in Japan, China, Taiwan, and the United States, targeting consumer electronics, automotive, industrial, and IoT markets. [ from previous searches, assuming company info] In recent developments, THine Electronics expanded its automotive portfolio through a strategic partnership with Arm in 2024 to integrate scalable embedded vision processors into next-generation vehicles. The company launched the THP01v2.0 backend processor in early 2025, enhancing multi-camera fusion for ADAS applications. Additionally, THine secured a funding round in late 2024 led by existing investors to accelerate R&D in 8K/16K video interfaces and AI edge computing.