Taiwan Semiconductor Manufacturing Company Limited
TSMWF
Other OTC17.24
USD
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- -
ISIN
TW0002330008
Return %
Stock
S&P500
1Y
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19.25
3Y
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65.11
5Y
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72.21
Capital Structure
FRC
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in mil. unless spec.Working Capital
FRC
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in mil. unless spec.Growth Rates
FRC
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in mil. unless spec.Quarterly Revenue
FRC
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in mil. unless spec.Quarterly Earnings Per Share
FRC
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in mil. unless spec.Quarterly Dividends Per Share
FRC
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in mil. unless spec.- CEO
- C. C. Wei
- Full Time Employees
- 76,907
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Hsinchu Science Park Hsinchu Taiwan, Province of China 300096
- IPO Date
- Jul 15, 2026
- Website
- tsmc.com
- Similar Companies
- Business
- Taiwan Semiconductor Manufacturing Company Limited (TSMC) operates as a dedicated semiconductor foundry and leader in advanced wafer fabrication services. TSMC focuses on the production of integrated circuits (ICs) for fabless semiconductor companies and other customers, offering a broad range of process technologies, specialty process services, and manufacturing solutions that enable customers to design and scale semiconductor products across diverse applications. Main Products and Services - Foundry services: leading-edge wafer fabrication for ICs across a variety of process nodes and technologies; volume production of logic, mixed-signal, analog, and specialty wafers; risk production and high-volume manufacturing capacity optimization; multi-project wafer service and turnkey manufacturing support. - Process technologies: advanced CMOS logic, FinFET and FinFET-equivalent structures for power and performance, ultra-low leakage processes, memory and specialty technologies, and specialty nodes tailored to customer requirements; development of process design kits, process qualification, and yield learning programs. - Manufacturing services: wafer fabrication, front-end processes (Fabs), back-end assembly and testing coordination as part of ecosystem support; package and test coordination through close collaboration with customers and ecosystem partners to ensure quality, reliability, and timing. - Design enablement and collaboration: IP protection, design-for-manufacturability guidance, collaboration on process characterizations, and joint development programs to optimize yields and performance for customer designs. - Supply chain and logistics support: wafer sourcing, utilization planning, capacity management across multi-site operations, and customer-facing supply chain services to ensure timely delivery and mitigated risk. - Quality and reliability services: extensive qualification programs, reliability testing, failure analysis, and ongoing monitoring to ensure product performance and adherence to industry standards. Geographic Operations - Global manufacturing footprint primarily anchored in Taiwan with wafer fabrication facilities and advanced cleanroom facilities; regional and global customer service and logistics support networks enabling worldwide access to manufacturing capacity; cross-border logistics and international customer engagement to support global fabless ecosystems. Founding Year and Headquarters - Founded in 1987 and headquartered in Hsinchu, Taiwan, with strategic presence and manufacturing operations spanning multiple regions to support a global customer base. Industry and Segments - Industry: Semiconductors; Segment focus: pure-play semiconductor foundry services, advanced wafer fabrication, and related manufacturing ecosystem support. - Customer types: fabless semiconductor companies, integrated device manufacturers seeking high-volume, technologically advanced wafer production, and partners within the semiconductor ecosystem requiring reliable manufacturing capacity and process innovation. Subsidiaries and Relationships - Operates as a standalone corporate entity with a comprehensive global ecosystem; maintains strategic partnerships and collaborations with major customers and ecosystem players to advance process technology development and manufacturing capabilities. Latest Major Company Changes - Strategic partnerships and alliances: engages in ongoing collaborations with leading semiconductor design houses, IP providers, and ecosystem partners to advance advanced process technologies, yield optimization, and manufacturing efficiency. - Funding rounds and acquisitions: maintains consistency of capital investment in advanced process development and capacity expansion to meet growing demand for cutting-edge nodes and specialty processes. - New product launches and service offerings: introduces process technology nodes and production capabilities aligned with market demand for high-performance, energy-efficient, and AI/accelerator-focused ICs. - Strategic shifts and expansions: expands manufacturing capacity and capability footprint through planned investments and site optimization initiatives to support multi-node, multi-project production pipelines. - Operational changes: implements ongoing efficiency programs, supply chain resilience measures, and process development roadmaps to sustain leadership in node advancement and manufacturing reliability. Context and Positioning - Market role: TSMC is a strategic manufacturing partner for leading technology and semiconductor companies, providing scalable, reliable, and technologically advanced fabrication services that underpin modern electronics across computing, communications, automotive, consumer electronics, and AI/ML applications. - Competitive differentiators: process technology leadership, high-volume manufacturing discipline, deep yield learning, comprehensive supply chain execution, and robust ecosystem collaboration that accelerates time-to-market for customers.