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    Electronic technology

  3. •

    Semiconductors
Macronix International Co., Ltd.

Macronix International Co., Ltd.

TTWSE:2337
99.50
TWD
-3.50
(-3.40%)
4.13EPS
37.48P/E
307.79BMarket Cap
Oct 27Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
12.58
12.7
11.84
13.53
18.99
20.28
19.1
21.64
27.39
23.51
14.9
13.96
15.49
23.07
Basic EPS, GAAP
-3.57
-3.66
-2.37
-0.14
3.06
4.94
1.64
2.9
6.48
4.85
-0.92
-1.73
-1.77
4.15
Free Cash Flow per Basic Share
-2.88
-0.87
0.11
2.51
2.65
2.86
-4.5
2.05
6.13
0.91
-4.43
-3.02
1.6
6.12
Dividend per Share
- -
- -
- -
- -
- -
0.99
1.2
1.2
1.21
1.8
1.8
0.5
- -
- -
Book Value per Share
16.19
12.67
10.16
10.11
13.41
17.06
17.68
19.52
25.2
28.38
26.07
23.72
24.69
31.29
Tangible Book Value per Share
16.01
12.53
10.1
10.09
13.38
17.03
17.65
19.49
25.15
28.31
26
23.68
24.66
31.27
Basic Weighted Avg Shares
1,765
1,765
1,768
1,783
1,801
1,822
1,832
1,839
1,846
1,850
1,854
1,854
1,865
1,913
Sales/Revenue/Turnover
22,204
22,414
20,928
24,125
34,197
36,953
34,995
39,801
50,573
43,487
27,624
25,883
28,880
44,122
Operating Margin (%)
-28.63
-28.18
-23.91
-1.48
16.82
17.62
8.86
14.74
21.88
21.54
-8.69
-15.16
-12.8
21.37
Depreciation Expense
7,744
7,565
5,901
2,042
1,972
2,120
2,731
3,746
4,284
4,539
4,224
4,857
5,094
5,082
Net Income, GAAP
-6,306
-6,454
-4,188
-243
5,518
8,993
3,012
5,326
11,963
8,970
-1,700
-3,214
-3,308
7,937
Effective Tax Rate (%)
- -
- -
- -
- -
0.35
2.93
0.44
8.82
10.24
12.85
- -
- -
- -
16.86
Profit Margin (%)
-28.4
-28.79
-20.01
-1.01
16.14
24.34
8.61
13.38
23.65
20.63
-6.15
-12.42
-11.45
17.99
Working Capital
11,189
1,831
8,613
7,415
11,473
16,525
11,092
13,593
21,072
23,057
19,438
18,934
17,021
25,255
LT Debt
10,935
2,074
7,862
5,636
4,860
5,885
10,748
11,677
10,004
12,674
17,969
21,381
18,030
13,623
Total Equity
28,624
22,606
18,429
18,319
24,656
31,360
32,493
36,194
46,725
52,610
48,326
43,980
45,808
61,944
Return on Invested Capital (%)
- -
- -
- -
- -
18.69
17.2
6.94
10.53
21.36
12.46
- -
- -
- -
9.99
Return on Capital (%)
- -
- -
- -
- -
18.7
24.93
7.23
10.94
21.49
14.19
- -
- -
- -
10.65
Return on Common Equity (%)
-19.86
-25.23
-20.42
-1.32
25.68
32.11
9.43
15.51
28.85
18.06
-3.37
-6.96
-7.37
15

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
6,937
7,564
8,315
LT Borrowings
17,386
14,727
13,019
LT Finance Leases
644
624
604
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,855
1,929
1,979
Market Capitalization
73,195
222,814
307,789

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
29,425
32,340
43,838
Cash, Cash Equivalents & STI
14,920
15,970
22,295
Accounts Receivable, Net
4,315
6,049
10,751
Inventories
9,813
9,276
9,756
Total Current Liabilities
12,404
13,877
18,584
Payables & Accruals
- -
- -
- -
ST Debt
6,937
7,564
8,315
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
10.49%
5.74%
4.16%
Free Cash Flow
118.95%
-131.03%
-153.19%
Net Income, GAAP
-231.88%
14.53%
2.93%
Sales/Revenue/Turnover
5.54%
-3.63%
11.58%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
5,760
6,456
7,755
5,913
25,883
2025
6,137
6,799
- -
7,729
28,880
2026
10,469
19,125
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.58
-0.15
-0.16
-0.84
-1.73
2025
-0.47
-0.69
- -
-0.16
-1.77
2026
0.9
3.91
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.5
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Miin Chyou Wu
Full Time Employees
3,922
Sector
Electronic technology
Industry
Semiconductors
Address
No. 16, Li-Hsin Road Hsinchu HSZ Taiwan 300
IPO Date
Mar 15, 1995
Website
macronix.com
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Business
Macronix International Co., Ltd. Macronix International Co., Ltd. designs, manufactures, and markets non-volatile memory integrated circuits, including a comprehensive range of NOR Flash products such as serial NOR Flash from 512Kbit to 2Gbit densities, parallel NOR Flash, OctaBus Memory, secure Flash solutions like ArmorFlash and ArmorBoot MX76 for identification, authentication, and encryption, 1.2V serial NOR Flash, and wide voltage range Flash; NAND Flash offerings encompassing SLC NAND, serial NAND, 19-nanometer NAND, 96-layer 3D NAND, and e.MMC for embedded applications; ROM products including serial ROM, parallel ROM, and XtraROM at 32-nanometer process; as well as LybraFlash for gigabit flash memory, wafer foundry services for IC design and IDM companies in processes like flat cell, high voltage, OTP, embedded NVM, analog, mixed-signal, and MEMS, and Known Good Die programs for system-in-package solutions. The company, founded in 1989 and headquartered in Hsinchu Science Park, Taiwan, operates two in-house wafer fabrication facilities—a 12-inch Fab 5 and an 8-inch Fab 2—and serves consumer, communications, computing, industrial, automotive, networking, IoT, medical, and other markets with sales in Taiwan, Japan, the United States, Europe, China, and rest of Asia. Recent developments include the launch of its 3D NOR Flash product at electronica 2024 in Munich to target high-demand applications in automotive, industrial, and medical sectors such as autonomous driving and smart technologies; achievement of stable production for 96-layer 3D NAND Flash with a focus on enterprise-grade SSDs; enhancements to the ArmorFlash MX78 series with over 100 times faster data access, low power consumption, and ISO/SAE 21434 cybersecurity certification; expanded collaborations with leading autonomous driving providers, automotive MCU manufacturers, and top-tier automakers for high-reliability memory adoption; and recognition of ArmorBoot MX76 as Best Memory Solution of the Year at EE Awards Asia 2024, marking the fourth such honor.