Taiwan-Asia Semiconductor Corporation

Taiwan-Asia Semiconductor Corporation

TTWSE:2340
45.50
TWD
-3.25
(-6.67%)
16.44BMarket Cap
Nov 11Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
13.81
13.65
12.16
11.86
12.96
12.07
13.03
14.8
15.63
10.36
9.07
9.82
9.88
- -
Basic EPS, GAAP
0.91
1.21
1.24
1.85
1.56
1.47
1.45
1.52
2.11
0.82
0.7
-1.16
-2.88
- -
Free Cash Flow per Basic Share
0.78
1.66
0.88
1.11
2.48
0.22
2.74
1.57
3
1.24
-6.33
-6.64
-3.11
- -
Dividend per Share
0.53
0.71
0.88
1.18
1.52
1.35
0.53
- -
1.31
3
1
0.53
0.03
- -
Book Value per Share
15.68
16.34
16.66
17.09
19.11
19.92
19.23
20.48
22.21
19.44
19
17.19
14.97
14.5
Tangible Book Value per Share
15.65
16.31
16.64
17.07
19.08
19.9
19.19
20.44
22.17
19.39
18.92
17.02
14.7
14.15
Basic Weighted Avg Shares
463
463
463
463
431
445
416
378
393
437
438
438
438
438
Sales/Revenue/Turnover
6,392
6,317
5,631
5,488
5,590
5,365
5,418
5,590
6,143
4,530
3,972
4,300
4,326
- -
Operating Margin (%)
7.62
11.82
10.04
12.42
14.02
13.69
13.63
12.37
16.49
8.63
2.05
-14.24
-29.74
- -
Depreciation Expense
460
440
412
400
418
445
487
473
472
441
514
750
1,104
- -
Net Income, GAAP
420
562
573
855
672
653
605
575
829
360
307
-510
-1,262
- -
Effective Tax Rate (%)
18.94
15.88
19.16
12.91
17.29
16.26
23.13
7.2
18.1
19.32
- -
- -
- -
- -
Profit Margin (%)
6.57
8.89
10.18
15.57
12.03
12.17
11.16
10.29
13.5
7.96
7.73
-11.86
-29.16
- -
Working Capital
4,240
4,439
4,652
4,116
3,211
3,847
4,263
4,573
5,437
3,817
2,817
2,160
1,604
1,509
LT Debt
1,537
1,236
1,015
- -
- -
250
1,044
965
199
385
1,866
3,320
3,563
3,505
Total Equity
7,260
7,566
7,716
7,914
7,224
7,531
7,268
7,693
9,698
8,509
8,498
7,928
7,066
6,756
Return on Invested Capital (%)
4.24
6.47
4.7
6.5
7.74
7.36
6.59
7.23
8.52
3.16
- -
- -
- -
- -
Return on Capital (%)
4.96
6.3
6.32
9.76
8.36
8.12
7.38
6.84
8.78
3.83
- -
- -
- -
- -
Return on Common Equity (%)
5.89
7.58
7.51
10.94
8.89
8.86
8.18
7.69
9.54
3.96
3.65
-6.44
-17.92
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2,018
2,363
2,644
LT Borrowings
3,418
3,252
3,372
LT Finance Leases
145
139
133
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
438
438
438
Market Capitalization
11,428
10,596
16,442

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
5,590
5,469
6,148
Cash, Cash Equivalents & STI
2,614
2,446
2,894
Accounts Receivable, Net
1,180
1,147
1,323
Inventories
1,595
1,683
1,716
Total Current Liabilities
3,986
4,375
4,639
Payables & Accruals
- -
- -
- -
ST Debt
2,018
2,363
2,644
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-0.35%
-0.78%
-10.87%
Free Cash Flow
45.18%
-123.1%
-53.27%
Net Income, GAAP
-13.32%
-29.16%
147.34%
Sales/Revenue/Turnover
-2.03%
-3.96%
0.61%
Total Cash Common Dividend
- -
- -
-95.07%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
957
1,081
1,153
1,109
4,300
2025
967
1,151
- -
1,063
4,326
2026
954
1,209
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.08
-0.13
-0.39
-0.57
-1.16
2025
-0.78
-0.86
- -
-0.69
-2.88
2026
-0.49
-0.44
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.53
2025
- -
- -
- -
- -
0.03
2026
- -
- -
- -
- -
- -

Company Description

CEO
Jung Huan Li
Full Time Employees
1,200
Sector
Electronic technology
Industry
Semiconductors
Address
No. 1, Li-hsin Road V Hsinchu HSZ Taiwan 300094
IPO Date
May 2, 1995
Business
Taiwan-Asia Semiconductor Corporation (Ticker: 2340.TW) specializes in the design, manufacture, and sale of optoelectronic semiconductor components. Its core product portfolio includes sensing devices such as photodiodes, silicon phototransistors, and phototriacs; power semiconductor devices including power MOSFETs, TVS diodes, and zener diodes; as well as light-emitting components like LED chips and LED lighting products. The company offers advanced LED epitaxy materials, chip fabrication, and customized semiconductor solutions targeting specialist markets that require high-performance sensing and lighting technologies. It operates primarily in Taiwan with its headquarters in Hsinchu Science-Based Industrial Park and engages customers across Asia and global semiconductor markets. Founded in 1987, Taiwan-Asia Semiconductor Corporation has recently made significant strategic operational changes including the planned spin-off of its 8-inch Gallium Nitride (GaN) product business group into its subsidiary Gan-Asia Semiconductor Corporation to focus on the growth prospects in power electronics. The company and its affiliated subsidiaries actively participate in SEMICON Taiwan 2025, showcasing integrated wafer fabrication and semiconductor service platforms that enhance one-stop solutions. TASC is positioning for robust growth leveraging its subsidiaries for innovation and expanding capacity utilization, with a strong focus on power devices suited for electric vehicles, smart grids, and industrial automation. The company also continues to invest in AI-driven manufacturing process improvements through its group affiliates. TASC serves emerging high-growth sectors including automotive electronics, data centers, industrial applications, and consumer electronics, aligning its product development with global demand for energy-efficient and reliable semiconductor components. Its semiconductor offerings contribute to power management, optical sensing, and lighting solutions essential for eco-friendly and intelligent technology applications. The company’s strategic focus includes expanding its GaN-based power device capabilities to meet rising performance and energy efficiency standards. Taiwan-Asia Semiconductor Corporation remains a key player in Taiwan’s semiconductor supply chain, supporting international market needs through innovation, diversified product lines, and integrated manufacturing services.