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    Electronic technology

  3. •

    Semiconductors
Mospec Semiconductor Corp.

Mospec Semiconductor Corp.

TTWSE:2434
50.70
TWD
-2.30
(-4.34%)
-0.49EPS
1.61BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
24.16
9.62
8.13
13.41
15.4
17.92
9.72
6.99
3.88
2.48
1.7
1.37
1.23
1.35
Basic EPS, GAAP
-9.28
10.17
-10.83
-7.43
-7.61
-10.63
-14.09
-0.33
-0.54
-0.94
-0.98
0.14
0.02
-0.49
Free Cash Flow per Basic Share
-6.44
-9.94
-4.92
-5.53
-4.97
2.37
-4.83
-10.26
-1.87
-2.87
-0.8
-1.8
-3.23
-3.64
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
32.7
56.91
31.83
26.37
32.97
22.65
7.9
12.44
14.34
13.53
12.52
12.76
12.74
12.12
Tangible Book Value per Share
32.7
56.91
31.83
26.37
32.74
22.46
7.76
12.38
14.32
13.53
12.52
12.76
12.74
12.12
Basic Weighted Avg Shares
20
27
27
17
17
17
17
19
35
37
37
37
37
37
Sales/Revenue/Turnover
475
256
217
228
262
305
165
134
135
92
63
51
46
50
Operating Margin (%)
-18.88
-58.98
-160.59
-46.14
-43.89
-59.5
-137.47
-53.06
-21.47
-79.17
-78.83
-93.44
-136.3
-151.31
Depreciation Expense
69
35
33
36
39
38
34
29
22
23
21
25
29
32
Net Income, GAAP
-182
271
-289
-126
-129
-181
-239
-6
-19
-35
-36
5
1
-18
Effective Tax Rate (%)
- -
1.61
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
2.04
- -
Profit Margin (%)
-38.41
105.71
-133.14
-55.39
-49.45
-59.31
-144.94
-4.69
-13.92
-38.05
-57.56
10.34
1.69
-36.33
Working Capital
459
765
420
262
176
-41
-80
78
143
105
61
64
46
-50
LT Debt
209
154
107
58
26
8
206
80
- -
16
28
49
70
55
Total Equity
871
1,138
848
703
561
385
134
336
530
501
463
472
471
448
Return on Invested Capital (%)
- -
-11.27
- -
- -
- -
- -
- -
- -
- -
- -
- -
-7.55
-9.35
- -
Return on Capital (%)
- -
21.03
- -
- -
- -
- -
- -
- -
- -
- -
- -
1.87
0.79
- -
Return on Common Equity (%)
-19.85
26.98
-29.07
-16.28
-20.49
-38.23
-92.22
-2.67
-4.35
-6.78
-7.53
1.12
0.16
-3.97

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
91
91
91
LT Borrowings
70
62
55
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
37
37
37
Market Capitalization
1,175
1,066
1,608

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
160
108
73
Cash, Cash Equivalents & STI
104
67
29
Accounts Receivable, Net
10
8
11
Inventories
5
9
8
Total Current Liabilities
114
112
123
Payables & Accruals
- -
- -
- -
ST Debt
91
91
91
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
6.28%
9.32%
-0.17%
Free Cash Flow
-22.14%
25.83%
79%
Net Income, GAAP
1.13%
18.06%
-85.36%
Sales/Revenue/Turnover
-12.05%
-18.4%
-10.18%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
10
15
13
13
51
2025
10
12
12
11
46
2026
11
16
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.33
-0.67
0.11
-0.64
0.14
2025
0.38
-0.52
0.47
-0.3
0.02
2026
-0.13
-0.52
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Yung Yu Tang
Full Time Employees
33
Sector
Electronic technology
Industry
Semiconductors
Address
No. 76, Zhongshan Road Tainan TQ Taiwan 74442
IPO Date
Sep 11, 2000
Website
mospec.com.tw
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Business
Mospec Semiconductor Corp. (2434.TW) operates as a vertically integrated power semiconductor company in Taiwan, specializing in the design, manufacture, and distribution of discrete semiconductor components; it produces power transistors including Darlington and switching transistors, Schottky barrier rectifiers, power Schottky diodes, SiC Schottky diodes, high efficiency rectifiers, fast recovery rectifiers, ultra-fast recovery rectifiers, transient voltage suppressor diodes, small signal Schottky diodes, and mini dip bridges, as well as surface mount devices in various package types such as TO-220, TO-247, TO-3, ITO-220, and SMD formats. The company also provides silicon wafer processes encompassing epitaxial silicon wafers, polished prime wafers, wafer reclamation products, and crystalline silicon solar cells, alongside foundry services for silicon epitaxy, wafer fabrication, and semiconductor packaging. Founded in 1987 and headquartered in Xinshi District, Tainan City, Taiwan, Mospec serves diverse global markets including power management, consumer electronics, automotive, and industrial applications with products available in chip, wafer, or packaged forms. Recent financial performance reflects challenges with third quarter 2025 earnings showing improved earnings per share of NT$0.47 versus NT$0.12 in the prior year third quarter, amid ongoing operations in a competitive semiconductor landscape without major disclosed acquisitions, partnerships, or strategic shifts in 2024 or 2025.