1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
MediaTek Inc

MediaTek Inc

TTWSE:2454
4,010.00
TWD
-130.00
(-3.14%)
61.10EPS
70.00P/E
6.78TMarket Cap
Oct 30Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
101.41
137.94
136.37
176.18
152.3
152.08
157.04
204.75
312.47
346.51
273.15
333.77
374.36
372.55
Basic EPS, GAAP
20.51
30.04
16.6
15.16
15.56
13.26
14.69
26.01
70.56
74.59
48.51
66.92
66.16
60.65
Free Cash Flow per Basic Share
28.04
21.82
7.66
16.31
9.91
8.65
22.1
44.06
15.9
79.35
94.06
84.01
86.29
49.68
Dividend per Share
9
15.18
22
11
9.53
9.99
9.03
10.54
37.1
73.33
76.24
55.07
54.07
54.06
Book Value per Share
145.58
158.07
153.75
155.48
165.1
172.35
197.71
235
271.53
276.51
231.31
248.84
250.98
265.77
Tangible Book Value per Share
134.02
119.21
105.51
109.74
116.79
125.75
152.88
186.8
225.32
230.36
180.27
197.23
200.7
204.67
Basic Weighted Avg Shares
1,342
1,545
1,564
1,564
1,564
1,565
1,568
1,573
1,579
1,584
1,587
1,590
1,592
1,593
Sales/Revenue/Turnover
136,056
213,063
213,255
275,512
238,216
238,057
246,222
322,146
493,415
548,796
433,446
530,586
595,966
593,618
Operating Margin (%)
18.55
22.17
12.15
8.38
4.12
6.7
9.16
13.42
21.9
23.1
16.58
19.29
17.36
15.13
Depreciation Expense
1,727
2,766
5,134
6,896
7,210
7,571
8,386
9,901
10,621
14,980
18,200
20,936
22,974
24,436
Net Income, GAAP
27,515
46,398
25,958
23,701
24,333
20,760
23,033
40,917
111,421
118,141
76,979
106,387
105,319
96,635
Effective Tax Rate (%)
6.98
11.37
12.26
11.69
11.63
12.28
14.15
12.91
11.81
12.49
11.05
10.36
15.03
13.01
Profit Margin (%)
20.22
21.78
12.17
8.6
10.21
8.72
9.35
12.7
22.58
21.53
17.76
20.05
17.67
16.28
Working Capital
100,356
146,935
113,607
100,931
111,407
113,445
135,631
148,064
135,758
156,083
58,890
84,123
94,106
76,687
LT Debt
87
54
- -
401
2,063
925
2,526
2,362
3,818
8,308
8,060
8,375
8,225
8,495
Total Equity
195,353
247,606
247,087
246,663
261,199
274,326
314,400
375,084
433,648
443,058
374,205
405,055
409,195
432,642
Return on Invested Capital (%)
11.37
15.83
7.58
6.75
2.73
4.3
5.48
9.6
20.89
22.75
14.57
21.8
19.78
16.96
Return on Capital (%)
13.54
18.06
9.02
7.98
8.08
6.79
6.91
10.52
24.81
24.79
18.15
26.05
24.83
21.94
Return on Common Equity (%)
14.84
20.97
10.65
9.77
9.64
7.79
7.87
11.95
27.72
27.09
19.05
27.82
26.42
24.14

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
5,505
29,881
32,952
LT Borrowings
60
120
120
LT Finance Leases
8,165
8,337
8,375
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,596
1,596
1,596
Market Capitalization
2,282,449
2,378,204
6,775,448

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
397,456
378,185
397,006
Cash, Cash Equivalents & STI
247,709
194,779
198,403
Accounts Receivable, Net
62,119
79,245
76,981
Inventories
67,235
85,470
98,421
Total Current Liabilities
303,350
309,807
320,319
Payables & Accruals
- -
- -
- -
ST Debt
5,505
29,881
32,952
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
5.62%
2.3%
1.02%
Free Cash Flow
66.48%
69.56%
2.87%
Net Income, GAAP
24.86%
36.14%
-1%
Sales/Revenue/Turnover
12.79%
15.62%
12.32%
Total Cash Common Dividend
27.55%
65.25%
-1.69%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
133,458
127,271
131,813
138,043
530,586
2025
153,312
150,369
142,097
150,188
595,966
2026
149,151
152,183
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
19.85
16.19
15.94
14.94
66.92
2025
18.43
17.5
15.84
14.36
66.16
2026
15.17
15.28
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
24.65
- -
30.43
- -
55.07
2025
29.04
- -
25.03
- -
54.07
2026
29.06
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Li Hsing Tsai
Full Time Employees
22,869
Sector
Electronic technology
Industry
Semiconductors
Address
No. 1, Dusing 1st Road Hsinchu TP Taiwan 30078
IPO Date
Jul 23, 2001
Website
mediatek.com
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Business
MediaTek Inc. (TWSE: 2454) is a fabless semiconductor company that designs and markets systems-on-chip (SoCs) solutions for wireless communications, mobile devices, home entertainment, connectivity, Internet of Things (IoT), automotive, and edge AI applications. The company offers a broad portfolio of products including Dimensity and Helio series chipsets for entry-level to flagship smartphones and tablets; MediaTek Genio platforms for consumer and enterprise IoT devices with voice, vision, and smart display capabilities; connectivity solutions encompassing Wi-Fi 7, 5G modems, and networking chipsets for routers and home gateways; smart home technologies for TVs, speakers, and voice assistants; Dimensity Auto platforms for infotainment, advanced driver-assistance systems (ADAS), and autonomous driving with 4G/5G cellular, mmWave radar, and AI-vision processing; custom ASIC solutions for AI, blockchain, and high-performance computing; display and camera processors; HyperEngine gaming technologies; and analog ICs via subsidiary Richtek Technology. MediaTek serves smartphone manufacturers, consumer electronics brands, automakers, and IoT developers worldwide, operating through geographic segments in Asia-Pacific (including headquarters), the U.S., Europe, and the Middle East. Founded in 1997 and headquartered in Hsinchu Science Park, Taiwan, MediaTek powers over 2 billion devices annually, holding leading market positions as the top provider of smartphone chipsets globally, number-one supplier in Android tablets and Arm-based Chromebooks, and largest vendor of smart TV chipsets. Subsidiaries include Airoha Technology for AIoT and broadband infrastructure, and Richtek for power management ICs. In recent developments, MediaTek partnered with Samba TV in September 2025 to deploy EdgeAI solutions like Samba AI with MiraAware on connected TVs for on-device content intelligence; announced a strategic alliance with Kynetics in November 2025 to advance embedded Android OS development using the Genio platform; led a $10 million seed funding round for InfiniLink in April 2025 to bolster AI-powered connectivity; made a TWD 376 million private placement investment in HFI Innovation in April 2025 to enhance AI ASIC and automotive capabilities with vertical integration including NVIDIA technologies; collaborated with TSMC on a pioneering chip featuring advanced packaging in November 2025; and joined NVIDIA's NVLink Fusion consortium while advancing cloud AI ASICs with Google TPU partnerships as outlined at industry forums in 2025. These initiatives underscore expansions into AI, automotive, and edge computing amid strong growth in flagship smartphones, connectivity, and computing segments reported in 2025 earnings.