1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Semiconductors
C Sun Mfg. Ltd.

C Sun Mfg. Ltd.

TTWSE:2467
452.00
TWD
-28.00
(-5.83%)
10.29EPS
62.12P/E
97.73BMarket Cap
Nov 06Next Earn
2012 Y
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
TTM
Revenue per Share
22.02
20.61
22.43
20.16
24.47
31.91
36.36
28.31
26.06
36.59
34.27
23.27
32.17
52.94
Basic EPS, GAAP
1.58
1.71
1.46
-2.97
1.32
2.57
3.55
1.99
2.8
4.22
4.59
3.12
4.8
9.98
Free Cash Flow per Basic Share
0.42
0.79
-0.04
1.23
4.77
0.25
3.11
2.17
9.14
1.48
3.3
6.15
3.61
-3.91
Dividend per Share
1.72
1.43
1.43
1.24
- -
0.48
1.43
2.38
2.38
2.38
2.92
3.62
3
4.93
Book Value per Share
15.57
16.77
17.28
13.13
12.63
14.6
16.56
16.03
16.01
18.13
20.35
20.7
32.39
100.34
Tangible Book Value per Share
14.61
15.94
16.34
12.7
12.24
14.19
16.18
15.68
15.68
17.83
20.02
20.38
32.07
99.9
Basic Weighted Avg Shares
166
167
167
167
159
157
157
157
157
156
157
156
150
153
Sales/Revenue/Turnover
3,653
3,438
3,740
3,363
3,885
5,003
5,700
4,438
4,086
5,723
5,367
3,626
4,818
8,090
Operating Margin (%)
7.89
4.96
5.69
-6.66
5.45
11.33
12.23
7.55
15.24
12.85
13.85
11.21
13.26
21.66
Depreciation Expense
113
136
120
135
79
70
70
102
101
84
80
79
80
93
Net Income, GAAP
262
286
243
-496
210
403
556
312
439
660
719
486
719
1,525
Effective Tax Rate (%)
22.03
21.12
19.32
- -
0.85
16.86
23.87
19.07
21.56
18.12
18.54
9.23
22.76
22.06
Profit Margin (%)
7.17
8.31
6.5
-14.75
5.41
8.06
9.76
7.04
10.74
11.54
13.4
13.41
14.93
18.85
Working Capital
1,944
1,928
1,719
1,357
1,313
1,660
1,804
1,548
1,504
1,661
1,930
1,796
3,106
1,717
LT Debt
393
205
357
627
600
540
620
558
436
751
768
1,172
1,848
3,449
Total Equity
2,704
2,850
2,992
2,082
2,050
2,378
2,719
2,650
2,682
3,050
3,478
3,415
5,251
16,330
Return on Invested Capital (%)
5.89
3.39
3.87
- -
5.44
12.25
12.17
5.83
9.92
13.74
11.74
6.6
7.22
9.54
Return on Capital (%)
8.61
7.95
6.23
- -
6.51
10.46
12.86
7.34
10.01
14.17
13.66
8.64
10.7
10.84
Return on Common Equity (%)
10.01
10.59
8.56
-19.56
10.07
18.88
22.78
12.23
17.47
24.74
23.89
15.49
18.1
15.49

Capital Structure

TWD

•

in mil. unless spec.
Sep'25
Mar'25
Jun'25
ST Debt
1,030
1,152
1,058
LT Borrowings
2,533
4,282
3,440
LT Finance Leases
11
9
9
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
151
152
158
Market Capitalization
28,967
61,704
97,729

Working Capital

TWD

•

in mil. unless spec.
Sep'25
Mar'25
Jun'25
Total Current Assets
6,445
8,669
10,483
Cash, Cash Equivalents & STI
2,022
3,027
3,441
Accounts Receivable, Net
2,119
2,218
2,450
Inventories
1,964
3,112
4,029
Total Current Liabilities
4,395
7,397
8,767
Payables & Accruals
- -
- -
- -
ST Debt
1,030
1,152
1,058
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
7.68%
16.18%
53.78%
Free Cash Flow
-154.04%
80.55%
-43.64%
Net Income, GAAP
-24.48%
23.07%
47.88%
Sales/Revenue/Turnover
5.24%
5.27%
32.89%
Total Cash Common Dividend
- -
- -
-20.39%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1,080
1,349
1,054
1,335
4,818
2025
2,783
1,510
1,536
2,262
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.15
1.25
1.1
1.3
4.8
2025
4.09
1.37
1.4
3.06
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
3
2025
- -
4.98
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Yu Wen Liang
Full Time Employees
10,751
Sector
Electronic technology
Industry
Semiconductors
Address
No. 266, Wenhua 2nd Road Taipei TP Taiwan 337021
IPO Date
Sep 17, 2001
Website
csun.com.tw
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Business
C Sun Mfg Ltd C Sun Mfg Ltd (2467.TW) manufactures and distributes semiconductor and electronic processing equipment, specializing in light and heat core technologies including plasma process, UV process, lamination and coating, thermal process, and wet process. The company offers printed circuit board (PCB) equipment such as roller coating systems, exposure systems, UV curing equipment, cut sheet laminators, conveyorized ovens, and convection cabinet ovens; flat panel display (FPD) equipment including thin film transistor liquid crystal display (TFT-LCD) equipment, TFT-liquid crystal module (LCM) equipment, and top UV machines; semiconductor and electronics equipment such as UV dryers, clean ovens, convection cabinet ovens, wafer vacuum laminate equipment, automated wafer-level bonding machines, plasma equipment, peelers, and laminators; as well as equipment for shoes, printing, painting, coating, photovoltaic (PV), textiles, plastics, rubber, chemicals, and aerospace industries, including industrial box and tunnel ovens, automatic system integration technologies, and consumables. C Sun Mfg Ltd serves industries including PCB, touch panel IC substrate, semiconductor advanced packaging, shoe making, printing, coating, and PV, with products distributed to over 20 countries such as Taiwan, China, Japan, United States, South Korea, Singapore, Malaysia, Vietnam, Thailand, and India. Founded on September 28, 1966 and headquartered in New Taipei City, Taiwan, with operating centers in Linkou, Taichung, Tainan, Guangzhou, Kunshan, Dongguan, and Bangkok, the company maintains a dominant market share in Greater China across bonding, laminating, peeling, baking, and electroplating pre-treatment equipment categories and continues to expand its global footprint through innovation in advanced processes like 3D stacking, heterogeneous integration, line-width scaling, and wafer thinning via the G2C+ Alliance.