Scientech Corporation

Scientech Corporation

TTWSE:3583
594.00
TWD
-26.00
(-4.19%)
17.01EPS
53.41P/E
75.58BMarket Cap
Oct 30Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
38.5
33.48
36.4
43.07
43.66
49.27
49.17
44.57
58.31
70.34
86.05
120.61
141.56
146.1
Basic EPS, GAAP
3.13
3.04
1.06
3.6
4.05
5.16
4.02
3.8
5.23
7.08
8.1
11.54
13.82
16.93
Free Cash Flow per Basic Share
3.01
1.76
0.14
9.06
5.23
5.96
1.85
8.65
18.72
23.88
11.76
14.67
2.8
27.92
Dividend per Share
- -
3
1.51
1
2
2
2.5
2
1.85
2.5
3.6
4
4.5
- -
Book Value per Share
23.88
24.1
23.85
26.32
28.57
31.15
32.61
35.43
38.95
44.6
49.66
61.77
75.43
121.48
Tangible Book Value per Share
23.83
24.05
23.81
26.29
28.54
31.12
32.58
35.41
38.93
44.58
49.65
61.76
74.83
121
Basic Weighted Avg Shares
80
81
81
81
81
81
80
80
80
80
80
80
80
81
Sales/Revenue/Turnover
3,068
2,717
2,942
3,495
3,539
3,988
3,949
3,580
4,684
5,650
6,912
9,688
11,371
11,761
Operating Margin (%)
11.53
10.93
4.23
9.8
11.95
13.06
10.73
12.75
12.16
12.68
10.45
11.41
13.86
14.39
Depreciation Expense
201
221
235
207
182
140
127
129
109
114
122
136
207
264
Net Income, GAAP
249
246
86
292
328
418
323
305
420
569
650
927
1,110
1,363
Effective Tax Rate (%)
23.91
22.33
27.64
19.53
20.83
22.62
20.02
21.44
19.86
22.73
24.41
27.39
25.83
24
Profit Margin (%)
8.13
9.07
2.92
8.37
9.28
10.48
8.17
8.53
8.97
10.06
9.41
9.57
9.76
11.59
Working Capital
751
674
753
871
1,273
1,079
1,254
988
1,173
1,315
1,680
3,107
1,948
2,866
LT Debt
576
543
440
200
300
- -
78
80
69
64
72
1,219
71
69
Total Equity
1,938
1,955
1,935
2,136
2,295
2,502
2,619
2,846
3,129
3,582
3,989
4,962
6,410
10,525
Return on Invested Capital (%)
10.5
8.57
3.3
10.43
12.83
15.09
11.78
11.56
13.95
14.09
12.38
14.12
15.46
14.17
Return on Capital (%)
10.21
9.61
3.46
11.48
13
16.36
12.4
10.52
12.77
15.15
15.47
16.89
14.88
15.37
Return on Common Equity (%)
14.31
12.66
4.41
14.36
14.83
17.42
12.6
11.18
14.06
16.94
17.18
20.71
20.14
17.93

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,530
1,293
195
LT Borrowings
- -
- -
- -
LT Finance Leases
71
68
69
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
80
80
84
Market Capitalization
26,831
36,437
75,582

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
20,158
20,905
21,782
Cash, Cash Equivalents & STI
6,688
7,258
7,429
Accounts Receivable, Net
888
782
928
Inventories
11,948
11,982
12,405
Total Current Liabilities
18,210
19,129
18,916
Payables & Accruals
- -
- -
- -
ST Debt
1,530
1,293
195
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
12.95%
17.87%
29.19%
Free Cash Flow
688.51%
7.43%
-80.94%
Net Income, GAAP
40.18%
29.9%
19.72%
Sales/Revenue/Turnover
15.37%
26.27%
17.37%
Total Cash Common Dividend
- -
19.05%
12.5%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,245
2,373
2,501
2,571
9,688
2025
2,812
2,913
2,831
2,814
11,371
2026
3,120
2,995
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2.61
2.82
3
3.11
11.54
2025
3.2
2.85
3.66
4.1
13.82
2026
4.14
5.01
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
4
2025
- -
- -
- -
- -
4.5
2026
- -
- -
- -
- -
- -

Company Description

CEO
Hung Yi Li
Full Time Employees
1,228
Sector
Electronic technology
Industry
Semiconductors
Address
No. 208, Ruiguang Road Taipei TP Taiwan 114673
IPO Date
Apr 23, 2012
Business
Scientech Corporation (3583.TW), founded in 1979 and headquartered in Taipei, Taiwan, engages in the research, development, production, sale, and maintenance of process equipment for semiconductors, liquid crystal displays, light-emitting diodes, solar power generation, flat panel displays, and other high-tech industries. The company offers chemical analysis and biotechnology equipment; remote control systems; camera lenses; mask/reticle and semiconductor front-end process equipment; MEMS, compound semiconductor, and LED products; semiconductor advanced packaging and testing equipment including FOPLP tools and laser precision-assisted die bonding systems; flat panel display equipment; 3D printing equipment; wet benches and single wafer wet process equipment; temporary bonding/de-bonding systems (TBDB) and glass recycle tools; baking systems; cleanroom and ESD solutions; and wafer reclamation services. It operates agency business for distributing chemistry, biotechnology, broadcast equipment, data storage, and 3D printer products; self-manufactured equipment divisions; and provides repair, overhaul, and calibration services primarily in Taiwan with global offices in China, Europe, and the United States. Scientech supports mass production for advanced packaging processes such as bumping, fan-out, and chip-on-wafer, while expanding TBDB applications into power IGBT, SiC, laser, and photonic processes. In recent developments, the company showcases enhanced capabilities in wet process equipment for front-end and back-end semiconductors at industry events like Touch Taiwan 2026, alongside continued delivery of products to domestic and international customers in photomask, Micro LED, and biochemical analysis sectors.