Taiwan Microloops Corp.

Taiwan Microloops Corp.

TTWSE:6831
395.50
TWD
-29.50
(-6.94%)
5.81EPS
150.12P/E
58.93BMarket Cap
Nov 18Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
24.96
21.23
21.73
32.54
32.19
30.4
34.07
60.89
62.13
Basic EPS, GAAP
0.71
0.02
1.63
0.97
1.75
1.92
1.8
4.94
5.82
Free Cash Flow per Basic Share
-0.99
-0.88
0.66
-8.15
3.69
0.13
-6.69
-9.4
-4.49
Dividend per Share
- -
- -
- -
- -
- -
0.43
0.75
1.23
- -
Book Value per Share
4.93
6.91
13.73
14.69
19.86
20.9
26.21
41.75
40.67
Tangible Book Value per Share
4.81
6.76
13.62
14.53
19.7
20.71
25.62
41.4
40.38
Basic Weighted Avg Shares
26
29
41
47
50
54
59
61
64
Sales/Revenue/Turnover
654
621
892
1,524
1,608
1,642
2,005
3,703
3,996
Operating Margin (%)
2.54
2.13
8.88
2.52
6.85
6.57
6.33
11.53
11.46
Depreciation Expense
20
29
42
79
67
78
113
136
151
Net Income, GAAP
19
- -
67
46
87
103
106
301
374
Effective Tax Rate (%)
10.96
74.99
- -
- -
20.88
22.87
25.08
13.71
14.48
Profit Margin (%)
2.86
0.08
7.5
2.99
5.44
6.3
5.28
8.12
9.36
Working Capital
170
196
410
343
662
721
673
1,685
1,312
LT Debt
9
64
51
256
239
4
181
151
166
Total Equity
231
323
643
688
1,079
1,135
1,573
2,818
2,745
Return on Invested Capital (%)
- -
0.78
- -
- -
6.9
6.56
6.41
14.18
14.78
Return on Capital (%)
- -
0.4
- -
- -
7.71
8.34
7.17
12.13
14.7
Return on Common Equity (%)
- -
0.17
13.85
6.84
9.9
9.34
7.82
13.69
17.65

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
412
535
541
LT Borrowings
- -
- -
- -
LT Finance Leases
151
177
166
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
68
68
68
Market Capitalization
19,913
26,055
58,928

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,665
3,596
3,774
Cash, Cash Equivalents & STI
1,214
1,457
1,206
Accounts Receivable, Net
1,859
1,641
1,934
Inventories
331
305
443
Total Current Liabilities
1,980
2,192
2,462
Payables & Accruals
- -
- -
- -
ST Debt
412
535
541
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
37.35%
79.2%
Free Cash Flow
- -
-1,464.01%
45.23%
Net Income, GAAP
- -
52.94%
183.82%
Sales/Revenue/Turnover
- -
37.06%
84.7%
Total Cash Common Dividend
- -
- -
69.33%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
448
524
506
527
2,005
2025
567
1,041
1,155
941
3,703
2026
854
1,047
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.64
0.56
0.11
0.49
1.8
2025
0.22
0.42
2.49
1.81
4.94
2026
0.66
1
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
0.75
2025
- -
- -
- -
- -
1.23
2026
- -
- -
- -
- -
- -

Company Description

CEO
Chun Hung Lin
Sector
Electronic technology
Industry
Semiconductors
Address
No.150, Jian 1st Road New Taipei Taiwan 235
IPO Date
Nov 25, 2025
Business
Taiwan Microloops Corp. is a Taiwan-based company engaged in the research, development, design, manufacture, and sale of thermal dissipation components and cooling modules. Its core products include vapor chambers, heat pipes, heat sinks, heat distribution panels, water cooling panels, liquid cooling systems, and ultra-thin thermal panels. These products serve multiple markets such as information technology, data centers, gaming, 5G mobile and base stations, network communications equipment, smartphones, and automotive autopilot systems and peripherals. The company provides comprehensive thermal solution planning, design, and manufacturing services to global top-tier clients. Founded in 2003 and headquartered in New Taipei City, Taiwan, Taiwan Microloops operates manufacturing facilities including a modern center in Huizhou, Guangdong, China. The company leverages advanced manufacturing automation and AI-based quality control systems to ensure high product consistency and performance. Taiwan Microloops integrates active and passive cooling technologies and offers hybrid thermal management strategies tailored to customer requirements, featuring intelligent thermal management with embedded temperature sensors for device compatibility and efficiency. In recent developments, Taiwan Microloops has expanded its product portfolio to include system-level thermal modules such as 3D vapor chambers, server liquid cooling, and immersion cooling systems. The company sees robust demand driven by AI computing and server applications, forecasting a 20% revenue increase in 2024 supported by strong growth in these segments. Taiwan Microloops celebrated its listing on the Taiwan Stock Exchange in November 2025, marking a strategic milestone in its corporate development. The company primarily serves markets in Taiwan, China, and other international regions, targeting customers in industrial electronics, telecommunications, data centers, and electric vehicles. Taiwan Microloops maintains a strong R&D focus to continuously innovate in thermal management technologies while supporting its global customer network with integrated thermal solutions. Overall, Taiwan Microloops Corp. is a leading provider of advanced thermal dissipation and cooling technologies, with a highly integrated business model spanning from core component manufacturing to system-level solutions, anchored by robust R&D, manufacturing excellence, and recent expansion into AI and immersion cooling markets. Its latest strategic initiatives underscore steady growth and enhanced market presence in the electronic equipment and parts sector under ticker 6831.TWO.