1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Electronic components
Complex Micro Interconnection Co., Ltd.

Complex Micro Interconnection Co., Ltd.

TTWSE:6835
31.80
TWD
-0.30
(-0.93%)
0.29EPS
116.66P/E
2.27BMarket Cap
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
57.74
42.9
45.27
46.8
44.6
33.22
36.84
36.11
34.33
Basic EPS, GAAP
5.27
2.36
2.99
2.72
4.05
3.57
4.06
0.97
0.3
Free Cash Flow per Basic Share
-1.28
6.21
2.64
-3.79
6.85
4.53
5.16
-8.38
-5.05
Dividend per Share
3
2.33
1.71
2.02
1.97
2
2
2.01
- -
Book Value per Share
11.54
14.14
16.58
19.76
23.25
24.6
28.59
28.18
26.77
Tangible Book Value per Share
11.41
14.05
16.51
19.68
23.2
24.51
28.51
27.96
26.58
Basic Weighted Avg Shares
36
54
55
60
61
66
66
66
67
Sales/Revenue/Turnover
2,086
2,324
2,483
2,785
2,724
2,198
2,438
2,380
2,306
Operating Margin (%)
8.96
8.39
10.02
7.07
7.85
11.73
11.17
5.93
0.68
Depreciation Expense
41
50
46
49
63
58
46
38
41
Net Income, GAAP
190
128
164
162
247
236
269
64
20
Effective Tax Rate (%)
23.44
29.55
25.53
13.68
20.87
25.95
26.38
21.02
18.29
Profit Margin (%)
9.13
5.51
6.59
5.82
9.07
10.74
11.02
2.68
0.86
Working Capital
439
599
591
649
1,273
1,354
2,219
1,881
1,682
LT Debt
5
26
- -
133
- -
51
670
1,041
1,003
Total Equity
695
851
998
1,189
1,538
1,628
1,896
1,856
1,763
Return on Invested Capital (%)
- -
10.87
14.31
10.96
9.19
9.39
7.87
3.58
0.43
Return on Capital (%)
- -
9.89
13.27
11.27
14.13
12.19
11.06
2.75
1.48
Return on Common Equity (%)
- -
16.58
17.71
14.83
18.12
14.92
15.27
3.41
1.15

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
329
297
339
LT Borrowings
1,040
1,021
1,002
LT Finance Leases
1
1
1
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
66
66
66
Market Capitalization
2,544
2,399
2,274

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,070
3,092
3,040
Cash, Cash Equivalents & STI
1,711
1,676
1,622
Accounts Receivable, Net
868
890
920
Inventories
345
388
402
Total Current Liabilities
1,189
1,313
1,358
Payables & Accruals
- -
- -
- -
ST Debt
329
297
339
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
13.75%
-2.07%
Free Cash Flow
- -
-163.43%
-261.55%
Net Income, GAAP
- -
-3.09%
-76.24%
Sales/Revenue/Turnover
- -
-0.16%
-2.38%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
575
595
641
626
2,438
2025
599
649
610
522
2,380
2026
577
597
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.96
0.98
0.44
1.68
4.06
2025
0.89
-0.46
0.49
0.04
0.97
2026
0.05
-0.28
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2
2025
- -
- -
- -
- -
2.01
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Shu Min Tu
Full Time Employees
742
Sector
Electronic technology
Industry
Electronic components
Address
No. 4, Lane 130, Minquan Road New Taipei TP Taiwan 23141
IPO Date
Nov 10, 2022
Website
cmi.com.tw
Similar Companies
Corning Incorporated (NYSE:GLW)
Taiyo Yuden Co., Ltd. (TSE:6976)
Celestica, Inc. (NYSE:CLS)
Amphenol Corporation (NYSE:APH)
IBIDEN CO., LTD. (TSE:4062)
Vicor Corporation (NASDAQ:VICR)
Business
Complex Micro Interconnection Co., Ltd. engages primarily in the manufacture and sale of electronic connectors and related interconnection products used across various electronic applications. Its core product portfolio includes high-density micro connectors, fine-pitch connectors, high-speed connectors, flexible printed circuits (FPCs), and customized interconnection solutions tailored for the electronics and communications industries. The company serves diverse markets including consumer electronics, telecommunications, automotive electronics, and industrial equipment sectors. Established in 1994 and headquartered in Taiwan, Complex Micro Interconnection operates globally with a focus on Asian, American, and European markets. In terms of recent major developments, Complex Micro Interconnection has notably expanded its technological capabilities and product offerings within the past two years to support emerging demands in high-speed data transmission and miniaturization trends in electronics. The company has also pursued strategic collaborations with key industry players to enhance its R&D and manufacturing efficiencies, reinforcing its competitive position in micro connector technologies. Furthermore, it has invested in upgrading production facilities to meet higher quality and volume requirements driven by rapid growth in 5G, automotive electronics, and other high-tech applications. These efforts underscore the company’s focus on innovation and operational excellence to capture expanding opportunities in the global electronic interconnection market. Complex Micro Interconnection is positioned within the electronic components industry, specifically in the interconnection device segment. Its customers primarily consist of original equipment manufacturers (OEMs) and original design manufacturers (ODMs) requiring advanced micro connector solutions. The company operates subsidiaries and has a parent company relationship under the broader corporate group based in Taiwan. Overall, Complex Micro Interconnection Co., Ltd. stands as a specialized manufacturer providing technologically advanced electronic connector solutions with a recent strategic emphasis on innovation, partnerships, and capacity expansion to support evolving industry requirements.