Eternal Precision Mechanics Co., Ltd.
TTWSE:7795409.50
TWD
-15.50
(-3.65%)
ISIN
TW0007795007
Return %
Stock
S&P 500
1Y
- -
14.20
3Y
- -
81.12
5Y
- -
68.34
Capital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.Company Description
- CEO
- Iwata Kazutoshi
- Full Time Employees
- 120
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- No. 30, Yumin Street Kaohsiung City KHH Taiwan
- IPO Date
- Jan 16, 2026
- Website
- eternal-epm.com
- Similar Companies
- Business
- Eternal Precision Mechanics Co., Ltd. is a Kaohsiung, Taiwan-based manufacturer and supplier of high-end semiconductor packaging equipment, specializing in vacuum laminators for ABF substrates and related advanced packaging processes. Main products and services - Vacuum laminators for ABF substrates: fully automated and semi-automated systems designed for advanced packaging workflows. - Ancillary equipment and integration solutions: process interfaces, film cutting and pre-laminating components, and modular equipment suitable for back-end packaging lines. - Custom process development and equipment validation: collaborative services that tailor equipment capabilities to specific ABF, FC-BGA, FC-CSP, PLP, and other advanced packaging applications. - After-sales support and service packages: spare parts, on-site installation, commissioning, preventive maintenance, and technical support to ensure uptime and performance. - Equipment-plus-process services model: end-to-end offerings combining hardware with process development, optimization, and mass-production support. Latest major company changes - Strategic partnerships and ecosystem development: enters alliances with material suppliers and key process developers to expand material compatibility testing and new process validations for ABF and advanced packaging technologies. - Market expansion and regional service footprint: broadens service locations in major semiconductor hubs (including markets in China and Japan) to provide real-time technical support and faster response times. - Company formation and corporate restructuring: established as a standalone entity with global aspirations, augmenting its parent group’s capabilities in high-precision back-end packaging equipment. - New product validations and process integration offerings: accelerates deployment of fully automated and semi-automated laminator systems with enhanced compatibility for FC-BGA, FC-CSP, PLP, and related packaging architectures. - Revenue and customer base growth initiatives: focuses on securing long-term collaboration with leading substrate and packaging manufacturers through an equipment-plus-service model that emphasizes process development and mass-production readiness. Additional context - Industry and segments: semiconductor equipment, advanced packaging, back-end process tooling. - Target markets: semiconductor manufacturers and packaging houses globally, with emphasis on AI, high-performance computing, 5G, and automotive electronics applications. - Geographic operations: headquarters in Kaohsiung, Taiwan; service and support presence in major semiconductor ecosystems across Asia with international shipments and customer support. - Founding year and headquarters: founded in 2011; headquarters located in Kaohsiung, Taiwan. - Subsidiaries/parent: operates as a specialized equipment unit within the Eternal Materials ecosystem, leveraging collaboration with group entities for process and materials integration.