- CEO
- Thomas Huang
- Full Time Employees
- 2,390
- Sector
- Producer manufacturing
- Industry
- Industrial machinery
- Address
- No.16, East 7th Street Kaohsiung City KH Taiwan 811
- IPO Date
- Feb 20, 2003
- Business
- Chang Wah Electromaterials Inc. (8070.TW), founded in 1989 and headquartered in Kaohsiung City, Taiwan, serves as a leading distributor of semiconductor packaging materials, equipment, and related components, primarily acting as an agent for renowned manufacturers including Sumitomo Bakelite and Sumitomo Metal Mining Group; its core offerings encompass epoxy molding compounds (EME), lead frames, sealing resins, laminated substrates, flip chip chip-scale package (FCCSP) and flip chip ball grid array (FCBGA) substrates, release films, cover and UV tapes, low coefficient of thermal expansion (CTE) cores and prepregs, dummy and monitor wafers, conductive and non-conductive silver pastes, automatic molding and trim-and-form equipment, fluid dispensing systems, electromagnetic compatibility (EMC) LED lead frames, tape chip-on-film (COF) substrates, light guide plates, fine-pitch flexible printed circuits (FPCs), and solar power systems, with products supporting applications in consumer electronics, network communications, telecommunications, mobile devices, automotive, optoelectronics including thin-film transistor liquid crystal displays (TFT-LCDs), light-emitting diodes (LEDs) and miniLEDs, PC peripherals, and energy sectors; the company operates principally in Taiwan and across Asia, bolstered by subsidiaries such as Chang Wah Technology Co., Ltd. for LED lead frames and JMC Electronics for advanced packaging substrates, while also engaging in import-export trading, leasing, manufacturing, and retailing of electrical appliances, telecommunications equipment, mechanical parts, synthetic resins, and electronic materials. In recent developments, Chang Wah Electromaterials launched a new joint venture plant with Sumitomo Bakelite in Kaohsiung in early 2024 to expand epoxy molding compound production capacity for semiconductor packaging, anticipates revenue contributions from this facility starting in 2025 alongside sample deliveries in late 2024, transitions toward panel-level fan-out packaging (FOPLP) from wafer-level processes with its subsidiary Chang Wah Technology to target high-margin miniLED solutions through 2025, collaborates with JMC Electronics on rollable substrates for microLED applications entering mass production in the third quarter of 2024, and approved a cash dividend of NT$0.71 per share for the first half of 2025 in November 2025, surpassing the prior year's distribution amid 12% year-over-year revenue growth to NT$14,241 million for the first nine months of 2025 driven by demand in EME and lead frames.