1. Taiwan Stocks

  2. •

    Producer manufacturing

  3. •

    Industrial machinery
Chenbro Micom Co., Ltd.

Chenbro Micom Co., Ltd.

TTWSE:8210
764.00
TWD
-38.00
(-4.74%)
161.04BMarket Cap
Nov 05Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
31.02
37.36
37.08
43.52
46.05
54.46
57.09
63.02
78.63
87.94
93.54
120.51
179.7
- -
Basic EPS, GAAP
2.85
4.52
4.22
5.01
3.8
5.37
7.62
8.16
5.62
8.32
9.03
16.05
29.06
- -
Free Cash Flow per Basic Share
-2.23
4.38
1.9
2.84
1.2
6.5
8.41
-9.32
-13.09
-3.36
18.95
15.8
17.13
- -
Dividend per Share
2.5
2.5
3
2.6
3
3
4
4.6
4.04
3.02
4.01
5.01
7.41
- -
Book Value per Share
19.27
21.71
22.54
23.86
24.38
26.44
29.4
32.49
34.42
40.68
45.83
59.3
86.86
99.51
Tangible Book Value per Share
19.2
21.6
22.45
23.78
24.32
26.34
29.31
32.39
34.26
40.5
45.25
58.77
86.4
99.03
Basic Weighted Avg Shares
120
120
120
120
120
120
120
120
120
120
120
120
122
124
Sales/Revenue/Turnover
3,724
4,473
4,439
5,210
5,514
6,521
6,835
7,545
9,423
10,558
11,247
14,517
22,001
- -
Operating Margin (%)
11.3
14.58
13.36
14.94
12.39
12.64
16.51
12.78
9.37
10.91
12.9
17.26
21.7
- -
Depreciation Expense
126
135
137
115
140
191
201
222
338
377
298
346
387
- -
Net Income, GAAP
342
541
505
600
455
642
912
977
673
999
1,085
1,934
3,558
- -
Effective Tax Rate (%)
24.86
23.75
24.07
26.47
25.97
26.23
20.93
19.08
24.15
24.89
22.56
24.48
24.24
- -
Profit Margin (%)
9.18
12.1
11.37
11.52
8.26
9.85
13.34
12.95
7.14
9.46
9.65
13.32
16.17
- -
Working Capital
1,185
1,411
1,436
1,328
1,267
1,259
1,670
613
1,448
2,235
2,905
3,953
5,670
6,923
LT Debt
157
161
160
150
132
129
120
131
1,983
2,662
2,704
2,674
1,357
2,601
Total Equity
2,307
2,599
2,708
2,857
2,919
3,165
3,520
3,950
4,177
4,937
5,578
7,264
11,077
12,713
Return on Invested Capital (%)
12.65
17.1
14.68
18.35
15.26
17.28
23.56
17.43
10.73
10.22
12.06
18.39
27.74
- -
Return on Capital (%)
14.12
19.45
17.11
19.86
14.31
18.77
25.26
22.85
11.18
12.43
12.32
19.49
28.17
- -
Return on Common Equity (%)
15.16
22.06
19.03
21.57
15.77
21.11
27.28
26.23
16.64
22.04
20.81
30.45
39.41
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,598
1,896
2,058
LT Borrowings
1,332
2,658
2,575
LT Finance Leases
25
26
26
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
125
125
125
Market Capitalization
125,946
108,652
161,035

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
16,583
19,386
20,928
Cash, Cash Equivalents & STI
5,912
8,576
9,034
Accounts Receivable, Net
6,424
6,939
8,005
Inventories
3,925
3,547
3,504
Total Current Liabilities
10,914
10,947
14,005
Payables & Accruals
- -
- -
- -
ST Debt
1,598
1,896
2,058
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
15.92%
23.93%
52.49%
Free Cash Flow
-45.34%
-141.05%
10.2%
Net Income, GAAP
27.3%
37.63%
84.03%
Sales/Revenue/Turnover
18.07%
24.82%
51.55%
Total Cash Common Dividend
- -
14.27%
50.5%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
2,773
3,607
4,272
3,865
14,517
2025
4,154
5,443
- -
6,740
22,001
2026
7,107
7,821
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
3.03
3.77
5.34
3.91
16.05
2025
5.53
6.87
- -
8.61
29.06
2026
10.73
11.1
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
5.01
2025
- -
- -
- -
- -
7.41
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Ya Nan Chen
Full Time Employees
3,334
Sector
Producer manufacturing
Industry
Industrial machinery
Address
No. 558, Zhongyuan Road New Taipei TPE Taiwan 242030
IPO Date
Nov 20, 2003
Website
chenbro.com
Similar Companies
Applied Materials, Inc. (NASDAQ:AMAT)
Oklo Inc. (NYSE:OKLO)
Lam Research Corporation (NASDAQ:LRCX)
Tokyo Electron Ltd. (TSE:8035)
Welspun Corp Limited (NSE:WELCORP)
Symbotic Inc. (NASDAQ:SYM)
Business
Chenbro Micom Co., Ltd. engages in the research and development, design, manufacture, processing, and trading of computer peripherals and system expendables globally, with operations in the United States, China, Taiwan, Singapore, Malaysia, and other international markets. The company specializes in manufacturing barebone servers; rackmount, tower server, and PC chassis products; and storage expansion kits. It also provides OEM, ODM, and JDM services, and is involved in software design activities related to computer products and peripherals. Founded in 1983 and headquartered in New Taipei City, Taiwan, Chenbro serves industries focused on cloud computing, 5G, artificial intelligence (AI), and AIoT through integrated enclosure solutions. Recently, Chenbro has expanded its global manufacturing footprint with a new production plant in Senai Airport City, Malaysia, marking its maiden investment in the ASEAN region to serve Southeast Asia more effectively. This expansion aligns with its strategy to support increasing demand for AI and ICT infrastructure and to diversify its manufacturing base amid geopolitical challenges. In 2024, Chenbro reported a 29% revenue increase to approximately NT$145.2 billion (US$4.41 billion), driven by robust demand for AI server enclosures. The company has also co-developed cloud server products and advanced AI server enclosure solutions in collaboration with leading technology partners from the U.S. and Taiwan, highlighting its commitment to innovation in high-speed computing and storage server modules. Chenbro markets rack-mounted edge computing server chassis, tower modular high-speed computing storage servers, high-speed storage server modules, and rack-mounted modular barebone servers worldwide. Its latest strategic initiatives include creating global localized production with lean technology capabilities and accelerating deployment in key international industrial clusters. With over 1,000 employees, Chenbro stands as a leading provider of mechanical and system solutions for the cloud industry, focusing on scalable, high-performance infrastructure products designed for data centers and AI applications.