United Microelectronics Corporation
New York Stock ExchangeCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Jason S. Wang
- Full Time Employees
- 20,000
- Sector
- Technology
- Industry
- Semiconductors
- Address
- Hsinchu Science Park Hsinchu City Taiwan, Province of China 30078
- IPO Date
- Sep 19, 2000
- CIK
- 0001033767
- Website
- umc.com
- Similar Companies
- Business
- United Microelectronics Corporation (UMC; NYSE: UMC, TWSE: 2303) operates as a leading global semiconductor foundry, providing high-quality integrated circuit (IC) fabrication services focused on logic and specialty technologies including Logic/Mixed-Signal; embedded High-Voltage (eHV) such as 80eHV TDDI, 40eHV and 28eHV TDDI; embedded Non-Volatile-Memory (eNVM); RFSOI; BCD; RF Technologies; CMOS Image Sensors (CIS); and MEMS processes, serving diverse sectors like AI, automotive, connectivity, consumer electronics, IoT, 5G, edge-computing and autonomous vehicles with wafer manufacturing on 12-inch, 8-inch and 6-inch platforms; design enablement; automotive and IoT solutions; venture capital and marketing support; consulting and advisory; energy technical services; solar engineering integrated design; research and development; and insurance services. Founded in 1980 as Taiwan's first semiconductor company spun off from state-owned ITRI and headquartered in Hsinchu Science Park, Hsinchu City, Taiwan, UMC maintains 12 fabs in production across Taiwan, Singapore, Japan and China with combined capacity exceeding 400,000 12-inch equivalent wafers per month, all certified to IATF 16949 automotive standards, plus sales offices in the United States, Europe, China, Japan, Korea and Singapore supporting approximately 20,000 employees worldwide and customers encompassing fabless semiconductor firms, integrated device manufacturers and system companies primarily in Asia-Pacific (67% of revenue), North America (20%), Europe (8%) and Japan (5%). Recent developments include the 2025 grand opening of expanded 12-inch Fab 12i in Singapore equipped for 22nm and 28nm production targeting smartphone display chips, IoT memory and connectivity applications, creating 700 local jobs; acquisition of production software from Synopsys International Limited for NT$534 million and from Siemens Electronic Design Automation Japan for NT$347 million to enhance manufacturing efficiency; the 2024 announcement of 12nm process collaboration with Intel; 2019 acquisition of MIFS (now USJC) 12-inch fab in Japan; and a 2025 pact with Polar to explore U.S. production of eight-inch wafers at its Minnesota facility amid rising demand.
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