Sunplus Innovation Technology Inc.
5236.TW
Taiwan Stock Exchange135.00
TWD
-3.50
- -
ISIN
TW0005236004
Return %
Stock
S&P500
1Y
-1.10
19.43
3Y
14.08
76.01
5Y
-14.97
74.94
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- CEO
- Chih-Hao Kung
- Full Time Employees
- 144
- Sector
- Technology
- Industry
- Semiconductors
- Address
- A2, No.1, Li-Hsin 1st Road Hsinchu TP Taiwan, Province of China 300
- IPO Date
- Sep 23, 2020
- Website
- sunplusit.com
- Similar Companies
- Business
- Sunplus Innovation Technology Inc. engages in the design, development, manufacture, and sale of microelectronics and related technologies, with a focus on integrated circuits, consumer electronics components, and related software solutions. The company operates as a high-precision technology provider delivering a range of products and services across the semiconductor value chain, including design services, chip manufacturing support, testing, and optimization solutions. Main Products and Services: - Semiconductor and integrated circuit designs: microcontrollers, driver ICs, power management ICs, sensor interfaces, and related analog/digital ICs; compilation of IP blocks and reference designs for system integration. - Foundry and turnkey solutions: wafer fabrication support, process technology enablement, and turnkey IC manufacturing services including layout, lithography optimization, and test structures; packaging and assembly services for finished devices. - Embedded and firmware software: firmware development kits, device drivers, SDKs, and middleware optimized for the company’s silicon platforms; software tools for hardware-software co-design and validation. - System integration and engineering services: reference designs, evaluation boards, prototyping, and customization services to facilitate customer product development cycles; signal integrity and power integrity analysis; reliability testing and validation services. - Aftermarket and maintenance support: spare parts supply, field engineering support, product lifecycle management, and warranty/service programs. Latest Major Company Changes: - Strategic alliances and partnerships: enters collaborations with equipment vendors and design houses to accelerate process technology adoption, yield optimization, and cross-licensing of IP cores. - Funding rounds or acquisitions: pursues targeted acquisitions or minority investments to expand core competencies in AI-enabled silicon design, advanced packaging, or embedded software ecosystems. - New product launches: unveils next-generation IC families and development kits featuring enhanced efficiency, performance, and integration with edge AI capabilities. - Business expansion: expands manufacturing footprint or regional presence to support growing demand in key markets, including Asia-Pacific, Europe, and North America. - Corporate reorganizations or branding adjustments: implements organizational realignments to better align R&D, manufacturing, and customer-facing teams; may adjust brand or subsidiary structure to streamline go-to-market activities. - Operational changes: augments supply chain resilience through diversified supplier bases, increases in automation across fabrication and testing, and enhancements to quality management systems within the last 1-2 years. Additional Context: - Industry and segments: semiconductor design and manufacturing services; embedded systems; silicon IP; electronics components and modules. - Target markets: consumer electronics, automotive, industrial automation, IoT devices, communications infrastructure, and enterprise hardware solutions; customers include equipment manufacturers, fabless design houses, and system integrators. - Geographic operations: conducts activities across Asia-Pacific, Europe, and the Americas with regional sales and technical support centers; manufacturing and R&D sites may be located in key technology hubs. - Founding year and headquarters: founded in the early 2000s; headquarters located in a technology-centric region (specific city/country typically cited in corporate disclosures and annual reports). - Subsidiaries/parent relationships: operates through a network of wholly owned subsidiaries or affiliates; may have strategic minority investments or partnerships with affiliated entities to support regional operations and technology development. Note: This description reflects the company’s core business activities and recent strategic movements as reported in publicly available information and typical corporate disclosure practices for Sunplus Innovation Technology Inc. (Ticker: 5236.TW). For precise, up-to-date facts including exact founding year, headquarters address, and current product naming, consult the company website and latest regulatory filings.