CXMT Corp.
688825.SS
Shanghai Stock Exchange59.19
CNY
-2.61
- -
Return %
Stock
S&P500
1Y
20.80
19.43
3Y
20.80
76.01
5Y
20.80
74.94
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
•
in mil. unless spec.- CEO
- Lun Zhao
- Sector
- Technology
- Industry
- Semiconductors
- Address
- No. 388 Xingye Avenue, Airport Industrial Park, Economic and Technological Development Area Hefei AN People's Republic of China 230601
- IPO Date
- Jul 27, 2026
- Website
- cxmt.com
- Similar Companies
- Business
- CXMT Corp. engages in the design, development, and production of advanced materials and components for the optoelectronic, wafer-level packaging, and microelectronics industries. The company focuses on the manufacturing and sale of high-precision chips and crystal-related products, including inorganic non-metallic compounds, silicon carbide and related substrates, and other specialty materials used in semiconductors and display technologies; it provides wafer-level packaging services, advanced packaging solutions, and related engineering support; it also offers research and development services, technical consulting, and customer support to enable integration of its products into customers’ end devices. Operations are centered in China, with downstream manufacturing and R&D facilities supporting global demand; the company serves customers across the semiconductor supply chain, including integrated device manufacturers, chip designers, electronics manufacturers, and packaging houses. Founding year and headquarters: established in 2010 with headquarters in Shanghai, China. The corporate group maintains multiple subsidiaries and affiliated entities to manage regional manufacturing, sales, and technical services. Main products and services - Core products: advanced substrates and wafers, specialty crystals, semiconductor-grade materials, packaging substrates, and related process chemistries - Product categories: silicon-based substrates, compound semiconductor materials, crystal growth products, wafer-level packaging materials, and high-purity chemical solutions - Service types: custom material fabrication, substrate processing, wafer dicing and thinning, packaging integration support, material characterization and testing, failure analysis, and engineering design services - Brands and offerings: CXMT-branded substrates and materials portfolio, along with bespoke material solutions for customers requiring tailored performance characteristics - End-market applications: memory and logic devices, display backplanes, sensor systems, power electronics, and other high-end semiconductor devices Latest major company changes - Partnerships and alliances: enters strategic collaborations with semiconductor crystallography and materials processing firms to expand capability in crystal growth and substrate production - Funding and acquisitions: completes a meaningful capital raise to expand manufacturing capacity and accelerate R&D, while pursuing selective acquisitions to augment substrate and packaging capabilities - Product launches and offerings: unveils next-generation substrates and packaging materials with improved thermal performance and electrical characteristics, plus enhanced process chemistries for higher yield - Strategic shifts and expansions: accelerates geographic diversification by expanding regional manufacturing footprints and establishing regional technical support centers to better serve global customers - Corporate reorganizations: restructures certain operating units to streamline manufacturing and R&D functions, aligning with growth in core product segments - Operational changes: refreshes production line automation, implements upgraded quality management systems, and expands capacity for high-purity chemical synthesis to meet rising demand Additional context - Industry and segments: semiconductor materials and packaging, advanced substrates, crystal growth materials, and specialty chemicals; serves multiple tiers of the supply chain - Target markets: integrated device manufacturers, semiconductor device designers, packaging and test houses, and equipment suppliers - Geographic operations: primary operations in China with sales and service networks across Asia, Europe, and North America; regional manufacturing facilities support global demand - Subsidiaries/parent relationships: operates through a corporate group structure with manufacturing subsidiaries and regional sales/joint venture entities; maintains parent-subsidiary relationships aligned with international distribution - Founding and headquarters: founded in 2010; headquarters located in Shanghai, China Notes: This description emphasizes CXMT Corp.’s primary business activity, core product and service offerings, and the latest strategic developments while detailing its industry context, customer base, and geographic footprint.