ASMPT Limited
ASMVY
Other OTC73.91
USD
-4.11
- -
CIK
0001447945
ISIN
US00212G1085
CUSIP
00212G108
Return %
Stock
S&P500
1Y
258.44
24.50
3Y
146.94
70.74
5Y
92.47
77.76
Capital Structure
FRC
•
in mil. unless spec.Working Capital
FRC
•
in mil. unless spec.Growth Rates
FRC
•
in mil. unless spec.Quarterly Revenue
FRC
•
in mil. unless spec.Quarterly Earnings Per Share
FRC
•
in mil. unless spec.Quarterly Dividends Per Share
FRC
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in mil. unless spec.- CEO
- Cher Tat Ng
- Full Time Employees
- 10,600
- Sector
- Technology
- Industry
- Semiconductors
- Address
- 8 Cheung Fai Road Tsing Yi Hong Kong 768924
- IPO Date
- Mar 13, 2013
- CIK
- 0001447945
- Website
- asmpacific.com
- Similar Companies
- Business
- ASMPT Limited (HKEX: 0522; OTC: ASMVY), a leading global supplier of hardware, software and service solutions for semiconductor assembly and packaging as well as surface mount technology (SMT) in the electronics manufacturing industry, operates through two primary segments: Semiconductor (SEMI) Solutions and SMT Solutions, complemented by its wholly-owned subsidiary Critical Manufacturing for manufacturing execution systems (MES); SEMI Solutions encompass advanced packaging and mainstream equipment including thermo-compression bonding (TCB) tools such as chip-to-substrate (C2S), chip-on-wafer and high-bandwidth memory (HBM) applications, die bonding via AMICRA, laser dicing and grooving through ALSI, deposition systems from NEXX and AEI, and integrated solutions for microelectronics, photonics and optoelectronics; SMT Solutions provide best-in-class printing (DEK), placement (SIPLACE), inspection, storage, software and process support products for intelligent factory automation; Critical Manufacturing delivers IoT-enabled MES platforms. Founded in 1975 as the Asian marketing arm of ASM International N.V. and formerly known as ASM Pacific Technology Limited until its rebranding to ASMPT Limited in June 2022, the company is headquartered in Singapore with global operations serving customers in electronics, mobile communications, computing, automotive, industrial and LED display markets across regions including Asia, Europe and the United States. Recent developments include securing orders for 19 chip-to-substrate TCB tools in December 2025 from a major OSAT partner supporting AI chip production for high-volume logic applications, reinforcing its position as the sole supplier and process of record with the largest worldwide TCB installed base exceeding 500 tools; ongoing AI-driven momentum with strong bookings in advanced packaging, HBM4, mainstream power management, systems-in-package (SiP) for RF modules and chip assembly for smartphones; and strategic collaborations such as deepened partnership with IBM on chiplet packaging bonding methods, alongside robust 2025 quarterly results highlighting expanded TCB total addressable market projections beyond US$1 billion by 2027 fueled by AI and high-performance computing investments.
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