1. South Korea Stocks

  2. •

    Electronic technology

  3. •

    Electronic production equipment
H&S HighTech Corp.

H&S HighTech Corp.

KKRX:044990
10,350.00
KRW
-90.00
(-0.86%)
90.97BMarket Cap
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
6,417.6
4,529.31
4,544.62
5,418.46
5,211.36
6,074.57
10,988.17
11,643.83
12,956.3
10,736.18
10,047.77
11,200.08
- -
Basic EPS, GAAP
505
-122
-25
-377
-425
-256
280
1,390
2,576
4,017
1,935
1,216
- -
Free Cash Flow per Basic Share
1,555.3
259.7
-94.49
-1,574.84
-185.06
-672.74
147.9
146.84
4,111.38
2,286.76
1,660.03
-699.37
- -
Dividend per Share
141.38
149.8
- -
99.88
90.6
- -
- -
- -
100
199.99
197.96
264.58
- -
Book Value per Share
5,153.22
4,875.87
4,804.75
4,253.07
3,804.49
3,549.9
3,893.2
5,350.51
7,809.79
11,599
13,704.52
14,316.71
14,845.88
Tangible Book Value per Share
4,113.88
4,000.01
4,112.95
3,718.82
3,407.82
3,152.97
3,494.33
4,951.32
7,412.22
11,197.94
13,314.77
13,821.96
14,350.64
Basic Weighted Avg Shares
7
7
7
8
8
8
8
8
8
8
8
7
7
Sales/Revenue/Turnover
45,513
32,729
33,543
40,702
39,113
45,645
82,415
87,344
97,203
80,552
76,161
81,887
- -
Operating Margin (%)
13.69
-4.92
-3.51
-6.67
-11.09
-6
4.2
11.53
22.22
17.2
17.56
11.8
- -
Depreciation Expense
3,296
3,409
2,737
3,677
3,462
2,279
2,335
2,497
2,215
3,682
4,934
5,486
- -
Net Income, GAAP
3,581
-882
-185
-2,832
-3,190
-1,924
2,100
10,427
19,326
30,139
14,667
8,891
- -
Effective Tax Rate (%)
9.88
- -
- -
- -
- -
- -
38.35
9.01
9.43
12.11
9.72
- -
- -
Profit Margin (%)
7.87
-2.69
-0.55
-6.96
-8.16
-4.21
2.55
11.94
19.88
37.42
19.26
10.86
- -
Working Capital
17,228
18,392
18,157
10,540
9,165
8,024
10,281
25,664
30,243
53,246
73,807
60,306
63,453
LT Debt
- -
- -
- -
- -
- -
14
- -
2,702
168
118
284
244
152
Total Equity
37,187
35,186
36,048
32,507
28,307
25,510
27,006
37,791
58,594
87,023
106,041
102,872
106,674
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
5.89
21.71
34.4
15.85
12.34
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
7.84
26.22
35.05
40.17
15.15
- -
- -
Return on Common Equity (%)
- -
-2.44
-0.52
-8.33
-10.55
-6.97
7.52
30.07
39.15
41.39
15.19
8.51
- -

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
4,299
4,283
4,306
LT Borrowings
- -
- -
- -
LT Finance Leases
244
175
152
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
7
7
7
Market Capitalization
109,937
104,332
90,967

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
70,807
77,096
78,274
Cash, Cash Equivalents & STI
36,445
40,059
40,303
Accounts Receivable, Net
20,624
21,507
22,533
Inventories
11,660
12,527
13,305
Total Current Liabilities
10,501
15,051
14,820
Payables & Accruals
- -
- -
- -
ST Debt
4,299
4,283
4,306
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
13.81%
32.47%
-2.99%
Free Cash Flow
400.06%
497.58%
-140.64%
Net Income, GAAP
156.65%
89.41%
-39.38%
Sales/Revenue/Turnover
11.94%
0.44%
7.52%
Total Cash Common Dividend
- -
- -
28.92%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
17,909
17,122
- -
- -
76,161
2025
20,268
16,472
- -
21,622
81,887
2026
22,156
22,826
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
509
363
- -
- -
1,935
2025
481
-275
- -
401
1,216
2026
498.52
213
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
197.96
2025
255.33
- -
- -
- -
264.58
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Jung-Hee Kim
Full Time Employees
188
Sector
Electronic technology
Industry
Electronic production equipment
Address
Daejeon South Korea
IPO Date
Dec 10, 2015
Website
hnshightech.com
Similar Companies
Bloom Energy Corporation (NYSE:BE)
AXT Inc (NASDAQ:AXTI)
Vertiv Holdings, LLC (NYSE:VRT)
Aehr Test Systems (NASDAQ:AEHR)
Teradyne, Inc. (NASDAQ:TER)
Dixon Technologies (India) Ltd. (NSE:DIXON)
Business
H&S HighTech Corp. is a South Korea-based electronic materials and components manufacturing company that specializes in advanced bonding solutions and frequency control devices for the global display, semiconductor, and telecommunications industries. Founded in 1995 and headquartered in Daejeon, South Korea, the company operates primarily through two core business divisions: Materials and Electronic Components. Its Materials Division develops and manufactures anisotropic conductive films (ACF) used for electrical interconnects and mechanical bonding in flat panel displays, organic light-emitting diode (OLED) screens, liquid crystal display (LCD) panels, printed circuit boards (PCBs), touch screen panels, and compact camera modules via Chip-on-Glass (COG), Chip-on-Film (COF), and Film-on-Glass (FOG) applications; advanced semiconductor packaging bonding films, including solder ACF and non-conductive films (NCF) for 2.5D and 3D multi-chip architectures; micro-LED interconnection materials; optical clear resins (OCR); and ultraviolet-curable functional coatings. Its Electronic Components Division produces quartz crystal frequency control solutions, including quartz crystal units (resonators); clock oscillators; voltage-controlled crystal oscillators (VCXO); temperature-compensated crystal oscillators (TCXO); microelectromechanical systems (MEMS) oscillators; and specialized precision timing devices utilized in automotive electronics, smart appliances, industrial equipment, and telecommunications infrastructure. H&S HighTech Corp. supplies its products to leading display panel fabricators, camera module assemblers, automotive component manufacturers, and consumer electronics original equipment manufacturers (OEMs) across South Korea, China, Taiwan, and other international markets. In recent corporate developments, the company completed a strategic uplisting by transferring its shares from the KONEX market to the KOSDAQ market of the Korea Exchange in October 2024 to fund ongoing research and development and expand production capacity. Furthermore, the company has expanded its commercial portfolio into high-margin OLED-grade conductive adhesives, ultra-fine-pitch bonding materials for next-generation semiconductor packaging, and automotive-grade timing components to accelerate revenue diversification and strengthen its global market position.