- CEO
- Ki-Hwan Park
- Full Time Employees
- 246
- Sector
- Electronic technology
- Industry
- Electronic production equipment
- Address
- Yongin-si South Korea
- IPO Date
- Nov 14, 2003
- Business
- Rorze Systems Corporation is a South Korea-based company primarily engaged in the development, manufacture, and distribution of automated transfer and precision handling equipment for the semiconductor and flat panel display (FPD) manufacturing industries. Founded in 1997 and headquartered in Yongin-si, Gyeonggi-do, South Korea, the company operates as an affiliate of Japan-based Rorze Corporation and provides high-precision cleanroom automation solutions to global technology manufacturers across South Korea, China, Taiwan, and other international markets.
The company's core product and service portfolio includes semiconductor wafer transfer systems, comprising Equipment Front End Modules (EFEM), atmospheric and vacuum transfer robots, wafer sorters, load ports, and wafer indexers; flat panel display automation systems, comprising glass substrate indexers, Cassette-to-Cassette transfer systems, OLED and LCD module handling automation, and cleanroom stockers; and advanced laser processing equipment, comprising laser glass cutting systems, laser scribing machines, laser marking tools, and laser de-bonding systems for ultra-thin glass and advanced packaging substrates. In addition, the company provides installation, retrofitting, spare parts distribution, and technical maintenance services for its installed machinery base.
In recent developments, Rorze Systems Corporation has expanded its product offerings to address advanced semiconductor packaging architectures, developing high-precision automation and laser processing tools specifically for panel-level packaging (PLP) and wafer-level packaging (WLP) lines. The company has also scaled the supply of its high-throughput EFEM platforms to major semiconductor foundries and memory manufacturers, while accelerating research and development into ultra-clean vacuum transfer robotics and hybrid laser-cutting technologies tailored for sub-nanometer wafer fabrication and next-generation flexible OLED display production.