Hanyang Digitech Co., Ltd

Hanyang Digitech Co., Ltd

KKRX:078350
34,950.00
KRW
+2,650.00
(+8.20%)
1,111.43EPS
25.15P/E
426.08BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
5,755.95
9,400.35
12,741.87
8,916.37
7,898.4
9,725.22
7,061.78
15,038.83
21,187.41
32,491.52
32,046.57
39,921.44
44,558.85
47,248.49
Basic EPS, GAAP
187
603
440
-70
-224
97
-1,328
426
1,693
2,492
846
1,712
1,025
1,111.43
Free Cash Flow per Basic Share
427.72
521.52
-245.96
-254.63
308.64
265.75
-2,828.36
-673.99
1,103.6
-1,396.17
-1,915.03
2,303.47
486.01
-846.3
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
3,517.29
4,146.63
4,608.83
4,446.96
4,118.39
4,219.6
3,003.11
3,796.94
5,629.91
8,129.46
8,912.15
10,741.24
11,152.07
12,721.7
Tangible Book Value per Share
3,226.93
3,830.48
4,203.03
4,004.48
3,699.81
3,826.33
2,892.84
3,725.44
5,543.45
8,042.31
8,817.34
10,631.79
10,970.34
12,541.5
Basic Weighted Avg Shares
10
10
10
10
10
10
10
11
14
15
15
15
15
15
Sales/Revenue/Turnover
57,741
94,066
127,088
88,176
76,689
93,974
67,971
159,741
303,399
484,770
478,838
595,167
651,051
693,590
Operating Margin (%)
5.12
8.46
5.4
0.59
-3.49
3.13
-11.68
4.34
9.89
10.9
3.99
5.89
3.67
3.74
Depreciation Expense
3,512
1,956
2,266
2,276
2,404
2,955
4,019
4,871
4,755
7,931
13,284
18,262
18,522
18,599
Net Income, GAAP
1,876
6,034
4,389
-692
-2,175
937
-12,782
4,525
24,243
37,180
12,641
25,523
14,976
16,315
Effective Tax Rate (%)
10.28
15.44
27.38
- -
- -
33.02
- -
25.63
23.99
25.54
20.13
24.21
24.4
26.7
Profit Margin (%)
3.25
6.41
3.45
-0.79
-2.84
1
-18.81
2.83
7.99
7.67
2.64
4.29
2.3
2.35
Working Capital
-4,618
1,819
6,328
3,153
-612
1,253
-17,711
-18,294
11,532
19,481
14,343
36,429
46,621
53,323
LT Debt
- -
- -
2,638
901
- -
1,664
17,905
321
405
496
705
840
1,093
1,061
Total Equity
35,173
41,466
45,870
43,593
39,638
40,613
28,904
48,375
83,995
121,858
133,188
159,374
170,006
193,934
Return on Invested Capital (%)
5.69
13.41
9.17
- -
- -
4.49
- -
7.69
27.7
33.34
9.88
15.16
9.6
9.74
Return on Capital (%)
4.88
12.55
8.44
- -
- -
2.47
- -
8.45
31.12
33.72
9.04
15.4
8.64
8.87
Return on Common Equity (%)
5.47
15.75
10.05
-1.55
-5.23
2.34
-36.77
11.71
36.63
36.12
9.91
17.45
9.09
9.2

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
17,364
16,890
10,606
LT Borrowings
- -
- -
- -
LT Finance Leases
584
1,093
1,061
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
15
15
15
Market Capitalization
248,638
328,516
426,080

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
161,056
165,762
192,881
Cash, Cash Equivalents & STI
26,865
22,686
28,767
Accounts Receivable, Net
63,752
64,579
76,687
Inventories
62,185
66,500
77,206
Total Current Liabilities
115,508
119,141
139,558
Payables & Accruals
- -
- -
- -
ST Debt
17,364
16,890
10,606
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
18.13%
30.87%
6.67%
Free Cash Flow
-227.9%
-162.9%
-79.32%
Net Income, GAAP
-116.01%
96.74%
-41.32%
Sales/Revenue/Turnover
26.84%
36.43%
9.39%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
167,530
155,680
129,061
142,897
595,167
2025
149,448
155,195
178,415
167,994
651,051
2026
191,987
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
503
405
259
544.1
1,712
2025
251
-241.11
598.13
419.28
1,025
2026
338.39
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Yun-Sang Kim
Full Time Employees
81
Sector
Electronic technology
Industry
Electronic production equipment
Address
Hwaseong-si South Korea
IPO Date
May 14, 2004
Business
Hanyang Digitech Co., Ltd. is a South Korea-based electronic manufacturing services and semiconductor backend solutions provider specializing in the assembly, testing, and distribution of semiconductor memory modules, storage devices, and telecommunications equipment. Founded in 2004 as a spin-off from Hanyang ENG Co., Ltd. and headquartered in Hwaseong, Gyeonggi-do, South Korea, the company operates across two principal business divisions: Semiconductor Memory and Telecommunications/VoIP. The company's core products and manufacturing services comprise: DRAM memory modules for enterprise servers, workstations, desktop PCs, and notebook computers, including DDR4 and advanced DDR5 Registered Dual In-Line Memory Modules (RDIMM), Unbuffered DIMMs (UDIMM), and Small Outline DIMMs (SODIMM); Solid State Drives (SSDs), encompassing enterprise-grade (eSSD) and client-grade storage solutions in SATA, PCIe, and M.2 NVMe form factors; semiconductor backend processing and surface mount technology (SMT) contract manufacturing services, providing precision electronic assembly and testing for global integrated device manufacturers; and telecommunications network devices, including Voice over Internet Protocol (VoIP) gateways, IP phones, wireless communication terminals, and IoT-enabled connectivity modules. Hanyang Digitech primarily serves tier-one semiconductor integrated device manufacturers, cloud data center operators, original equipment manufacturers, and telecommunications service providers. The company conducts domestic operations in South Korea and maintains its primary overseas high-volume manufacturing subsidiary, Hanyang Digitech VINA Co., Ltd., located in Bac Giang Province, Vietnam, which serves global supply chains across Asia, North America, and Europe. In recent strategic and operational developments, Hanyang Digitech has substantially scaled up production capacity and automated testing infrastructure at its Vietnam manufacturing facility to meet surging global demand for high-capacity DDR5 server memory modules and enterprise SSDs utilized in artificial intelligence data centers and cloud computing networks. The company has reinforced its primary supplier partnerships with domestic semiconductor leaders, transitioning major production lines toward high-density memory configurations and advancing preparation for next-generation Compute Express Link (CXL) memory architectures. In addition, the company continues to upgrade its automated surface-mount lines and inspection technologies to optimize manufacturing yields and operational efficiency across high-speed computing hardware.