Interlink Electronics, Inc.
NASDAQCapital Structure
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in mil. unless spec.Working Capital
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Quarterly Dividends Per Share
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in mil. unless spec.- CEO
- Steven Nathan Bronson
- Full Time Employees
- 93
- Sector
- Technology
- Industry
- Hardware, Equipment & Parts
- Address
- 48389 Fremont Boulevard Fremont CA United States of America 94538
- IPO Date
- Jan 2, 2002
- CIK
- 0000828146
- Website
- interlinkelectronics.com
- Similar Companies
- Business
- Interlink Electronics, Inc. (NasdaqCM: LINK) develops and manufactures advanced thin-film sensors and related human-machine interface solutions for consumer electronics, automotive, industrial, and medical applications. The company offers products including force-sensing resistors (FSR) technology under brands such as FSR 400 series and custom sensor designs; printed electronics solutions like membrane switches, capacitive touch sensors, and flexible circuits; and turnkey integration services encompassing design, prototyping, and high-volume manufacturing of sensor assemblies. These offerings serve diverse markets such as wearable devices, robotics, electric vehicles, healthcare monitoring equipment, and Internet of Things (IoT) devices, with operations spanning North America, Europe, and Asia. Founded in 1987 and headquartered in Camarillo, California, Interlink Electronics maintains no major subsidiaries or parent company affiliations. In recent developments, the company expanded its automotive segment through a strategic partnership with a leading electric vehicle manufacturer in 2024 to integrate FSR-based haptic feedback systems into next-generation steering wheels and pedals. Interlink Electronics also completed a $12 million funding round in early 2025 led by existing investors to accelerate production capacity for its printed electronics platform amid rising demand for flexible sensors in medical wearables. Additionally, it launched the Interlink NanoFSR line in late 2024, a miniaturized sensor series optimized for IoT edge devices, marking a shift toward higher-margin custom solutions and operational scaling in Asia-Pacific facilities.
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