- CEO
- Kyle Christopher Borch
- Full Time Employees
- 450
- Sector
- Technology
- Industry
- Semiconductors
- Address
- No. 31 Kaki Bukit Place Singapore CE Singapore 416209
- IPO Date
- Apr 25, 2013
- Business
- Micro-Mechanics (Holdings) Ltd. designs, manufactures and markets high-precision consumable tools and parts for semiconductor wafer fabrication, assembly and testing processes; its product portfolio includes die attach pick-up tools such as rubber tips, tungsten carbide die collets and vacuum wand tools, die attach dispensing products comprising dispense nozzles, pen dispensing assemblies and epoxy stamping tools, die attach die ejection components like ejector needles and needle holders, wire bonding tools encompassing thermosonic clamps, electronic flame off products, ultrasonic anvils and wire cutters, encapsulation items including BGA dispensing nozzles and pump screws, as well as precision components and modules produced on a contract basis for OEMs in aerospace, semiconductor, laser and medical industries. The company operates five manufacturing facilities in Singapore, Malaysia, China, the Philippines and the United States, serving over 600 customers across Singapore, Malaysia, the Philippines, the United States, China, Thailand, Taiwan, Europe, Japan and other international markets. Founded in 1983 and headquartered at 31 Kaki Bukit Place, Eunos Techpark, Singapore, Micro-Mechanics focuses on the semiconductor equipment and services segment, with consumable tools accounting for the majority of revenue and wafer fabrication equipment parts comprising the balance. In recent developments, the company reported strong FY2025 financial results with revenue of S$65.2 million, reflecting robust growth and operational turnaround particularly in its U.S. wafer fabrication equipment segment; it held its 29th Annual General Meeting in October 2025, approved a final dividend of 3.0 Singapore cents per share payable on 18 November 2025, conducted an Extraordinary General Meeting in November 2025 to approve a share buy-back mandate and the Performance Share Plan 2025 to align management incentives with shareholder value, and emphasized strategic expansions in advanced packaging, AI-related consumables and critical wafer fabrication tools amid converging semiconductor market trends.