MagnaChip Semiconductor

MagnaChip Semiconductor

MX
MagnaChip SemiconductorUS flagNew York Stock Exchange
3.09
USD
+0.05
- -
112.78MMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
20.84
20.5
18.43
19.75
20.02
13.5
15.17
14.4
10.57
7.53
5.61
5.2
4.94
4.9
Basic EPS, GAAP
-1.82
-3.44
-2.47
-0.85
2.5
-0.11
-0.64
9.8
1.26
-0.18
-0.89
-1.44
-0.82
-0.85
Free Cash Flow per Basic Share
0.73
-1.64
-0.5
-0.3
-1.59
0.15
0.77
-0.83
1.22
-0.42
-0.25
-0.48
-1.5
-0.57
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
2.39
-0.54
-1.8
-2.06
-1.16
-0.5
-0.43
9.66
9.92
9.77
8.87
7.5
6.85
6.2
Tangible Book Value per Share
2.3
-0.62
-1.88
-2.15
-1.28
-0.62
-0.51
9.58
9.86
9.73
8.83
7.49
6.84
6.19
Basic Weighted Avg Shares
35
34
34
35
34
34
34
35
45
45
41
38
36
36
Sales/Revenue/Turnover
734
698
634
688
680
465
521
507
474
338
230
196
179
177
Operating Margin (%)
-2.53
-9.58
-6.78
0.07
5.24
4.7
4.57
6.44
10.52
-0.58
-21.04
-12.41
-17.34
-20.93
Depreciation Expense
33
30
26
25
28
32
33
16
14
15
17
16
13
12
Net Income, GAAP
-64
-117
-85
-30
85
-4
-22
345
57
-8
-37
-54
-30
-31
Effective Tax Rate (%)
- -
- -
- -
- -
1.34
- -
- -
- -
23.34
- -
- -
- -
- -
- -
Profit Margin (%)
-8.74
-16.79
-13.39
-4.3
12.5
-0.84
-4.19
68.03
11.96
-2.38
-15.92
-27.65
-16.62
-17.26
Working Capital
172
107
94
89
192
220
246
236
324
291
199
173
133
97
LT Debt
224
224
220
221
303
304
305
2
2
4
3
29
45
16
Total Equity
82
-19
-62
-72
-40
-17
-15
346
453
428
345
277
248
227
Return on Invested Capital (%)
- -
- -
- -
- -
15.73
- -
- -
- -
8.34
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
51.46
- -
- -
- -
12.97
- -
- -
- -
- -
- -
Return on Common Equity (%)
-47.02
- -
- -
- -
- -
- -
- -
- -
14.21
-1.82
-9.48
-17.48
-11.32
-12.33

Capital Structure

FRC

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1
28
27
LT Borrowings
45
16
16
LT Finance Leases
1
1
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
36
36
37
Market Capitalization
92
102
173

Working Capital

FRC

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
177
170
164
Cash, Cash Equivalents & STI
104
95
88
Accounts Receivable, Net
26
24
24
Inventories
34
33
34
Total Current Liabilities
43
72
68
Payables & Accruals
39
38
35
ST Debt
1
28
27
Deferred Revenue
- -
- -
- -

Growth Rates

FRC

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-253%
-4.79%
-10.31%
Free Cash Flow
29.67%
-37.62%
201.44%
Net Income, GAAP
-161.64%
32.2%
-45.27%
Sales/Revenue/Turnover
-10.56%
-18.14%
-8.94%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
43
46
55
63
196
2025
45
48
46
41
179
2026
46
45
- -
- -
- -

Quarterly Earnings Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.4
-0.34
-0.26
-0.44
-1.44
2025
-0.24
0.01
-0.36
-0.22
-0.82
2026
-0.13
-0.13
- -
- -
- -

Quarterly Dividends Per Share

FRC

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Chae Lee
Full Time Employees
711
Sector
Technology
Industry
Semiconductors
Address
76, Jikji-daero Cheongju-si NC South Korea 28581
IPO Date
Mar 11, 2011
Business
Magnachip Semiconductor Corporation designs and manufactures analog and mixed-signal semiconductor platform solutions for communications, Internet of Things, consumer, computing, industrial, and automotive applications; its core products encompass power management integrated circuits including MOSFETs, IGBTs, AC-DC/DC-DC converters, LED drivers, and regulators, alongside display driver ICs for OLED and LCD panels supporting high-resolution displays in smartphones, televisions, automotive displays, and notebook PCs. Founded in 2004 as a spin-off from Hynix Semiconductor and headquartered in Cheongju-si, South Korea, the company maintains significant manufacturing facilities in South Korea, including Gumi-si, and operates sales and R&D offices across Asia, the United States, and China, with a recent expansion marked by the grand opening of its subsidiary Magnachip Technology Company Ltd. in Hefei, China, in May 2024. In November 2025, Magnachip signed a strategic 10-year licensing agreement with Hyundai Mobis for its advanced IGBT technology, originally co-developed for electric vehicle traction inverters since 2015, enabling expansion into industrial, AI data centers, and renewable energy markets with plans to launch a new seventh-generation industrial IGBT series in the first half of 2026 and initial revenue expected in 2027; the company also launched 30 new-generation power products in the first nine months of 2025, plans at least 20 more in Q4 for a yearly total exceeding 50, and initiated operational expense reductions including workforce streamlining to achieve approximately $2.5 million in annualized savings.

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