1. Singapore Stocks

  2. •

    Electronic technology

  3. •

    Electronic production equipment
Advanced Systems Automation Limited

Advanced Systems Automation Limited

SSGX:WJ9
0.00
SGD
+0.00
(+50.00%)
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.24
0.32
0.16
0.18
0.06
0.02
- -
0.02
0.03
0.02
0.02
0.01
0.01
- -
Basic EPS, GAAP
-0.03
-0.01
-0.12
-0.02
-0.02
-0.01
-0.01
-0.01
- -
- -
-0.01
- -
- -
- -
Free Cash Flow per Basic Share
-0.05
-0.03
-0.03
-0.02
-0.02
-0.01
- -
- -
- -
- -
- -
- -
- -
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
0.17
0.13
0.02
- -
0.01
0.01
- -
- -
- -
- -
-0.01
- -
- -
- -
Tangible Book Value per Share
0.15
0.12
0.02
- -
0.01
- -
- -
-0.01
-0.01
-0.01
-0.01
-0.01
-0.01
- -
Basic Weighted Avg Shares
87
107
147
147
327
491
672
672
672
672
562
1,635
1,665
672
Sales/Revenue/Turnover
21
35
24
27
19
12
- -
14
19
15
13
18
16
- -
Operating Margin (%)
-10.27
-1.06
-33.45
-8.99
-11.1
-8.05
- -
-12.74
2.02
3.35
-7.77
-25.17
2.57
- -
Depreciation Expense
1
2
3
- -
1
- -
- -
- -
1
1
1
1
1
- -
Net Income, GAAP
-2
-1
-17
-3
-6
-6
-5
-5
- -
- -
-4
-6
-5
- -
Effective Tax Rate (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
91.9
- -
- -
- -
- -
Profit Margin (%)
-10.69
-3.07
-70.79
-10.35
-29.31
-49.55
- -
-34
-1.28
0.15
-31.07
-34.55
-30.6
- -
Working Capital
3
7
2
- -
3
-3
-8
-10
-11
-2
-1
-4
-8
-10
LT Debt
2
1
1
- -
- -
1
1
2
2
3
1
2
2
- -
Total Equity
18
20
2
-1
5
5
1
-2
-2
-3
-7
- -
-7
-1
Return on Invested Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
2.09
- -
- -
- -
- -
Return on Capital (%)
- -
- -
- -
- -
- -
- -
- -
- -
- -
2.63
- -
- -
- -
- -
Return on Common Equity (%)
-13.78
-5.85
-151.26
- -
- -
-103.06
-118.25
- -
- -
- -
- -
- -
- -
- -

Capital Structure

SGD

•

in mil. unless spec.
Sep'19
Dec'19
Jun'20
ST Debt
2
1
1
LT Borrowings
- -
- -
- -
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
672
672
672
Market Capitalization
- -
- -
- -

Working Capital

SGD

•

in mil. unless spec.
Sep'19
Dec'19
Jun'20
Total Current Assets
12
11
10
Cash, Cash Equivalents & STI
3
2
2
Accounts Receivable, Net
6
4
5
Inventories
2
1
1
Total Current Liabilities
18
19
20
Payables & Accruals
- -
- -
- -
ST Debt
2
1
1
Deferred Revenue
- -
- -
- -

Growth Rates

SGD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
3,998.22%
8,254.87%
41,168.75%
Free Cash Flow
4.14%
18.12%
-45.89%
Net Income, GAAP
-1,772.88%
-3,547.23%
-18.13%
Sales/Revenue/Turnover
- -
5.66%
-7.58%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

SGD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
13
2024
- -
- -
- -
- -
18
2025
- -
- -
- -
- -
16

Quarterly Earnings Per Share

SGD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
-0.01
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

SGD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2023
- -
- -
- -
- -
- -
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Chong Hoe Seah
Full Time Employees
100
Sector
Electronic technology
Industry
Electronic production equipment
Address
16 Kallang Place Singapore CE Singapore 339156
IPO Date
Jul 22, 1996
Website
asa.sg
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Business
Advanced Systems Automation Limited (ASA or the Group) (SGX: WJ9) is a technology company focused on the design, development, manufacture, and sale of advanced automation equipment for the semiconductor, electronics, and medical industries. The Group offers a broad portfolio of products including automated optical inspection systems, intelligent test handlers, and flip chip bonders; die bonder systems; wire bonders; encapsulation systems; and singulation equipment, with key brands encompassing systems for wafer-level and panel-level processing. It provides engineering services such as prototyping, custom design, and maintenance support. Headquartered in Singapore and founded in 1999, ASA operates primarily in Asia, with manufacturing facilities in Singapore and China, and serves global customers in semiconductor front-end and back-end processes, consumer electronics assembly, and medical device production. In recent developments, the company expanded its intelligent test handler portfolio through the launch of new models optimized for high-speed 3D packaging applications in October 2024. ASA secured strategic partnerships with leading semiconductor equipment providers for collaborative development of next-generation inspection technologies announced in mid-2025. Additionally, it completed a funding round in late 2025 to support R&D investments in AI-driven automation solutions amid growing demand for advanced packaging amid the global chip shortage recovery. The Group also reorganized its operations to establish a dedicated medical automation division in early 2026, targeting expansion into biopharmaceutical equipment markets.