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    Electronic production equipment
Shenzhen S-king Intelligent Equipment Co., Ltd. Class A

Shenzhen S-king Intelligent Equipment Co., Ltd. Class A

SSSE:688328
66.79
CNY
-2.79
(-4.01%)
0.74EPS
140.19P/E
9.04BMarket Cap
Oct 23Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.78
1.99
3.57
3.61
5.4
7.52
7.79
10.68
11.93
7.23
6.9
5.39
7.16
8.08
Basic EPS, GAAP
0.16
0.28
0.7
0.34
0.63
0.73
0.84
1.2
0.73
-0.44
-1.43
-1.12
0.26
0.68
Free Cash Flow per Basic Share
0.17
0.34
0.06
-0.76
0.41
0.39
-0.3
-0.94
-3.1
-2.42
-1.51
0.03
1.23
- -
Dividend per Share
0.02
0.02
0.03
0.13
0.05
0.01
0.02
0.04
0.38
0.3
0.08
0.22
0.08
0.21
Book Value per Share
0.48
0.91
1.72
2.17
4.81
5.54
6.37
7.54
9.43
9.12
9.73
8.58
8.79
9.29
Tangible Book Value per Share
0.48
0.91
1.72
2.08
4.73
5.45
5.87
7.01
9.05
8.74
9.33
8.24
8.46
8.97
Basic Weighted Avg Shares
61
61
49
50
57
61
61
61
76
81
81
94
94
94
Sales/Revenue/Turnover
108
121
174
182
309
455
472
648
911
589
558
509
672
761
Operating Margin (%)
7.34
13.65
16.84
9.32
15.06
15.18
14.2
15.65
10.03
-3.16
-12.02
-3.8
9.87
14.88
Depreciation Expense
1
1
1
1
1
2
3
4
11
17
27
21
17
- -
Net Income, GAAP
10
17
34
17
36
44
51
73
56
-36
-116
-106
24
64
Effective Tax Rate (%)
- -
14.63
11.81
7.15
8.61
6.59
5.21
7.05
2.63
- -
- -
- -
9.66
10.87
Profit Margin (%)
9.18
14.13
19.6
9.41
11.66
9.7
10.78
11.23
6.12
-6.09
-20.72
-20.76
3.63
8.45
Working Capital
28
50
97
114
275
322
345
375
536
625
562
395
408
473
LT Debt
4
- -
1
1
- -
- -
- -
25
49
350
119
14
6
6
Total Equity
29
55
104
137
300
347
400
483
815
805
949
852
843
900
Return on Invested Capital (%)
- -
16.13
22.24
4.22
15.25
14.26
14.03
16.24
9.74
- -
- -
- -
3.69
6.52
Return on Capital (%)
- -
29.01
34.47
11.11
15.28
12.57
12.6
12.59
5.28
- -
- -
- -
2.15
6.01
Return on Common Equity (%)
40.66
40.43
42.83
14.54
16.99
14.05
14.06
17.22
9.12
-4.77
-14.28
-12.49
2.98
7.55

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
116
127
153
LT Borrowings
- -
- -
- -
LT Finance Leases
6
6
6
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
94
94
94
Market Capitalization
2,756
3,290
9,039

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,010
1,051
1,154
Cash, Cash Equivalents & STI
179
235
300
Accounts Receivable, Net
327
342
403
Inventories
286
279
274
Total Current Liabilities
602
613
682
Payables & Accruals
- -
- -
- -
ST Debt
116
127
153
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
27.64%
14.86%
-1.02%
Free Cash Flow
243.82%
808.63%
3,885.81%
Net Income, GAAP
4.43%
-19.34%
-123.1%
Sales/Revenue/Turnover
18.57%
4.66%
32.08%
Total Cash Common Dividend
144.36%
205.1%
-63.78%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
86
155
164
105
509
2025
179
181
- -
145
672
2026
188
247
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.28
- -
-0.11
-0.74
-1.12
2025
0.15
0.07
- -
-0.04
0.26
2026
0.29
0.36
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.04
0.03
0.15
-0.01
0.22
2025
0.02
0.02
- -
0.02
0.08
2026
- -
0.17
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Yi Hong Huang
Full Time Employees
682
Sector
Electronic technology
Industry
Electronic production equipment
Address
B10-11F, Block BC Shenzhen GD China 518102
IPO Date
Mar 9, 2021
Website
szskd.com
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Business
Shenzhen S-king Intelligent Equipment Co., Ltd. (688328.SS) manufactures and sells intelligent automation equipment for the 3C digital, semiconductor packaging and testing, and core components sectors in China. The company offers semiconductor equipment including IC device testing and sorting machines, discrete device test sorters, turret test handlers such as SKD936 series and SKD980 models, wafer bonding and probe station machines; display module equipment comprising full-automatic and semi-automatic fitting series for flat panel laminating such as on-board laptop, large-size TV, AMOLED, and mobile phone wearing applications, AOI/testing equipment, COG/FOG bonding equipment, and auxiliary lines like wipe washers, deaeration machines, UV curing machines, and loading/unloading machines; camera and image module packaging equipment including automatic mirror mount laminating and chip laminating machines; digital inkjet equipment such as UV printing systems; and intelligent components encompassing direct drive linear motors, linear guides, linear slides, and frequency converters. Products serve display panel manufacturers, consumer electronics firms, semiconductor packaging and testing companies, and other enterprises, with equipment distributed across more than 10 countries and regions. Founded in 2004 and headquartered at B10-11F, Block BC, Huizhi R&D Center, Xixiang Street, Bao'an District, Shenzhen, Guangdong Province, China, the company operates additional facilities including a Huizhou base and wholly-owned subsidiaries Shenzhen Shenkeda Semiconductor Technology Co., Ltd., Shenzhen Xianma Technology Co., Ltd., Shenzhen Sigal Semiconductor Equipment Co., Ltd., and Huizhou Shenkeda Intelligent Equipment Co., Ltd. In recent developments, the company maintains scalable flexible cover lamination and fully automatic curved surface lamination equipment applicable to dual-foldable screen mobile phone displays; reported a net loss of 106 million yuan for fiscal 2024 with revenue of 509 million yuan but achieved profitability in Q1 2025 with net income of 14.3 million yuan; and executives including Director Zhang Xinming and Lin Guangman managed shareholdings through reductions and completions in early 2025.