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    Electronic technology

  3. •

    Electronic production equipment
Forehope Electronic (Ningbo) Co., Ltd. Class A

Forehope Electronic (Ningbo) Co., Ltd. Class A

SSSE:688362
44.00
CNY
-0.81
(-1.81%)
0.05EPS
617.96P/E
43.67BMarket Cap
Oct 28Next Earn
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
0.27
1.66
3.22
6.7
6.13
5.89
8.71
10.76
11.52
Basic EPS, GAAP
-0.27
-0.18
0.12
1.05
0.39
-0.23
0.16
0.2
0.16
Free Cash Flow per Basic Share
-2.55
-1.48
-3.63
-4.53
-2.54
-5.25
-1.76
-1.32
- -
Dividend per Share
0.01
0.05
0.16
0.26
0.31
0.44
0.44
0.45
0.53
Book Value per Share
0.82
0.9
0.85
3.95
6.27
6.01
6.15
6.36
8.46
Tangible Book Value per Share
0.64
0.75
0.68
3.69
6.05
5.79
5.8
5.83
8
Basic Weighted Avg Shares
145
220
232
307
355
406
415
409
408
Sales/Revenue/Turnover
39
366
748
2,055
2,177
2,391
3,609
4,398
4,705
Operating Margin (%)
-117.69
-8.13
100
21.76
13.47
-0.22
7.02
6.39
5.72
Depreciation Expense
6
34
10
272
445
521
763
1,037
- -
Net Income, GAAP
-39
-40
28
322
138
-93
66
82
64
Effective Tax Rate (%)
- -
- -
3.85
9.48
- -
- -
- -
- -
5.58
Profit Margin (%)
-101.31
-10.83
3.72
15.68
6.36
-3.91
1.84
1.86
1.35
Working Capital
-102
-571
-1,273
-1,234
-512
486
-887
-927
-945
LT Debt
80
56
508
775
2,672
5,240
4,824
5,699
5,900
Total Equity
181
277
296
1,373
2,945
3,998
4,037
4,094
5,288
Return on Invested Capital (%)
- -
- -
3.52
13.93
- -
- -
- -
- -
0.15
Return on Capital (%)
- -
- -
6.65
16.77
- -
- -
- -
- -
2.54
Return on Common Equity (%)
- -
-17.29
9.72
38.6
7.05
-3.73
2.67
3.19
2

Capital Structure

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
2,640
2,799
3,614
LT Borrowings
5,695
6,287
5,898
LT Finance Leases
3
3
2
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
410
410
453
Market Capitalization
13,304
15,122
43,672

Working Capital

CNY

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
3,470
3,840
4,721
Cash, Cash Equivalents & STI
1,793
2,131
2,796
Accounts Receivable, Net
861
795
873
Inventories
511
583
715
Total Current Liabilities
4,397
4,467
5,666
Payables & Accruals
- -
- -
- -
ST Debt
2,640
2,799
3,614
Deferred Revenue
- -
- -
- -

Growth Rates

CNY

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
103.4%
1.41%
Free Cash Flow
- -
14.87%
-25.71%
Net Income, GAAP
- -
136.82%
23.22%
Sales/Revenue/Turnover
- -
52.66%
21.87%
Total Cash Common Dividend
- -
44.21%
1.54%

Quarterly Revenue

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
727
903
922
1,058
3,609
2025
945
1,065
- -
1,228
4,398
2026
1,172
1,239
- -
- -
- -

Quarterly Earnings Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-0.09
0.12
0.07
0.06
0.16
2025
0.06
0.01
- -
0.05
0.2
2026
0.07
0.03
- -
- -
- -

Quarterly Dividends Per Share

CNY

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.1
0.12
0.12
0.12
0.44
2025
0.11
0.12
- -
0.13
0.45
2026
0.13
0.15
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Shun Bo Wang
Full Time Employees
6,612
Sector
Electronic technology
Industry
Electronic production equipment
Address
Ningbo China
IPO Date
Nov 16, 2022
Website
forehope-elec.com
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Business
Forehope Electronic (Ningbo) Co., Ltd. is a China-based outsourced semiconductor assembly and test provider primarily engaged in the research, development, packaging, and testing of mid-to-high-end and advanced integrated circuits. Founded in 2017 and headquartered in Yuyao, Ningbo, China, the company delivers comprehensive, turnkey backend manufacturing solutions encompassing wafer bumping, circuit probing, assembly, and final testing. Its core product and service portfolio includes System-in-Package solutions for heterogeneous multi-die integration; Flip Chip packaging technologies, including FC-CSP and FC-BGA; Wafer-Level Packaging services featuring wafer bumping and fan-out processes; Quad Flat No-Lead and Dual Flat No-Lead packages; Micro-Electro-Mechanical Systems sensor packaging; Wire Bonding assembly; and proprietary packaging platforms such as FH-BSAP supporting 2.5D and 3D integration. The company serves global and domestic fabless semiconductor design companies across applications including 5G telecommunications, artificial intelligence, automotive electronics, AIoT, consumer electronics, and high-performance computing. In recent strategic developments, Forehope Electronic announced an overseas expansion with an investment of up to RMB 2.1 billion to build an advanced integrated circuit packaging and testing facility in Penang, Malaysia, dedicated to System-in-Package production for AIoT and power modules. Additionally, the company initiated its Phase III high-end IC packaging and testing expansion in Yuyao with a planned investment of RMB 10.3 billion to expand manufacturing capacity for 2.5D advanced packaging, wafer bumping, and flip-chip technologies, alongside fully scaling its integrated one-stop turnkey service infrastructure.