1. Taiwan Stocks

  2. •

    Electronic technology

  3. •

    Electronic production equipment
Zen Voce Corporation

Zen Voce Corporation

TTPEX:3581
101.50
TWD
-4.00
(-3.79%)
3.31EPS
60.45P/E
7.22BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
20.72
19.27
16.08
17.28
23.84
22.65
23.12
23.5
25.64
29.6
28.64
27.02
30.78
34.54
Basic EPS, GAAP
0.99
2.04
0.91
1.02
1.5
0.71
1.05
1.5
2.11
1.26
0.55
0.6
0.81
2.34
Free Cash Flow per Basic Share
1.53
-2.64
2
0.97
-1.95
0.68
1.32
-0.49
1.1
1.01
2.01
-0.03
-0.56
-0.81
Dividend per Share
- -
- -
- -
- -
- -
- -
-0.02
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
12.95
14.08
14.74
14.42
14.4
14.07
14.29
15
16.1
16.73
16.51
16.86
17.34
17.75
Tangible Book Value per Share
12.95
14.08
14.74
12.57
12.52
12.17
12.38
13.89
14.99
15.63
15.12
15.53
16.07
16.51
Basic Weighted Avg Shares
53
46
51
51
51
51
51
51
51
51
51
51
51
51
Sales/Revenue/Turnover
1,094
880
826
886
1,222
1,166
1,180
1,199
1,308
1,510
1,461
1,378
1,570
1,759
Operating Margin (%)
14.11
7.89
10.68
7.83
8.12
5.89
8.18
11.18
10.27
10.34
4.61
4.3
7.97
8.41
Depreciation Expense
15
14
14
15
21
19
34
29
26
30
26
29
25
24
Net Income, GAAP
52
93
47
52
77
36
54
77
108
64
28
31
41
119
Effective Tax Rate (%)
38.41
16.56
29.05
22.91
4.5
21.63
16.35
26.08
18.05
34.96
33.77
31.96
28.41
18.1
Profit Margin (%)
4.79
10.56
5.65
5.89
6.29
3.11
4.55
6.39
8.23
4.25
1.91
2.24
2.62
6.78
Working Capital
407
483
591
636
610
657
551
679
712
658
663
703
787
783
LT Debt
7
24
18
89
80
73
69
54
45
32
26
12
1
3
Total Equity
591
643
755
900
884
864
841
896
937
977
978
1,015
1,056
1,067
Return on Invested Capital (%)
13.14
7.87
7.75
5.17
7.51
4.28
5.6
7.02
8.77
7.07
3.05
2.62
5.48
7.37
Return on Capital (%)
7.48
13.07
5.92
4.76
5.18
1.92
3.32
3.26
6.83
3.02
0.17
-0.25
0.1
5.46
Return on Common Equity (%)
8.44
15.06
6.67
6.99
10.41
4.96
7.38
10.26
13.57
7.66
3.29
3.62
4.71
14.02

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
383
441
440
LT Borrowings
- -
- -
- -
LT Finance Leases
1
- -
3
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
51
51
51
Market Capitalization
3,713
3,407
7,217

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,721
1,938
2,151
Cash, Cash Equivalents & STI
705
866
721
Accounts Receivable, Net
392
406
403
Inventories
524
601
915
Total Current Liabilities
935
1,125
1,369
Payables & Accruals
- -
- -
- -
ST Debt
383
441
440
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
3.58%
3.35%
4.11%
Free Cash Flow
101.58%
309.77%
1,885.83%
Net Income, GAAP
8.44%
-2.54%
33.2%
Sales/Revenue/Turnover
7.3%
5.91%
13.9%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
326
349
350
353
1,378
2025
357
299
414
500
1,570
2026
405
440
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.04
0.14
-0.18
0.6
0.6
2025
-0.23
-0.37
0.73
0.67
0.81
2026
0.31
0.63
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

Company Profile APIChatGPT
CEO
Tu Cheng Li
Full Time Employees
114
Sector
Electronic technology
Industry
Electronic production equipment
Address
No. 53, Jinggong Road Hsinchu Taiwan 304034
IPO Date
Oct 2, 2007
Website
zenvoce.com
Similar Companies
Bloom Energy Corporation (NYSE:BE)
AXT Inc (NASDAQ:AXTI)
Vertiv Holdings, LLC (NYSE:VRT)
Aehr Test Systems (NASDAQ:AEHR)
Teradyne, Inc. (NASDAQ:TER)
Dixon Technologies (India) Ltd. (NSE:DIXON)
Business
Zen Voce Corporation manufactures and sells semiconductor assembly and testing equipment in Taiwan and internationally. The company designs and manufactures IC packaging machines and bumping products; wafer cutting and cleaning machines; board cutting and cleaning machines; wafer test probe card PCBs; IC test HIFIX and CHANG kits; SOCKET IC test products; IC handlers; and SOCKET IC burn-in test products. It also acts as an agent for semiconductor burn-in test connectors, micro-electromechanical (MEMS) equipment, solar equipment, and LCD inspection equipment, while providing comprehensive technical services to customers in the semiconductor, optoelectronic, microelectronics, and LCD equipment industries. Founded in 1999 and headquartered in Hsinchu, Taiwan, the company, formerly known as Trutek Cooperation, went public in 2007 and primarily serves domestic and overseas markets including America, Mainland China, and Singapore. No major acquisitions, partnerships, funding rounds, or strategic expansions have been reported in the last one to two years.