Microelectronics Technology Inc.

Microelectronics Technology Inc.

TTWSE:2314
9.38
TWD
+0.18
(+1.96%)
-4.47EPS
1.68BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
33.05
30.41
73.59
36.94
33.84
34.31
24.97
17.01
40.49
45.08
33.37
15.74
15.81
17.29
Basic EPS, GAAP
-4.43
-2.59
0.48
0.8
0.72
0.22
0.01
-0.41
-4.64
-4.89
-6.17
-10.8
-6.11
-4.47
Free Cash Flow per Basic Share
-0.02
-2.36
-1.23
0.79
-1.02
0.55
0.59
-0.35
-16.64
-6.06
-2.88
0.43
-1.12
0.51
Dividend per Share
- -
- -
- -
- -
0.11
0.2
0.2
- -
- -
- -
- -
- -
- -
- -
Book Value per Share
13.98
11.4
9.76
10.71
11.93
11.88
11.43
10.42
8.45
8.63
7.47
3.23
3.03
0.27
Tangible Book Value per Share
11.52
9.36
8.22
9.3
10.62
10.58
10.13
9.11
7.17
7.33
6.24
1.98
-3.79
-2.53
Basic Weighted Avg Shares
206
206
86
206
223
232
232
232
97
99
101
106
106
112
Sales/Revenue/Turnover
6,808
6,263
6,323
7,597
7,551
7,969
5,799
3,950
3,930
4,482
3,354
1,670
1,678
1,938
Operating Margin (%)
-12.44
-6.64
-1.69
2.8
2.49
0.67
0.22
-3.46
-11.82
-9.22
-15.25
-51.23
-44.25
-30.71
Depreciation Expense
374
288
210
139
114
96
138
163
193
217
232
221
189
173
Net Income, GAAP
-912
-534
41
164
161
52
2
-95
-450
-486
-620
-1,146
-649
-501
Effective Tax Rate (%)
- -
- -
46.01
26.89
19.6
36.2
84
- -
- -
- -
- -
- -
- -
- -
Profit Margin (%)
-13.4
-8.52
0.65
2.16
2.13
0.65
0.03
-2.42
-11.45
-10.85
-18.48
-68.63
-38.67
-25.84
Working Capital
580
168
596
1,486
1,610
1,549
1,466
1,563
1,282
1,176
720
-205
-725
-569
LT Debt
71
- -
- -
387
- -
- -
279
779
1,026
937
577
556
427
637
Total Equity
2,412
1,966
2,010
2,327
2,770
2,760
2,655
2,420
1,962
2,078
1,882
814
135
29
Return on Invested Capital (%)
- -
- -
-1.6
4.74
4.63
1.06
0.06
- -
- -
- -
- -
- -
- -
- -
Return on Capital (%)
- -
- -
1.75
5.52
5.24
1.91
0.16
- -
- -
- -
- -
- -
- -
- -
Return on Common Equity (%)
-31.95
-24.39
2.06
7.57
6.3
1.88
0.06
-3.76
-20.54
-24.08
-31.3
-85.04
-136.77
-258.71

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
1,257
1,238
999
LT Borrowings
300
272
533
LT Finance Leases
127
113
104
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
45
45
109
Market Capitalization
1,012
862
1,678

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
1,859
1,920
1,690
Cash, Cash Equivalents & STI
125
132
86
Accounts Receivable, Net
552
586
580
Inventories
1,020
1,015
833
Total Current Liabilities
2,584
2,738
2,260
Payables & Accruals
- -
- -
- -
ST Debt
1,257
1,238
999
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
-14.08%
-32.51%
-83.35%
Free Cash Flow
49.3%
259.32%
-358.66%
Net Income, GAAP
-518.22%
89.74%
-43.38%
Sales/Revenue/Turnover
-9.54%
-12.27%
0.49%
Total Cash Common Dividend
- -
- -
- -

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
431
501
353
385
1,670
2025
248
321
439
671
1,678
2026
384
445
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
-1.7
-0.76
-2.59
-4.7
-10.8
2025
-2.11
-0.98
-3.85
-0.59
-6.11
2026
-2.3
-0.72
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
- -
2025
- -
- -
- -
- -
- -
2026
- -
- -
- -
- -
- -

Company Description

CEO
Eugene Wu
Full Time Employees
1,933
Sector
Electronic technology
Industry
Telecommunications equipment
Address
Hsinchu Science Park Hsinchu TP Taiwan 300
IPO Date
Aug 8, 1990
Business
Microelectronics Technology Inc. specializes in the design, manufacture, and sale of microwave and satellite communication products, including satellite communication systems such as low noise block downconverters (LNBs), very small aperture terminals (VSATs), and outdoor transceivers for satellite networks. The company also produces telecommunication systems and devices including digital microwave radios, LTE/5G NR remote radio heads for cellular network backhaul, radio frequency identification (RFID) readers and modules, and mobile transceiver base station modules and subsystems. Its products serve applications in direct broadcasting satellite, private networks, telephony, distance education, telemedicine, video conferencing, disaster recovery, transportation, and supply chain tracking. The company operates manufacturing facilities in Taiwan and China with R&D centers in the United States and Denmark, targeting global markets across the United States, Mainland China, Taiwan, and internationally. Founded in 1983 and headquartered in Hsinchu, Taiwan, Microelectronics Technology Inc. is part of the Foxconn Technology Group. Recent major developments include the successful development and production of LEO Ka-Band outdoor transceivers for the Telesat Lightspeed™ satellite network, marking MTI's advancement in next-generation satellite communication technology. The company is also actively engaged in strategic partnerships and government-funded programs, such as collaborations with Rakuten Mobile and EchoStar to advance energy-efficient Open RAN macro radios and 5G ORAN technologies, supported by significant funding from the U.S. National Telecommunications and Information Administration (NTIA) under the NOFO2 wireless innovation initiative. These partnerships aim to position MTI strategically in the evolving 5G wireless network and satellite communications industry, emphasizing innovation in energy efficiency and global connectivity. Additionally, in 2024, MTI expanded its capabilities in wireless communication technologies through a partnership with Mobicom under the NTIA wireless innovation program. Microelectronics Technology Inc. maintains a diversified portfolio in wireless systems, including satellite communications, microwave radios, RFID technologies, and mobile base station equipment, aligned with its core RF and microwave technology competencies. The recent focus on LEO satellite transceivers and Open RAN advancements highlight the company’s strategic shift towards supporting next-generation, energy-efficient connectivity solutions for global telecommunications infrastructure.