Winbond Electronics Corp.
TTWSE:2344154.50
TWD
-5.00
(-3.13%)
ISIN
TW0002344009
Return %
Stock
S&P 500
1Y
239.93
14.20
3Y
499.19
81.12
5Y
527.30
68.34
Capital Structure
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in mil. unless spec.Growth Rates
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in mil. unless spec.Quarterly Revenue
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in mil. unless spec.Quarterly Earnings Per Share
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in mil. unless spec.Company Description
- CEO
- Yu-Chun Chiao
- Full Time Employees
- 7,942
- Sector
- Electronic technology
- Industry
- Semiconductors
- Address
- No. 8, Keya 1st Road Taichung TXQ Taiwan 428303
- IPO Date
- Oct 18, 1995
- Website
- winbond.com
- Similar Companies
- Business
- Winbond Electronics Corporation engages in the design, development, manufacture, and marketing of very large scale integration (VLSI) integrated circuits (ICs) for diverse microelectronic applications worldwide, primarily operating through three product segments: Dynamic Random Access Memory (DRAM) IC products; Flash memory products; and Logic IC products. Its DRAM portfolio includes Mobile DRAM devices such as Pseudo Static RAM (PSRAM), HyperRAM, Low Power Single Access (LPSDR) Synchronous DRAM (SDRAM), Low Power Double Data Rate SDRAM (DDR SDRAM) including DDR1 through DDR4X variants, and specialty SDRAM products. The Flash memory segment offers Code Storage Flash Memory including serial NOR, QspiNAND, OctalNAND, Single Level Cell (SLC) NAND, SpiStack, Authentication Flash products, NAND-based Multi-Chip Packages (MCP), and TrustME secure flash memory. The Logic IC segment encompasses application-specific catalog products supporting various customer needs across computing, communication, consumer electronics, automotive, and industrial sectors. Beyond manufacturing, Winbond provides research and development, design, sale, after-sales service, testing, consulting, and electronic commerce related to its semiconductor products. The company markets its products primarily through distributors and online platforms. Founded in 1987, Winbond Electronics is headquartered in Taichung, Taiwan, with global operations spanning Asia, the Americas, Europe, and beyond. In recent strategic developments within the past two years, Winbond expanded its technology and market reach through the acquisition of a 46% stake in NexFlash Technologies Inc., a Silicon Valley-based intellectual property developer specializing in flash memory technology, with an investment of approximately $33 million aimed at advancing process technologies and product innovation. Additionally, in 2024, Winbond acquired the Advanced PC Business Division from National Semiconductor, enhancing its logic IC business with key products such as I/O controllers, embedded controllers, and Trusted Platform Module (TPM) controllers, strengthening its footprint in notebook and motherboard markets and adding expertise in information system protection ICs compliant with TPM industry standards. Winbond also entered a strategic partnership with STMicroelectronics to integrate high-performance memory with STM32 devices targeting smart industrial and consumer applications. Moreover, the company is leading supply chain efforts in green transformation, advancing energy-efficient semiconductor solutions aligned with carbon reduction goals. These initiatives underscore Winbond’s commitment to innovation and market expansion while maintaining its position as a total memory solutions provider recognized globally for specialty DRAM, mobile DRAM, code storage flash, and secure flash memory products. Winbond maintains a strong position in the semiconductor industry focused on microelectronics for computing, communications, consumer electronics, automotive, and industrial industries. Its product applications include embedded systems, mobile computing, data storage solutions, and security-enhanced memory technologies. The company’s comprehensive portfolio and recent strategic acquisitions position it for competitive growth amidst evolving technology demands and increasing focus on energy efficiency and security in semiconductor products. Winbond continues to invest heavily in research and development, securing its role as a top innovator in memory and logic IC solutions globally.