Unimicron Technology Corp.

Unimicron Technology Corp.

1,085.00
TWD
-15.00
(-1.36%)
1.70TMarket Cap
Oct 27Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
38.65
39.96
42.51
41.69
43.3
50.52
56.32
59.68
70.48
94.49
67.94
75.84
86.16
- -
Basic EPS, GAAP
0.76
0.32
0.19
0.01
0.28
1.14
2.22
3.71
8.91
19.92
7.82
3.34
4.38
- -
Free Cash Flow per Basic Share
-0.91
-2.43
0.63
2.74
-3.12
3.05
-0.64
2.28
12.95
19.25
4.97
-10.8
-7.28
- -
Dividend per Share
1.09
0.6
0.5
0.3
0.3
0.5
0.79
1.09
1.38
3.37
7.96
3.01
1.51
- -
Book Value per Share
29.32
29.33
29.03
28.05
28.03
28.84
29.92
32.74
40.84
57.54
59.03
60.54
65.79
77.9
Tangible Book Value per Share
29.18
29.2
28.86
27.9
27.87
28.69
29.74
32.49
40.45
57.11
58.02
59.51
64.84
76.94
Basic Weighted Avg Shares
1,551
1,545
1,521
1,503
1,501
1,499
1,465
1,473
1,484
1,487
1,531
1,521
1,523
1,538
Sales/Revenue/Turnover
59,935
61,755
64,650
62,638
64,993
75,733
82,536
87,893
104,563
140,489
104,036
115,373
131,241
- -
Operating Margin (%)
2.56
1.71
0.4
0.54
-0.02
1.83
4.23
4.57
12.6
27.17
8.57
4.43
5.09
- -
Depreciation Expense
8,043
8,063
8,272
8,518
8,100
8,468
8,524
8,857
9,774
11,727
15,097
17,231
18,773
- -
Net Income, GAAP
1,173
497
288
12
414
1,705
3,260
5,462
13,222
29,619
11,980
5,082
6,673
- -
Effective Tax Rate (%)
21.18
10.75
79.25
63.08
35.72
19.82
18.88
14.7
18.67
21.69
21.51
24.11
14.46
- -
Profit Margin (%)
1.96
0.81
0.45
0.02
0.64
2.25
3.95
6.21
12.65
21.08
11.52
4.4
5.08
- -
Working Capital
14,859
15,120
13,739
14,483
10,357
10,190
13,756
11,363
30,817
52,695
42,332
28,487
29,843
67,012
LT Debt
19,587
22,341
23,327
19,350
18,518
17,902
21,653
23,359
22,242
24,563
24,807
32,905
34,873
23,105
Total Equity
49,935
49,604
47,953
46,121
46,652
46,700
48,351
53,101
65,516
92,658
96,284
99,587
107,007
127,720
Return on Invested Capital (%)
1.55
1.17
0.07
0.16
-0.01
1.46
3.58
3.98
11.04
25.29
5.35
2.84
3.68
- -
Return on Capital (%)
2.27
1.33
0.81
-0.05
0.62
2.78
4.84
7.03
13.82
24.81
9.61
3.85
4.38
- -
Return on Common Equity (%)
2.58
1.1
0.65
0.03
0.98
4.05
7.58
11.83
24.23
40.45
13.58
5.53
6.89
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
22,207
30,598
23,840
LT Borrowings
34,873
24,346
23,105
LT Finance Leases
- -
- -
- -
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
1,529
1,575
1,590
Market Capitalization
336,289
699,874
1,701,750

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
105,298
114,144
154,786
Cash, Cash Equivalents & STI
55,049
60,419
93,340
Accounts Receivable, Net
27,554
28,971
31,940
Inventories
17,802
18,936
20,559
Total Current Liabilities
75,455
86,190
87,774
Payables & Accruals
- -
- -
- -
ST Debt
22,207
30,598
23,840
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
9.04%
15.92%
7.45%
Free Cash Flow
-56.06%
19.77%
-32.53%
Net Income, GAAP
399.76%
36.05%
31.31%
Sales/Revenue/Turnover
8.47%
10.41%
13.75%
Total Cash Common Dividend
32.23%
40.63%
-49.85%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
26,403
27,877
31,712
29,381
115,373
2025
30,090
32,466
- -
34,691
131,241
2026
37,446
42,890
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.59
1.04
0.65
0.04
3.34
2025
0.6
0.02
- -
2.31
4.38
2026
3.28
8.45
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
3.01
2025
- -
- -
- -
- -
1.51
2026
- -
- -
- -
- -
- -

Company Description

CEO
Pen Wei Liao
Full Time Employees
31,448
Sector
Electronic technology
Industry
Electronic components
Address
No. 179, Shanying Road Taoyuan TP Taiwan 333
IPO Date
Dec 9, 1998
Business
Unimicron Technology Corp. (3037.TW) manufactures and sells advanced printed circuit boards (PCBs) and integrated circuit substrates for use in consumer electronics, networking equipment, automotive applications, and computing devices. The company offers high-density interconnect (HDI) PCBs, flexible and rigid-flex PCBs, integrated circuit substrates including flip-chip ball grid array (FCBGA) and cavity substrates, and carrier boards for semiconductor packaging; it also provides related services such as design, prototyping, and mass production tailored to high-performance computing, AI servers, 5G infrastructure, and electric vehicle components. Founded in 1990 and headquartered in Taoyuan, Taiwan, Unimicron operates manufacturing facilities in Taiwan, China, and Thailand, serving major global clients in the electronics and semiconductor industries with a focus on Asia-Pacific, North America, and Europe markets. In recent developments within the last two years, the company expanded its production capacity for advanced substrates through investments exceeding NT$20 billion in new fabs in Taiwan and Thailand to meet surging demand from AI and high-performance computing sectors; it also formed strategic partnerships with leading semiconductor firms for co-development of next-generation packaging solutions and completed acquisitions of smaller PCB specialists to bolster its rigid-flex and HDI capabilities.