Transcom, Inc. (Taiwan)

Transcom, Inc. (Taiwan)

TTWSE:5222
91.30
TWD
-1.50
(-1.62%)
10.48BMarket Cap
Nov 05Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
1.48
1.95
2.27
4.64
5.38
4.87
7.74
9.72
11.29
11.56
13.93
14.46
10.64
- -
Basic EPS, GAAP
-1.26
-0.56
0.33
1.48
0.71
0.68
1.91
2.26
3.04
2.79
4.86
4.4
2.51
- -
Free Cash Flow per Basic Share
- -
-0.59
-0.76
-0.27
1.05
0.39
-0.29
1.22
2.08
0.94
3.95
5.51
1.33
- -
Dividend per Share
- -
- -
- -
- -
- -
- -
0.24
1.52
0.75
2.63
2.25
3.31
3.63
- -
Book Value per Share
1.23
1.01
2.57
4.11
4.79
5.5
7.04
10.76
21.92
22.22
24.98
27.49
27.41
32.1
Tangible Book Value per Share
1.17
0.99
2.55
4.09
4.77
5.44
6.99
10.72
21.9
22.11
24.89
27.3
27.26
31.95
Basic Weighted Avg Shares
60
58
65
73
74
74
74
73
81
90
90
90
90
95
Sales/Revenue/Turnover
89
114
149
337
396
361
570
706
917
1,035
1,251
1,302
954
- -
Operating Margin (%)
-85.25
-30.24
14.55
36.18
18.14
20.86
32.04
29.61
33.91
35.41
37
34.18
25.84
- -
Depreciation Expense
6
6
6
7
13
16
24
42
47
56
72
77
80
- -
Net Income, GAAP
-76
-33
22
107
52
51
141
164
247
249
437
396
225
- -
Effective Tax Rate (%)
- -
- -
- -
0.23
10.94
18.82
16.16
16.72
19.13
22.48
17.83
18.96
15.9
- -
Profit Margin (%)
-85.01
-28.75
14.54
31.77
13.2
14
24.72
23.25
26.9
24.11
34.9
30.45
23.57
- -
Working Capital
37
24
111
191
222
231
293
580
1,440
1,149
1,660
933
636
586
LT Debt
- -
- -
20
6
5
3
95
97
91
93
90
93
90
95
Total Equity
75
66
185
299
353
410
543
891
1,979
2,006
2,254
2,475
2,493
2,925
Return on Invested Capital (%)
- -
- -
- -
37.56
14.93
12.85
25.11
18.86
15.65
12.94
16.45
13.9
7.52
- -
Return on Capital (%)
- -
- -
- -
33.78
12.6
11.05
23.94
18.92
15.73
11.74
19.3
15.78
8.45
- -
Return on Common Equity (%)
-67.22
-46.6
17.24
44.23
16
13.23
29.54
22.9
17.19
12.52
20.49
16.76
9.06
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
164
124
224
LT Borrowings
- -
- -
- -
LT Finance Leases
90
95
95
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
91
91
91
Market Capitalization
10,666
10,513
10,476

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
974
1,178
988
Cash, Cash Equivalents & STI
404
486
447
Accounts Receivable, Net
221
174
116
Inventories
335
390
403
Total Current Liabilities
338
523
402
Payables & Accruals
- -
- -
- -
ST Debt
164
124
224
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
33.86%
29.3%
0.73%
Free Cash Flow
-97.66%
64.87%
-75.94%
Net Income, GAAP
61.07%
14.79%
-43.24%
Sales/Revenue/Turnover
25.82%
8.2%
-26.68%
Total Cash Common Dividend
- -
57.05%
9.61%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
278
363
331
330
1,302
2025
266
213
- -
263
954
2026
178
229
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
0.79
1.31
1.34
0.88
4.4
2025
0.83
0.37
- -
0.56
2.51
2026
0.22
0.41
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
3.31
2025
- -
- -
- -
- -
3.63
2026
- -
- -
- -
- -
- -

Company Description

CEO
Chuan Sheng Chang
Full Time Employees
276
Sector
Electronic technology
Industry
Electronic production equipment
Address
90 Dasoong 7th Road Tainan TQ Taiwan 74145
IPO Date
Oct 25, 2021
Business
Transcom, Inc. operates as a microwave device and subsystem company headquartered in the Tainan Science-Based Industrial Park, Taiwan. Founded in 1998, the company specializes in the research, development, manufacture, and sales of high-performance Gallium Arsenide (GaAs) devices for both high power and low noise applications. Key product lines include monolithic microwave integrated circuits (MMICs), GaAs field-effect transistors (FETs), wideband fiber optic drivers, and C-band and Ku-band medium to high power amplifiers. Transcom also offers MMIC foundry services, providing custom design and turnkey packages to meet specific client needs. The company serves wireless communication markets across Taiwan, Asia, Europe, North America, and internationally, producing approximately 15,000 wafers annually and over 30 million pieces of microwave integrated circuit components. In recent developments, Transcom has focused on expanding its product offerings and maintaining manufacturing capacity amid evolving wireless communication standards. The company has enhanced its in-house design capabilities for subsystem development and continues to invest in advanced GaAs and MMIC technologies to support emerging market demands. There have been no reports of major mergers or acquisitions within the last two years, indicating a strategic focus on organic growth and product innovation. The company sustains operations supported by high-volume manufacturing and advanced semiconductor technologies to cater to global wireless equipment manufacturers and telecommunications suppliers. Transcom's business segments primarily cover wireless communications equipment, including amplifiers, modules, chips, integrated circuits, and directional couplers. Its target market includes telecom equipment manufacturers and system integrators in Asia, Europe, and North America. The company maintains a comprehensive manufacturing and R&D infrastructure in Taiwan, reinforcing its position as a key regional supplier of microwave semiconductor components. As a publicly listed company on the Taiwan Stock Exchange under the ticker 5222.TW, Transcom continues to emphasize product quality, innovation in GaAs semiconductor devices, and expanding its footprint in the global telecommunications supply chain. Recent operational activities focus on sustaining high production outputs and advancing product lines that leverage PHEMT (Pseudomorphic High Electron Mobility Transistor) technology for next-generation communication applications. This description reflects the company's current profile, core products and services, and recent strategic focus based on publicly available information.