uPI Semiconductor Corp.

uPI Semiconductor Corp.

TTWSE:6719
175.00
TWD
-4.50
(-2.51%)
28.49BMarket Cap
Nov 10Next Earn
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
40.37
60.21
84.19
77.97
37.58
38.86
43.49
- -
Basic EPS, GAAP
1.03
6.27
15.75
14.85
0.63
2.42
6.58
- -
Free Cash Flow per Basic Share
-5.26
5.17
12.86
12.5
0.18
12.5
8.48
- -
Dividend per Share
1
- -
1.5
7.52
9.99
2.17
1.7
- -
Book Value per Share
18.59
25
41.05
112
100.35
129.28
133.62
133.7
Tangible Book Value per Share
18.16
24.59
40.58
111.47
99.78
128.89
133.33
133.47
Basic Weighted Avg Shares
70
70
71
78
81
95
105
106
Sales/Revenue/Turnover
2,815
4,199
5,951
6,085
3,037
3,698
4,581
- -
Operating Margin (%)
2.9
12.4
22.91
21.56
-1.01
3.64
14.58
- -
Depreciation Expense
83
90
100
101
109
113
113
- -
Net Income, GAAP
72
438
1,113
1,159
51
230
693
- -
Effective Tax Rate (%)
10.93
14.66
21.06
22.19
29.03
16.93
16.89
- -
Profit Margin (%)
2.55
10.42
18.71
19.05
1.67
6.22
15.12
- -
Working Capital
1,032
1,383
2,116
7,226
6,471
12,662
13,552
13,651
LT Debt
357
352
317
17
8
1,547
1,576
1,585
Total Equity
1,314
1,767
2,902
8,806
8,152
13,535
14,092
14,108
Return on Invested Capital (%)
- -
22.43
37.43
16.35
-0.25
0.96
3.6
- -
Return on Capital (%)
- -
22.76
40.97
19.18
0.6
2.13
4.71
- -
Return on Common Equity (%)
- -
28.4
47.68
19.8
0.6
2.12
5.01
- -

Capital Structure

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
9
11
11
LT Borrowings
1,569
1,575
1,580
LT Finance Leases
7
7
5
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
105
105
106
Market Capitalization
20,566
17,036
28,490

Working Capital

TWD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
14,593
14,909
15,189
Cash, Cash Equivalents & STI
13,185
13,310
13,411
Accounts Receivable, Net
402
389
475
Inventories
807
1,005
1,104
Total Current Liabilities
1,041
1,017
1,538
Payables & Accruals
- -
- -
- -
ST Debt
9
11
11
Deferred Revenue
- -
- -
- -

Growth Rates

TWD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
- -
66.08%
4.12%
Free Cash Flow
- -
1,583.54%
-24.93%
Net Income, GAAP
- -
123.73%
201.18%
Sales/Revenue/Turnover
- -
7.9%
23.89%
Total Cash Common Dividend
- -
- -
-13.53%

Quarterly Revenue

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
846
922
995
935
3,698
2025
979
1,227
- -
1,190
4,581
2026
979
1,122
- -
- -
- -

Quarterly Earnings Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
1.41
1.07
0.2
-0.03
2.42
2025
1.48
0.41
- -
2.32
6.58
2026
2.1
2.1
- -
- -
- -

Quarterly Dividends Per Share

TWD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
2.17
2025
- -
- -
- -
- -
1.7
2026
- -
- -
- -
- -
- -

Company Description

CEO
Hsueh Wei Huang
Full Time Employees
288
Sector
Electronic technology
Industry
Electronic production equipment
Address
No.5, Taiyuan 1st Street Hsinchu HSZ Taiwan 302
IPO Date
Jan 13, 2022
Business
uPI Semiconductor Corp. uPI Semiconductor Corp. (6719.TW) engages in the design, research, development, and sale of power management integrated circuits and power semiconductor components. The company offers power management products including PMICs, DC-DC controllers and converters, power device drivers, low dropout regulators, power switch ICs, power monitoring and protection circuits, charging ICs, and integrated power stages; battery management solutions such as protection ICs and charger ICs; low- and middle-voltage power MOSFETs; analog miscellaneous products including operational amplifiers; and GaN solutions comprising GaN FET drivers and uGANs. Its products serve high-performance computing systems, graphics cards, servers, data centers, base stations, gaming devices, drones, mobile phones, automotive PD charging, battery subsystems, charging stations, and industrial applications. uPI Semiconductor Corp. distributes its products in Taiwan, Asia, America, and other regions. Founded in 2005 and headquartered in Zhubei, Taiwan, the company recently launched the uP1969 and uP1970 MV E-Mode GaN FET dual-channel gate drivers to deliver higher efficiency thermal solutions for high-power, high-density applications in AI servers and data centers.