Walton Advanced Engineering, Inc. (8110.TW) provides semiconductor packaging and testing services primarily for memory products to manufacturers in Taiwan and China. The company offers end-to-end turnkey solutions including wafer probing, IC packaging such as legacy lead frame, wire bond BGA, multichip, system-in-package, thin small-outline package (TSOP), ball grid array (BGA), multi-chip stacking package (MCP), chip scale package (CSP), trench BGA, package on package (POP), and three-dimensional (3D) stack-up products; flash memory products, micro-secure digital (SD) cards, memory modules, and universal serial bus (USB) devices; as well as testing services encompassing chip probing, burn-in, final test, and backend support with drop shipment capabilities. Founded in 1995 and headquartered at No. 18, North First Road, Kaohsiung Export Processing Zone, Kaohsiung City, Taiwan, Walton operates facilities in Taiwan and China, serving global semiconductor clients with approximately 3,100 employees and ranking among the top memory backend providers worldwide. Recent developments include participation in the 2024 Taiwan Continuous Improvement Award (TCIA) with excellent results, passage of the Cleaner Production Assessment System for Green Factory Label in April 2024, and ongoing corporate social responsibility initiatives such as blood donation events and donations of air conditioners to charitable causes in 2025.