ASMPT Limited

ASMPT Limited

123.10
HKD
-11.30
(-8.41%)
100.15BMarket Cap
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
27.16
35.52
32.24
35.15
42.95
48.28
39.07
35.96
53.44
47.04
35.64
30.12
32.99
- -
Basic EPS, GAAP
1.4
3.99
2.38
3.61
6.9
5.47
1.52
3.97
7.72
6.36
1.73
0.83
2.17
- -
Free Cash Flow per Basic Share
1.21
2.79
1.55
3.76
2.48
2.78
4.99
5.46
5.33
5.95
4.59
1.37
-0.6
- -
Dividend per Share
0.65
1.3
2.3
1.2
2.3
2.6
2.7
1.4
3.3
3.91
2.51
1.13
0.58
- -
Book Value per Share
17.68
20.38
19.79
22.1
27.94
29.92
28.44
32.06
37.01
38.15
37.86
36.47
40.76
41.26
Tangible Book Value per Share
17.58
17.75
17.18
19.6
25.32
23.8
22.97
26.46
32.26
33.38
33.04
31.77
37.03
37.72
Basic Weighted Avg Shares
399
401
402
405
408
405
407
409
411
412
412
414
416
416
Sales/Revenue/Turnover
10,841
14,229
12,977
14,249
17,523
19,551
15,883
14,700
21,948
19,363
14,697
12,483
13,736
- -
Operating Margin (%)
7.12
15.08
11.53
14.4
18.15
16.12
7.94
7.44
18.77
16.71
7.51
4.61
4.55
- -
Depreciation Expense
423
415
419
437
474
572
843
861
743
739
713
707
696
- -
Net Income, GAAP
559
1,600
956
1,464
2,815
2,216
619
1,622
3,169
2,620
715
345
902
- -
Effective Tax Rate (%)
17
27.17
30.11
19.78
14.62
25.61
36.21
22.94
22.41
23.29
31.32
36.14
10.8
- -
Profit Margin (%)
5.15
11.24
7.37
10.27
16.07
11.34
3.9
11.03
14.44
13.53
4.87
2.77
6.57
- -
Working Capital
4,716
7,081
6,961
5,681
9,787
7,375
8,949
9,464
11,362
11,269
9,228
11,023
12,620
12,571
LT Debt
145
2,180
2,406
78
2,122
474
4,084
3,853
3,599
3,320
1,842
4,048
3,891
3,640
Total Equity
7,081
8,205
8,036
9,026
11,377
12,161
11,632
13,194
15,412
15,858
15,804
15,292
17,132
17,305
Return on Invested Capital (%)
7.33
17.01
9.89
14.97
20.72
15.33
4.6
4.33
15.75
12.36
3.68
1.49
5.67
- -
Return on Capital (%)
7.53
18.4
10.14
14.95
23.73
16.06
4.73
10.06
17.28
13.79
4.22
2.41
5.06
- -
Return on Common Equity (%)
8.19
20.93
11.8
17.19
27.6
18.82
5.2
13.08
22.28
16.9
4.55
2.24
5.6
- -

Capital Structure

HKD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
- -
- -
316
LT Borrowings
- -
- -
2,125
LT Finance Leases
- -
- -
1,515
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
418
418
419
Market Capitalization
32,357
41,475
100,150

Working Capital

HKD

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
- -
- -
18,642
Cash, Cash Equivalents & STI
- -
- -
5,876
Accounts Receivable, Net
- -
- -
4,562
Inventories
- -
- -
7,250
Total Current Liabilities
- -
- -
6,071
Payables & Accruals
- -
- -
- -
ST Debt
- -
- -
316
Deferred Revenue
- -
- -
- -

Growth Rates

HKD

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
8.25%
5.63%
12.04%
Free Cash Flow
-1.55%
-45.44%
-144.4%
Net Income, GAAP
32.89%
22.99%
161.26%
Sales/Revenue/Turnover
2.65%
1.68%
10.04%
Total Cash Common Dividend
3.07%
3.34%
-48.43%

Quarterly Revenue

HKD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
3,342
- -
- -
12,483
2025
- -
3,402
- -
- -
13,736
2026
- -
- -
- -
- -
- -

Quarterly Earnings Per Share

HKD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
0.33
- -
- -
0.83
2025
- -
0.32
- -
- -
2.17
2026
- -
- -
- -
- -
- -

Quarterly Dividends Per Share

HKD

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
1.13
2025
- -
- -
- -
- -
0.58
2026
- -
- -
- -
- -
- -

Company Description

CEO
Bassel Haddad
Full Time Employees
9,000
Sector
Electronic technology
Industry
Electronic production equipment
Address
2 Yishun Avenue 7 Hong Kong Hong Kong 768924
IPO Date
Jan 3, 1989
Business
ASMPT Limited (0522.HK), headquartered in Singapore and founded in 1975, serves as a leading global supplier of hardware and software solutions for semiconductor assembly and packaging as well as surface mount technology (SMT) industries. The company designs, manufactures and markets advanced equipment including thermo-compression bonders such as FIREBIRD TCB and MEGA for heterogeneous integration and multi-chip packaging; laser dicing systems like ALSI LASER1206; placement platforms including SIPLACE V, SIPLACE CA2 and solutions for large BGAs; LITHOBOLT for die-to-wafer hybrid bonding; AMICRA NANO die bonder for co-packaged optics; wafer deposition tools; inspection, storage and software solutions; plus intelligent intralogistics and IoT data platforms for optimized manufacturing processes. ASMPT operates internationally across electronics, mobile communications, computing, automotive, industrial and LED display markets, with a focus on high-productivity, reliable systems driven by continuous R&D investment. In recent developments, ASMPT secures new orders for nineteen chip-to-substrate thermo-compression bonding (TCB) tools targeting the AI chip market, reflecting strong demand in advanced packaging; announces robust 2025 third quarter results fueled by AI momentum; appoints Gordon Lam as Chief Commercial Officer for SEMI Solutions; launches SIPLACE V placement platform and ALSI LASER1206 for AI and smart mobility; commits to the Science Based Targets initiative (SBTi) for science-based climate action; and discontinues its materials business in 2020 while closing ASMPT Equipment (Shenzhen) in 2025. The company, listed on the Hong Kong Stock Exchange, maintains constituent status in indices including Hang Seng TECH, Composite MidCap and Corporate Sustainability Benchmark.

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