DNF Co., Ltd.

DNF Co., Ltd.

KKRX:092070
12,870.00
KRW
+80.00
(+0.63%)
192.86EPS
95.82P/E
207.52BMarket Cap
Nov 18Next Earn
2013 Y
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
2,202.18
6,293.48
6,691.5
5,461.76
7,060.52
7,168.49
5,799.3
9,085.66
11,461.17
11,681.59
7,277.27
6,446.95
6,959.76
7,314.73
Basic EPS, GAAP
-1,437
1,038
1,617
979
1,256
1,363
220
1,435
1,083
499
807
55
109
192.86
Free Cash Flow per Basic Share
-353.94
1,291.96
669.73
-308.28
1,834.27
-254.29
131.45
749.04
-84.61
-1,591.77
-1,270.73
852.31
968.87
1,065.1
Dividend per Share
- -
- -
- -
- -
- -
- -
- -
- -
194.16
200
199.95
201.77
101.64
99.29
Book Value per Share
1,856.44
4,007.11
5,693.48
6,672.45
7,789.4
8,863.58
8,883.16
10,501.13
12,425.58
13,033.09
13,395.4
13,251.96
13,305.36
13,249.77
Tangible Book Value per Share
1,540.15
3,756.51
5,490.55
6,595.36
7,726.35
8,807.96
8,837.16
9,326.8
11,359.29
12,697
13,321.55
13,160.07
13,172.76
13,108.85
Basic Weighted Avg Shares
9
10
11
11
11
10
10
10
11
12
12
11
11
11
Sales/Revenue/Turnover
20,606
61,630
71,489
58,222
74,381
74,243
58,815
95,098
127,056
135,179
84,233
73,949
79,133
82,732
Operating Margin (%)
-42.91
24.33
27.35
20.76
20.29
19.91
8.92
12.42
8.77
12.06
-3.4
-1.38
-0.85
0.69
Depreciation Expense
3,919
4,272
4,787
5,371
4,148
3,958
4,668
5,424
6,248
6,636
7,581
6,387
7,080
7,282
Net Income, GAAP
-13,446
10,165
17,275
10,436
13,232
14,116
2,231
15,020
12,006
5,774
9,341
631
1,239
2,181
Effective Tax Rate (%)
- -
20.69
21.01
9.87
18.93
6.58
2.21
19.44
6.99
30.92
- -
- -
- -
- -
Profit Margin (%)
-65.25
16.49
24.16
17.92
17.79
19.01
3.79
15.79
9.45
4.27
11.09
0.85
1.57
2.64
Working Capital
-14,335
3,976
11,260
19,179
26,885
22,528
19,760
22,889
39,684
49,646
50,886
48,867
46,179
48,577
LT Debt
11,772
3,360
1,823
10,800
8,333
9,230
6,949
1,212
1,319
1,429
65
176
188
309
Total Equity
17,323
42,683
60,703
71,140
81,491
90,070
90,269
115,007
145,623
157,768
155,010
153,151
149,413
148,788
Return on Invested Capital (%)
- -
20.82
22.95
13.31
13.06
13.35
4.75
7.67
6.74
6.53
- -
- -
- -
- -
Return on Capital (%)
- -
21.78
27.12
13.46
14.64
14.23
2.44
13.31
8.88
3.9
- -
- -
- -
- -
Return on Common Equity (%)
-56.19
33.88
33.42
15.83
17.34
16.46
2.47
14.78
9.35
3.92
6.11
0.41
0.82
1.46

Capital Structure

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
ST Debt
74
81
97
LT Borrowings
- -
- -
- -
LT Finance Leases
176
188
309
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
11
11
11
Market Capitalization
165,748
175,405
207,521

Working Capital

KRW

•

in mil. unless spec.
Sep'25
Dec'25
Mar'26
Total Current Assets
51,465
56,098
59,151
Cash, Cash Equivalents & STI
20,771
23,119
26,191
Accounts Receivable, Net
3,886
4,426
4,525
Inventories
25,098
25,555
25,519
Total Current Liabilities
7,264
9,919
10,574
Payables & Accruals
- -
- -
- -
ST Debt
74
81
97
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
9.95%
5.91%
-2.44%
Free Cash Flow
96.77%
315.56%
12.68%
Net Income, GAAP
47.59%
-1.4%
96.45%
Sales/Revenue/Turnover
4.7%
-0.58%
7.01%
Total Cash Common Dividend
- -
- -
-50.06%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
19,465
20,222
17,680
16,581
73,949
2025
17,280
18,384
21,109
22,360
79,133
2026
20,879
- -
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
165
-22
-88
-0.58
55
2025
-39
-96
-86
334.44
109
2026
44.42
- -
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
- -
- -
201.77
2025
- -
- -
- -
- -
101.64
2026
100
- -
- -
- -
- -

Company Description

CEO
Jae-Ho Shin
Full Time Employees
252
Sector
Producer manufacturing
Industry
Electrical products
Address
Daejeon South Korea
IPO Date
Nov 16, 2007
Business
DNF Co., Ltd. is a South Korea-based specialty chemical and electronic materials manufacturing company engaged in the research, development, synthesis, and commercial production of advanced chemical precursors and functional material solutions for the semiconductor, display, and electronic components industries. Founded in 2001 and headquartered in Daejeon, South Korea, the company operates dedicated research, synthesis, and manufacturing facilities, supplying major integrated device manufacturers, semiconductor foundries, and flat-panel display producers across South Korea, greater East Asia, and global technology markets. The company's primary product offerings comprise Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) precursor materials; Double Patterning Technology (DPT) and Quadruple Patterning Technology (QPT) silicon precursors, including DIPAS and chlorosilane derivatives used for sub-nanometer lithography and fine-pitch patterning; High-k dielectric precursors, including zirconium-based, hafnium-based, and titanium-based precursors engineered for high-density dynamic random-access memory (DRAM) capacitor fabrication and advanced logic gates; Low-k dielectric precursors formulated for interlayer dielectric (ILD) insulating films to minimize parasitic capacitance; Spin-on-Carbon (SOC) hardmask materials for high-aspect-ratio etching; metal and conductive barrier layer precursors; chemical mechanical planarization (CMP) slurries; functional optical coatings and barrier films for organic light-emitting diode (OLED) and liquid crystal display (LCD) panels; and specialty chemical additives and functional materials for secondary battery electrodes. In recent corporate and strategic developments, Solus Advanced Materials acquired a controlling stake in DNF Co., Ltd., making the company a core subsidiary within its electronic materials portfolio to drive supply-chain synergies across semiconductor chemicals and advanced packaging materials. Built upon long-standing technical partnerships and strategic equity investment from Samsung Electronics, DNF Co., Ltd. has expanded its commercialization efforts for next-generation precursor formulations optimized for high-bandwidth memory (HBM), ultra-high-layer 3D NAND flash architectures, and sub-3nm Gate-All-Around (GAA) logic fabrication, while actively advancing operational initiatives in high-purity secondary battery materials and next-generation green chemical technologies.