Park Systems Corp.

Park Systems Corp.

KKRX:140860
238,000.00
KRW
-9,500.00
(-3.84%)
3,321.73EPS
74.48P/E
1.73TMarket Cap
Nov 17Next Earn
2014 Y
2015 Y
2016 Y
2017 Y
2018 Y
2019 Y
2020 Y
2021 Y
2022 Y
2023 Y
2024 Y
2025 Y
TTM
Revenue per Share
3,153.3
4,056.26
3,759.06
5,021.39
6,306.64
7,802.5
10,716.41
12,770.83
18,070.23
20,946.47
25,254.72
29,599.37
28,023.93
Basic EPS, GAAP
-169
732
573
694
844
1,277
1,498
1,361
4,061
3,553
6,175
4,963
3,336.64
Free Cash Flow per Basic Share
-98.13
-7.26
-73.63
305.8
466.42
52.3
-314.9
1,237.71
3,437.33
2,694.42
887.05
-4,294.51
-10,549.28
Dividend per Share
- -
- -
49.17
49.63
79.45
99.62
120.37
178.92
249.11
399.37
399.34
499.44
- -
Book Value per Share
952.5
3,514.55
4,048.82
4,636.5
5,433.96
6,656.1
7,995.71
13,124.51
17,307.79
20,733.66
27,068.58
32,371.65
48,950.3
Tangible Book Value per Share
952.5
3,514.55
4,048.82
4,636.5
5,429.67
6,652.28
7,992.33
13,121.68
15,884.3
19,205.64
25,456.57
28,308.81
44,447.93
Basic Weighted Avg Shares
5
5
7
7
7
7
7
7
7
7
7
7
7
Sales/Revenue/Turnover
15,293
19,992
24,452
32,882
41,810
51,974
71,223
85,250
124,522
144,806
175,060
205,613
194,795
Operating Margin (%)
-1.2
11.83
14.16
18.34
13.6
15.46
21.09
20.65
26.26
19.08
22.02
20.53
12.02
Depreciation Expense
331
180
272
419
582
2,233
2,982
3,267
3,714
4,675
6,408
7,845
9,722
Net Income, GAAP
-820
3,608
3,727
4,545
5,595
8,506
9,956
9,085
27,984
24,562
42,804
34,476
23,193
Effective Tax Rate (%)
- -
- -
5.03
8.62
9.66
- -
7.1
- -
12.22
9.51
9.37
16.37
20.79
Profit Margin (%)
-5.36
18.05
15.24
13.82
13.38
16.37
13.98
10.66
22.47
16.96
24.45
16.77
11.91
Working Capital
9,805
20,530
24,067
27,924
32,975
39,206
53,462
80,011
86,619
98,442
128,213
123,300
191,698
LT Debt
- -
- -
- -
- -
- -
1,042
23,971
16,937
3,605
4,429
19,155
46,534
55,689
Total Equity
5,621
22,603
26,426
30,559
36,114
44,363
53,082
90,142
119,463
143,485
187,910
225,120
340,305
Return on Invested Capital (%)
- -
- -
13.29
19.09
15.21
- -
21.9
- -
23.09
16.01
17.19
12.89
5.29
Return on Capital (%)
- -
- -
15.21
15.95
16.79
- -
16.36
- -
23.17
16.22
21.72
13.02
6.97
Return on Common Equity (%)
- -
25.57
15.2
15.95
16.78
21.14
20.43
12.69
26.7
18.68
25.83
16.69
8.47

Capital Structure

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
ST Debt
36,029
36,548
35,295
LT Borrowings
42,275
50,776
50,890
LT Finance Leases
4,259
4,860
4,800
Preferred Equity and Hybrid Capital
- -
- -
- -
Shares Outstanding
7
7
7
Market Capitalization
1,453,434
1,630,767
1,727,584

Working Capital

KRW

•

in mil. unless spec.
Dec'25
Mar'26
Jun'26
Total Current Assets
196,653
178,499
264,878
Cash, Cash Equivalents & STI
76,560
66,044
126,550
Accounts Receivable, Net
- -
- -
- -
Inventories
54,835
60,790
61,188
Total Current Liabilities
73,354
79,262
73,180
Payables & Accruals
- -
- -
- -
ST Debt
36,029
36,548
35,295
Deferred Revenue
- -
- -
- -

Growth Rates

KRW

•

in mil. unless spec.

(avg. rate of change)

10 years
5 years
1 year
Total Equity
26.64%
34.64%
19.8%
Free Cash Flow
-99.69%
-196.32%
-585.17%
Net Income, GAAP
35.93%
48.37%
-19.46%
Sales/Revenue/Turnover
26.57%
24.08%
17.45%
Total Cash Common Dividend
- -
35.89%
25.33%

Quarterly Revenue

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
25,664
44,697
41,374
63,324
175,060
2025
50,910
52,309
45,621
56,774
205,613
2026
39,361
53,039
- -
- -
- -

Quarterly Earnings Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
394
1,931
914
2,931.23
6,175
2025
2,154
583
1,392.2
834.01
4,963
2026
737.49
373
- -
- -
- -

Quarterly Dividends Per Share

KRW

•

in mil. unless spec.

Year

Q1
Q2
Q3
Q4
FY
2024
- -
- -
-0.18
0.18
399.34
2025
- -
- -
- -
- -
499.44
2026
- -
- -
- -
- -
- -

Company Description

CEO
Sang-il Park
Full Time Employees
392
Sector
Electronic technology
Industry
Electronic equipment/Instruments
Address
150 Gwacheon-daero 12-gil Gwacheon-si GY South Korea 13824
IPO Date
Dec 17, 2015
Business
Park Systems Corp. (KOSDAQ: 140860) develops, manufactures and sells atomic force microscopy (AFM) systems and complementary nanometrology solutions worldwide; core products include research-grade AFMs such as Park NX7, NX10, NX20, NX12 and NX-Hivac for nanoscale imaging, surface analysis and True Non-Contact AFM in materials science, life sciences and physics; industrial AFMs like Park NX-Wafer, FX40, NX-HDM, NX-3DM, NX-TSH and NX-Hybrid WLI for semiconductor fabrication, photomask repair, 3D metrology, nano-infrared spectroscopy, optical profilometry and in-line process control; ellipsometry systems for thin-film characterization; active vibration isolation platforms; and software solutions including Park SmartAnalysis, SmartScan and SmartLitho. The company serves semiconductor, display, data storage, polymer, thin-film, photonics, 2D-materials and anisotropic films sectors, with target customers encompassing leading semiconductor manufacturers, national research universities and over 1,000 institutions globally. Founded in 1997 and headquartered in Suwon-si, South Korea, Park Systems operates through regional headquarters in the United States, Japan, Germany, France, China, Taiwan, Singapore, India and Mexico, supported by distribution partners across Europe, Asia and the Americas. In January 2025, Park Systems acquired Lyncée Tec SA, a Swiss pioneer in Digital Holographic Microscopy (DHM), to expand its optical metrology portfolio following the 2022 acquisition of Accurion GmbH for imaging spectroscopic ellipsometry; integration efforts focus on developing fully automated DHM-AFM hybrids for advanced semiconductor packaging. At SEMICON Korea 2025, the company launched the FX Large Sample AFM series, including FX300, FX200 IR and FX300 IR models with Photo-induced Force Microscopy (PiFM) for nanoscale infrared spectroscopy on 300 mm wafers, alongside cleanroom-compatible automation features like AI-based laser alignment and StepScan; Park Systems also introduced SmartSimulator, a browser-based virtual AFM platform for remote workflow simulation and training. From 2019-2023, the company achieved a 30% CAGR, surpassing competitors, through joint development projects with imec for in-line wafer metrology and penetration into global semiconductor fabs.